摘要:
This specification discloses a polishing method of polishing the surface of a film layer provided on the surface of a substrate by polishing means with both of them driven relative to each other, having a position detecting step of detecting a predetermined position on the surface of the film layer, a first measuring step of applying momentary light from a light source to the predetermined position, and detecting the light beam from the predetermined position by a light receiving element to thereby measure the film thickness at the predetermined position, and a controlling step of controlling the polishing state by using data obtained in the first measuring step. The specification also discloses a polishing apparatus using such polishing method.
摘要:
Disclosed is a method of polishing the surface of a film provided on a substrate, by use of a polishing device, while relatively moving the film surface and the polishing device. The method includes a position detecting step for detecting a predetermined position on the surface of the film, a first measurement step for measuring an absolute value of the film thickness at the predetermined position, and a second measurement step for measuring film thickness information of the film about the predetermined position, on the basis of a measured value obtained through the first measurement step. The method also includes a film thickness distribution measurement step for detecting a film thickness distribution of the film, on the basis of a data obtained through the first and second measurement steps, and a control step for controlling continuation/discontinuation of polishing, on the basis of a data obtained through the film thickness distribution measurement step.
摘要:
In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.
摘要:
In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.
摘要:
A method and apparatus for measuring the thickness of a film layer provided on a predetermined surface includes a step and device for detecting light reception signals of interference light of different wavelengths generated when light illuminates the film layer on the predetermined surface, a step or device for performing a first process for obtaining an approximate value for the film thickness by selecting a combination of solutions with the closest values from among solutions for the film thickness obtainable from at least three of the light reception signals corresponding to the respective wavelengths, and a step or device for performing a second process for obtaining an exact value for the film thickness by selecting a combination of solutions with the closest values from among solutions for the film thickness obtainable from all the light reception signals corresponding to the respective wavelengths. The second process is performed on the basis of the approximate value and with a restricted range for selection of the combination.
摘要:
A polishing method of polishing the surface of a layer provided on the surface of a substrate includes a surface configuration measuring step of detecting surface information at a plurality of locations on the layer and obtaining the surface configuration of the layer, the surface configuration of the layer being obtained by measuring a distance from a reference surface set relative to the surface of the layer, a film thickness distribution measuring step of detecting the film thicknesses at a plurality of locations on the layer and obtaining the film thickness distribution of the layer, a determining step of determining whether the surface configuration and film thickness distribution of the layer are within a preset allowable range and a polishing controlling step of continuing or stopping the polishing on the basis of a result of the determination in the determining step.
摘要:
An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.
摘要:
The present invention relates to a rotation information detecting method of detecting rotation information of a rotating object, comprising the step of mounting a rotating scale on a rotating shaft of the rotating object, said rotating scale having a first pattern for detecting rotation information formed thereon in advance, the detection step of detecting the rotation information of the rotating object by detecting the first pattern and the formation step of forming a second pattern for detecting rotation information on the rotating scale on the basis of the detected rotation information.
摘要:
An encoder capable of detecting movement information on a moving body with high accuracy without being affected by environmental changes, wherein movement information on a moving body is detected by causing a luminous flux to impinge upon a first scale section of an optical scale which is provided on the moving body and which consists of gratings of a fixed pitch, causing the luminous flux to impinge upon a second scale section of the optical scale, and receiving the luminous flux which has undergone light modulation at the second scale section, and wherein a light adjustment device for intercepting or attenuating a +1st order or -1st order diffracted ray of diffracted rays of light from the first scale section is provided in the optical path extending from the first scale section, an optical image having an intensity distribution of the same grating pitch as the first scale section being formed on the second scale section mainly by the zero order and the -1st order diffracted rays or by the zero order and the +1st order diffracted rays.
摘要:
An exposure apparatus includes an illumination optical system for illuminating a reticle using a light from a light source, and a projection optical system for projecting a pattern of the reticle onto a substrate, the exposure apparatus exposing the substrate through a liquid that is supplied to a space between the substrate and a lens of the projection optical system closest to the substrate, a surface of the lens on which the light does not pass having a polished surface.