公开(公告)号：US5021269A

公开(公告)日：1991-06-04

申请号：US323094

申请日：1989-03-13

申请人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Hisao Irie ,  Tatsuji Mizuta ,  Shinsuke Ohara

发明人： Masanao Kono ,  Yoshihiro Hasegawa ,  Yasutaka Nishi ,  Hisao Irie ,  Tatsuji Mizuta ,  Shinsuke Ohara

IPC分类号： C23C18/08 ,  H05K3/10 ,  H05K3/24 ,  H05K3/34

CPC分类号： C23C18/08 ,  H05K3/3473 ,  H05K2203/0776 ,  H05K2203/0783 ,  H05K2203/1105 ,  H05K2203/125 ,  H05K3/105 ,  H05K3/244 ,  H05K3/3494

摘要： A method for forming a metal film on the surface of a substrate metal, which comprises soaking a substrate metal or a non-metal support carrying the substrate metal thereon in a solution of a metal salt in a high boiling point solvent under heating conditions, characterized in that the metal salt is a salt of the metal to be formed on the surface of the substrate metal with an acidic substance selected from an organic carboxylic acid, a rosin and a rosin derivative. The metal is precipitated from the solution exclusively on the surface of the substrate metal without forming any solid metal particle in the solution or on the substrate metal. Thus, the method is applicable to the formation of a soldering alloy as a film on the surface of a substrate metal without leaving thereon any free metal particle which may cause short circuits in electronic circuits. The method can thus be applied advantageously to the manufacture of electronic elements having a metal film thereon and high density printed circuits, and thus is also useful in the field of electronic industry.

摘要翻译： 一种在基板金属表面上形成金属膜的方法，其特征在于，在加热条件下，将金属盐在金属盐溶解在高沸点溶剂中的步骤中浸渍载有其上的基板金属的基板金属或非金属载体， 其特征在于，所述金属盐是在所述基材金属的表面上形成的金属与选自有机羧酸，松香和松香衍生物的酸性物质的盐。 金属从溶液中仅沉积在基底金属的表面上，而不在溶液中或在基底金属上形成任何固体金属颗粒。 因此，该方法适用于在基板金属的表面上形成作为膜的焊接合金，而不会留下可能导致电子电路短路的任何自由金属颗粒。 因此，该方法可有利地应用于其上具有金属膜的电子元件的制造和高密度印刷电路，因此也可用于电子工业领域。

公开(公告)号：US5145532A

公开(公告)日：1992-09-08

申请号：US244791

申请日：1988-09-14

申请人： Takao Fukunaga ,  Hisao Nakajima ,  Kenzo Kobayashi ,  Masanao Kono ,  Hisao Irie ,  Ryo Inoue

发明人： Takao Fukunaga ,  Hisao Nakajima ,  Kenzo Kobayashi ,  Masanao Kono ,  Hisao Irie ,  Ryo Inoue

IPC分类号： B23K35/22 ,  B23K35/26 ,  B23K35/34 ,  H05K3/34

CPC分类号： B23K35/34 ,  B23K35/262 ,  H05K3/3484 ,  H05K2203/125

摘要： A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.

公开(公告)号：US07503958B2

公开(公告)日：2009-03-17

申请号：US11509567

申请日：2006-08-25

申请人： Eiichiro Matsubara ,  Tetsu Ichitsubo ,  Takaaki Anada ,  Seishi Kumamoto ,  Hisao Irie

发明人： Eiichiro Matsubara ,  Tetsu Ichitsubo ,  Takaaki Anada ,  Seishi Kumamoto ,  Hisao Irie

IPC分类号： B22F9/08

CPC分类号： B22F9/082 ,  B22F1/0003

摘要： The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the solder powder comprises 3 to 12% by weight of Zn, 1.0 to 15% by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.

摘要翻译： 本发明是通过液体淬火雾化法制造SnZnNiCu焊料粉末的方法，雾化温度不低于500℃，特别是不低于900℃。用作原料的原料金属 焊料粉末含有3〜12重量％的Zn，1.0〜15重量％的Cu和Ni之和，Sn和余量的不可避免的杂质占原料总量的比例。 由此，能够实现高接合强度，提供可以提高焊点部的接合可靠性的SnZnNiCu焊料粉末。

公开(公告)号：US20070186997A1

公开(公告)日：2007-08-16

申请号：US11727014

申请日：2007-03-23

申请人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

发明人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

IPC分类号： B23K35/34

CPC分类号： B23K35/0244 ,  B23K1/203 ,  B23K35/007 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/34 ,  B23K35/36 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/041

摘要： A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

摘要翻译： 在进行无电解镀镍的板进行焊接时使用的焊剂用焊剂，具有成膜能力的助熔剂树脂，活化剂和溶剂，还含有金属盐的总量的0.1〜20重量％ 助焊剂量。 使用这种助焊剂抑制镍焊料在焊接部分的扩散，并防止磷的浓度，从而提高焊接的接合强度。

公开(公告)号：US06923875B2

公开(公告)日：2005-08-02

申请号：US10342210

申请日：2003-01-15

申请人： Kazuki Ikeda ,  Hiroshi Tanaka ,  Hisao Irie ,  Keigo Obata ,  Takao Takeuchi ,  Naoya Inoue

发明人： Kazuki Ikeda ,  Hiroshi Tanaka ,  Hisao Irie ,  Keigo Obata ,  Takao Takeuchi ,  Naoya Inoue

IPC分类号： B23K35/34 ,  B23K35/26 ,  B23K35/363 ,  C22C13/00 ,  H05K3/34 ,  C23C18/00

CPC分类号： H05K3/3484 ,  B23K35/262 ,  B23K35/34 ,  H05K2203/121

摘要： According to present invention, there is provided a lead-free solder precipitating composition comprising a tin powder, and a complex of silver ions and/or copper ions and aryl phosphines, alkyl phosphine, phosphines or azoles. The solder precipitating composition can form proper lead-free solder on lands of a circuit board, without forming silver and/or copper film on the circuit board.

摘要翻译： 根据本发明，提供了一种无铅焊料沉淀组合物，其包含锡粉末，以及银离子和/或铜离子与芳基膦，烷基膦，膦或唑类的络合物。 焊料沉淀组合物可以在电路板的焊盘上形成适当的无铅焊料，而不在电路板上形成银和/或铜膜。

公开(公告)号：US5118029A

公开(公告)日：1992-06-02

申请号：US618031

申请日：1990-11-26

申请人： Kenichi Fuse ,  Takao Fukunaga ,  Masanao Kohno ,  Hisao Irie

发明人： Kenichi Fuse ,  Takao Fukunaga ,  Masanao Kohno ,  Hisao Irie

IPC分类号： B23K35/34 ,  H05K3/34

CPC分类号： H05K3/3484 ,  B23K35/34 ,  H05K2201/10992 ,  H05K2203/043 ,  H05K2203/125 ,  H05K3/3473

摘要： A paste-like composition containing a lead salt of an organic acid and tin powder is applied on a pad array portion of a circuit board. Then, the paste-like compsition is heated so as to cause precipitation, thereby forming a solder layer formed of a Sn-Pb alloy substantially only on the pads. This precipitation is performed in a state that a liquid pool is formed on the pad array portion when the paste-like composition is liquefied by heating, and the tin powder is settled in the liquid pool. When an electronic part is mounted on the pads, first, preparatory solder layers are formed on the pads by the above-mentioned precipitation process. After a paste-like composition is applied on the preparatory solder layers, the electronic part is put on the paste-like composition. Then, the paste-like composition is heated, thereby soldering leads of the electronic part to the pads.

公开(公告)号：US07798389B2

公开(公告)日：2010-09-21

申请号：US11727014

申请日：2007-03-23

申请人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

发明人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

IPC分类号： B23K31/02 ,  B23K35/36

CPC分类号： B23K35/0244 ,  B23K1/203 ,  B23K35/007 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/34 ,  B23K35/36 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/041

摘要： A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

摘要翻译： 在进行无电解镀镍的板进行焊接时使用的焊剂用焊剂，具有成膜能力的助熔剂树脂，活化剂和溶剂，还含有金属盐的总量的0.1〜20重量％ 助焊剂量。 使用这种助焊剂抑制镍焊料在焊接部分的扩散，并防止磷的浓度，从而提高焊接的接合强度。

公开(公告)号：US20070051201A1

公开(公告)日：2007-03-08

申请号：US11509567

申请日：2006-08-25

申请人： Eiichiro Matsubara ,  Tetsu Ichitsubo ,  Takaaki Anada ,  Seishi Kumamoto ,  Hisao Irie

发明人： Eiichiro Matsubara ,  Tetsu Ichitsubo ,  Takaaki Anada ,  Seishi Kumamoto ,  Hisao Irie

IPC分类号： C22C13/00 ,  B22F9/08

CPC分类号： B22F9/082 ,  B22F1/0003

摘要： The present invention is a method to manufacture the SnZnNiCu solder powder through liquid quenching atomizing method, and an atomizing temperature is not less than 500° C., in particular, not less than 900° C. The raw material metal used as raw material of the solder powder comprises 3 to 12% by weight of Zn, 1.0 to 15% by weight of the sum of Cu and Ni, and Sn and inevitable impurities for the rest, to the total amount of raw material. Thereby, high joint strength is achieved and the SnZnNiCu solder powder which can improve joint reliability of solder joint part is provided.

摘要翻译： 本发明是通过液体淬火雾化法制造SnZnNiCu焊料粉末的方法，雾化温度不低于500℃，特别是不低于900℃。用作原料的原料金属 焊料粉末含有3〜12重量％的Zn，1.0〜15重量％的Cu和Ni之和，Sn和余量的不可避免的杂质占原料总量的比例。 由此，能够实现高接合强度，提供可以提高焊点部的接合可靠性的SnZnNiCu焊料粉末。

公开(公告)号：US20060043157A1

公开(公告)日：2006-03-02

申请号：US10924867

申请日：2004-08-25

申请人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

发明人： Kazuki Ikeda ,  Hisao Irie ,  Toshinori Shima ,  Takaaki Anada ,  Syunsuke Ishikawa

IPC分类号： B23K31/02

CPC分类号： B23K35/0244 ,  B23K1/203 ,  B23K35/007 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/34 ,  B23K35/36 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K2101/42 ,  H05K3/244 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2203/041

摘要： A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.

摘要翻译： 在进行无电解镀镍的板进行焊接时使用的焊剂用焊剂，具有成膜能力的助熔剂树脂，活化剂和溶剂，还含有金属盐的总量的0.1〜20重量％ 助焊剂量。 使用这种助焊剂抑制镍焊料在焊接部分的扩散，并防止磷的浓度，从而提高焊接的接合强度。

公开(公告)号：US5296649A

公开(公告)日：1994-03-22

申请号：US852526

申请日：1992-03-17

申请人： Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

发明人： Izumi Kosuga ,  Kenichi Fuse ,  Takao Fukunaga ,  Hirokazu Shiroishi ,  Masanao Kohno ,  Hisao Irie

IPC分类号： B23K35/02 ,  B23K35/34 ,  H05K1/11 ,  H05K3/34 ,  H05K01/00

CPC分类号： H05K3/3484 ,  B23K35/0222 ,  B23K35/34 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09918 ,  H05K2201/10689 ,  H05K2203/0435 ,  H05K3/3421 ,  H05K3/3452 ,  Y02P70/611

摘要： A plurality of pads are formed on a circuit board body at a pitch of 0.5 mm or less. The pads are formed such that a projecting height H of a pad from the board body surface and a width W of the pad satisfy a relation 2H D. A solder layer, obtained by a substitution reaction between a powder of a metal having the highest ionization tendency among metals constituting the solder layer or a powder of an alloy thereof and a salt formed by bonding the other metal or metals in the solder layer to an organic acid, is formed on each pad.

摘要翻译： 在电路板主体上以0.5mm以下的间距形成多个焊盘。 焊盘形成为使得来自板体表面的焊盘的突出高度H和焊盘的宽度W满足关系2H D。 通过在构成焊料层的金属中的离子化倾向最高的金属粉末或其合金粉末之间的取代反应和通过将焊料层中的其它金属或金属接合而形成的盐而获得的焊料层为 有机酸形成在每个垫上。