Polishing method and polishing apparatus using the same
    1.
    发明授权
    Polishing method and polishing apparatus using the same 失效
    抛光方法和使用其的抛光装置

    公开(公告)号:US06503361B1

    公开(公告)日:2003-01-07

    申请号:US09090803

    申请日:1998-06-04

    IPC分类号: C23F104

    摘要: This specification discloses a polishing method of polishing the surface of a film layer provided on the surface of a substrate by polishing means with both of them driven relative to each other, having a position detecting step of detecting a predetermined position on the surface of the film layer, a first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and a controlling step of controlling the polishing state by using data obtained in the first measuring step. The specification also discloses a polishing apparatus using such polishing method.

    摘要翻译: 该说明书公开了一种抛光方法,其通过抛光装置抛光设置在基板的表面上的膜层的表面,两者都被相对于彼此驱动,具有位置检测步骤,该位置检测步骤检测膜的表面上的预定位置 第一测量步骤,将来自光源的瞬时光施加到预定位置,并且由光接收元件检测来自预定位置的光束,从而测量预定位置处的膜厚度;以及控制步骤, 通过使用在第一测量步骤中获得的数据的抛光状态。 本说明书还公开了使用这种抛光方法的抛光装置。

    Method and apparatus for measuring film thickness and film thickness
distribution during polishing
    2.
    发明授权
    Method and apparatus for measuring film thickness and film thickness distribution during polishing 失效
    研磨过程中测量薄膜厚度和薄膜厚度分布的方法和装置

    公开(公告)号:US6004187A

    公开(公告)日:1999-12-21

    申请号:US917853

    申请日:1997-08-27

    CPC分类号: B24B37/013 H01L22/26

    摘要: Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, and a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step. The method also includes a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.

    摘要翻译: 公开了通过使用研磨装置,在使膜面和研磨装置相对移动的同时研磨设置在基板上的膜的表面的方法。 该方法包括用于检测胶片表面上的预定位置的位置检测步骤,用于测量预定位置处的膜厚绝对值的第一测量步骤,以及用于测量胶片厚度信息的第二测量步骤 基于通过第一测量步骤获得的测量值来关于预定位置。 该方法还包括基于通过第一和第二测量步骤获得的数据以及用于控制抛光的持续/停止的控制步骤,用于检测膜的膜厚度分布的膜厚度分布测量步骤 通过膜厚分布测量步骤获得的数据。

    Polishing apparatus and polishing method
    4.
    发明授权
    Polishing apparatus and polishing method 失效
    抛光设备和抛光方法

    公开(公告)号:US06551172B1

    公开(公告)日:2003-04-22

    申请号:US09654036

    申请日:2000-09-01

    IPC分类号: B24B4900

    CPC分类号: B24B37/013 B24B49/12

    摘要: In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.

    摘要翻译: 为了在短时间内测量待抛光材料的被研磨表面的厚度,从被抛光材料的待抛光表面反射的光获得二维图像,在该位置处 通过所获得的二维图像指定要观察的厚度,并且进行厚度测量。

    Film thickness measuring method and apparatus
    5.
    发明授权
    Film thickness measuring method and apparatus 失效
    薄膜厚度测量方法和装置

    公开(公告)号:US6137575A

    公开(公告)日:2000-10-24

    申请号:US177486

    申请日:1998-10-23

    IPC分类号: G01B11/06 G01B9/02

    CPC分类号: G01B11/0625

    摘要: A method and apparatus for measuring the thickness of a film layer provided on a predetermined surface includes a step and device for detecting light reception signals of interference light of different wavelengths generated when light illuminates the film layer on the predetermined surface, a step or device for performing a first process for obtaining an approximate value for the film thickness by selecting a combination of solutions with the closest values from among solutions for the film thickness obtainable from at least three of the light reception signals corresponding to the respective wavelengths, and a step or device for performing a second process for obtaining an exact value for the film thickness by selecting a combination of solutions with the closest values from among solutions for the film thickness obtainable from all the light reception signals corresponding to the respective wavelengths. The second process is performed on the basis of the approximate value and with a restricted range for selection of the combination.

    摘要翻译: 用于测量设置在预定表面上的膜层的厚度的方法和装置包括用于检测当光照射预定表面上的膜层时产生的不同波长的干涉光的光接收信号的步骤和装置,用于 通过从对应于各个波长的光接收信号中的至少三个获得的薄膜厚度的解决方案中选择具有最接近值的解的组合来获得膜厚的近似值的第一处理,以及步骤或 用于通过从对应于各个波长的所有光接收信号可获得的膜厚度的解决方案中选择具有最接近的值的解的组合来执行用于获得膜厚度的精确值的第二处理的装置。 基于近似值进行第二处理,并且具有用于选择组合的限制范围。

    Polishing method and polishing apparatus using the same
    6.
    发明授权
    Polishing method and polishing apparatus using the same 失效
    抛光方法和使用其的抛光装置

    公开(公告)号:US6093081A

    公开(公告)日:2000-07-25

    申请号:US848159

    申请日:1997-04-29

    摘要: A polishing method of polishing the surface of a layer provided on the surface of a substrate includes a surface configuration measuring step of detecting surface information at a plurality of locations on the layer and obtaining the surface configuration of the layer, the surface configuration of the layer being obtained by measuring a distance from a reference surface set relative to the surface of the layer, a film thickness distribution measuring step of detecting the film thicknesses at a plurality of locations on the layer and obtaining the film thickness distribution of the layer, a determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range and a polishing controlling step of continuing or stopping the polishing on the basis of a result of the determination in the determining step.

    摘要翻译: 抛光设置在基板表面上的层的表面的抛光方法包括:表面构造测量步骤,用于检测该层上多个位置处的表面信息,并获得该层的表面形状,该层的表面形状 通过测量相对于所述层的表面设置的参考表面的距离获得的膜厚度分布测量步骤,用于检测所述层上的多个位置处的膜厚度并获得所述层的膜厚度分布,确定 确定层的表面形状和膜厚分布是否处于预设允许范围内的步骤;以及基于确定步骤中的确定结果继续或停止抛光的抛光控制步骤。

    EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD
    7.
    发明申请
    EXPOSURE APPARATUS AND DEVICE MANUFACTURING METHOD 有权
    曝光装置和装置制造方法

    公开(公告)号:US20070109514A1

    公开(公告)日:2007-05-17

    申请号:US11559084

    申请日:2006-11-13

    IPC分类号: G03B27/42

    CPC分类号: G03F7/70916 G03F7/70341

    摘要: An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.

    摘要翻译: 曝光装置包括:照明光学系统,用于使用来自光源的光照射光罩;以及投影光学系统,用于将掩模版的图案投射到基板上,所述曝光装置通过供给到 基板和最靠近基板的投影光学系统的透镜之间的空间,光线不通过的透镜的表面具有抛光表面。

    Rotation information detecting apparatus and method
    8.
    发明授权
    Rotation information detecting apparatus and method 失效
    旋转信息检测装置及方法

    公开(公告)号:US5640377A

    公开(公告)日:1997-06-17

    申请号:US508901

    申请日:1995-07-28

    摘要: The present invention relates to a rotation information detecting method of detecting rotation information of a rotating object, comprising the step of mounting a rotating scale on a rotating shaft of the rotating object, said rotating scale having a first pattern for detecting rotation information formed thereon in advance, the detection step of detecting the rotation information of the rotating object by detecting the first pattern and the formation step of forming a second pattern for detecting rotation information on the rotating scale on the basis of the detected rotation information.

    摘要翻译: 旋转信息检测方法技术领域本发明涉及一种检测旋转物体的旋转信息的旋转信息检测方法,包括将旋转刻度安装在旋转物体的旋转轴上的步骤,所述旋转刻度具有用于检测形成在其上的旋转信息的第一图案 通过检测第一图案来检测旋转物体的旋转信息的检测步骤,以及基于检测到的旋转信息形成用于检测旋转刻度的旋转信息的第二图案的形成步骤。

    Encoder with an optical scale and interference of zero and first order
diffraction beams
    9.
    发明授权
    Encoder with an optical scale and interference of zero and first order diffraction beams 失效
    具有光刻度和零级和一级衍射光束干扰的编码器

    公开(公告)号:US5481106A

    公开(公告)日:1996-01-02

    申请号:US70996

    申请日:1993-06-04

    CPC分类号: G01D5/38

    摘要: An encoder capable of detecting movement information on a moving body with high accuracy without being affected by environmental changes, wherein movement information on a moving body is detected by causing a luminous flux to impinge upon a first scale section of an optical scale which is provided on the moving body and which consists of gratings of a fixed pitch, causing the luminous flux to impinge upon a second scale section of the optical scale, and receiving the luminous flux which has undergone light modulation at the second scale section, and wherein a light adjustment device for intercepting or attenuating a +1st order or -1st order diffracted ray of diffracted rays of light from the first scale section is provided in the optical path extending from the first scale section, an optical image having an intensity distribution of the same grating pitch as the first scale section being formed on the second scale section mainly by the zero order and the -1st order diffracted rays or by the zero order and the +1st order diffracted rays.

    摘要翻译: 一种编码器,其能够高精度地检测移动体上的移动信息而不受环境变化的影响,其中通过使光束照射到设置在 所述移动体由固定间距的光栅构成,使得光束撞击到光刻尺的第二刻度部分,并且接收在第二刻度部分处经过光调制的光束,并且其中光调节 在从第一刻度部分延伸的光路中设置用于截取或衰减来自第一标尺部分的衍射光线的+ 1级或-1级衍射光线的装置,具有相同光栅间距的强度分布的光学图像 因为第一刻度部分主要以零级和-1级衍射光线形成在第二刻度部分上 通过零级和+ 1级衍射光线。

    Exposure apparatus and device manufacturing method
    10.
    发明授权
    Exposure apparatus and device manufacturing method 有权
    曝光装置和装置制造方法

    公开(公告)号:US07916273B2

    公开(公告)日:2011-03-29

    申请号:US11559084

    申请日:2006-11-13

    IPC分类号: G03B27/42 G03B27/52

    CPC分类号: G03F7/70916 G03F7/70341

    摘要: An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.

    摘要翻译: 曝光装置包括:照明光学系统,用于使用来自光源的光照射光罩;以及投影光学系统,用于将掩模版的图案投射到基板上,所述曝光装置通过供给到 基板和最靠近基板的投影光学系统的透镜之间的空间,光线不通过的透镜的表面具有抛光表面。