公开(公告)号：US5362984A

公开(公告)日：1994-11-08

申请号：US839558

申请日：1992-02-24

申请人： Masashi Konda ,  Toshio Yamamoto ,  Yoshiaki Emoto

发明人： Masashi Konda ,  Toshio Yamamoto ,  Yoshiaki Emoto

IPC分类号： H01L21/60 ,  H01L23/49 ,  H01L23/495 ,  H01L23/52 ,  H01L23/02

CPC分类号： H01L24/49 ,  H01L23/49572 ,  H01L23/52 ,  H01L2224/05554 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/4813 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107

摘要： A semiconductor device is disclosed in which connection between electrodes of a semiconductor element and/or between a plurality of semiconductor elements can be made in one package to the utmost. More particularly, electrodes of two IC chips 12a and 12b are bonded to leader leads 16a and interconnection leads 16b.sub.5 patterned on a film. Connections of the interconnection leads 16b.sub.1 and 16b.sub.2 to 16b.sub.4 and 16b.sub.3 which are impossible by the leads, are made in such a manner that pads 24b.sub.1, 24b.sub.4 and 24b.sub.2, 24b.sub.3 formed on the interconnection leads are connected correspondingly by using bonding wires as jumping wires. After the connection, the IC chips, the leads and the bonding wires are resin-sealed over an overall region encompassed by a region 27.

摘要翻译： 公开了一种半导体器件，其中半导体元件的电极和/或多个半导体元件之间的连接可以最大程度地制成一个封装。 更具体地，两个IC芯片12a和12b的电极被接合到引线领导者16a和互连引线16b5图案上形成膜。 互连的连接引线16B1和16B2至16B4和16B3，其由引线是不可能的，在该焊盘上形成的互连引线部24b1，24b4和24B2，24B3，通过使用接合线作为跳跃导线相应地连接的方式制造。 连接后，将IC芯片，引线和接合线都被树脂密封在由一个区域27包围的区域的整体。

公开(公告)号：US5150198A

公开(公告)日：1992-09-22

申请号：US669520

申请日：1991-03-14

申请人： Naoharu Ohikata ,  Toshio Yamamoto ,  Masashi Konda

发明人： Naoharu Ohikata ,  Toshio Yamamoto ,  Masashi Konda

IPC分类号： H01L23/36 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L23/49568 ,  H01L23/4334 ,  H01L24/50 ,  H01L2924/09701

摘要： A radiator for a semiconductor chip is provided which is made from a material having good heat conductivity. The radiator is plate shaped and is attached to the semiconductor chip. The radiator has at least one projection on the outer peripheral edge thereof so as to extend outwardly, laterally beyond the outer periphery of the semiconductor chip. The semiconductor chip and the radiator are sealed within plastic so that the projection of the radiator extend outwardly from the plastic encapsulation. Heat from the semiconductor chip is released from the plastic encapsulation via the projection(s) of the radiator. The radiator can be formed from a material which also has good electrical conductivity to electrically protect the semiconductor chip.

摘要翻译： 提供了由具有良好导热性的材料制成的用于半导体芯片的散热器。 散热器是板形的并且附接到半导体芯片。 散热器在其外周边缘上具有至少一个突起，以便向外延伸超过半导体芯片的外周。 半导体芯片和散热器被密封在塑料内，使得散热器的突起从塑料封装向外延伸。 来自半导体芯片的热量通过散热器的投影从塑料封装中释放出来。 散热器可以由具有良好导电性的材料形成以电保护半导体芯片。

公开(公告)号：US5137479A

公开(公告)日：1992-08-11

申请号：US669519

申请日：1991-03-14

申请人： Naoharu Ohikata ,  Toshio Yamamoto ,  Tadashi Kamiyama ,  Masashi Konda

发明人： Naoharu Ohikata ,  Toshio Yamamoto ,  Tadashi Kamiyama ,  Masashi Konda

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/28 ,  H01L23/495

CPC分类号： H01L23/49572 ,  H01L21/565 ,  H01L2924/0002

摘要： A lead structure for packaging a semiconductor chip is provided which includes a plurality of electroconductive leads. At least one lead of an adjacent pair of electroconductive leads has at least one projecting portion which projects towards the other lead of the pair so that a tortuous path is defined between the electroconductive leads. The tortuous path minimizes outflow of molten plastic between the electroconductive leads.

摘要翻译： 提供一种用于封装半导体芯片的引线结构，其包括多个导电引线。 相邻一对导电引线的至少一个引线具有至少一个突出部分，该突出部分朝着该对的另一个引线突出，使得在导电引线之间限定弯曲的路径。 弯曲路径使导电引线之间的熔融塑料流出最小化。

公开(公告)号：US5114878A

公开(公告)日：1992-05-19

申请号：US669189

申请日：1991-03-13

申请人： Tadakatsu Maruyama ,  Yasuhide Ohno ,  Masashi Konda ,  Tosiharu Kikuchi ,  Yasuhiro Suzuki ,  Tomohiro Uno ,  Hiroaki Otsuka ,  Hiroyuki Tanahashi

发明人： Tadakatsu Maruyama ,  Yasuhide Ohno ,  Masashi Konda ,  Tosiharu Kikuchi ,  Yasuhiro Suzuki ,  Tomohiro Uno ,  Hiroaki Otsuka ,  Hiroyuki Tanahashi

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L21/603 ,  H01L23/485 ,  H01L23/498

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/86 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16237 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T29/49153

摘要： A method of bonding bumps to leads of a TAB tape comprises the steps of preparing a substrate which is provided with through-holes, each having a size which will not allow the bumps to pass therethrough, at positions corresponding to bonding positions of the leads of the TAB tape where the bumps are to be bonded; provisionally arranging the bumps at positions of the through-holes at one side of the substrate by reducing a pressure in another side of the substrate opposite to said one side thereof to such the bumps in said through-holes; disposing the substrate on which the bumps are provisionally arranged and said TAB tape in such a positional relationship that said bumps face to the bonding positions of the leads of said TAB tape; and bonding the provisionally arranged bumps to the leads at the bonding positions and an apparatus for arranging bumps in a positional relationship corresponding to bonding positions of leads of a TAB tape.

摘要翻译： 将凸块接合到TAB带的引线的方法包括以下步骤：制备具有通孔的基板，每个基板的尺寸不允许凸块通过，在与引线的引线的接合位置对应的位置 要粘贴凸块的TAB带; 通过将与其一侧相对的基板的另一侧的压力减小到所述通孔中的这些凸块，将凸块临时布置在基板一侧的通孔的位置处; 以与所述TAB带的引线的接合位置相对的位置关系布置临时布置凸块的基板和所述TAB带; 以及在接合位置处将临时布置的凸块接合到引线，以及用于以与TAB带的引线的接合位置相对应的位置关系设置凸块的装置。

公开(公告)号：US5803339A

公开(公告)日：1998-09-08

申请号：US845823

申请日：1997-04-28

申请人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

发明人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

IPC分类号： H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H05K3/3478 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/742 ,  H01L2224/75252 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T156/108

摘要： A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

公开(公告)号：US5687901A

公开(公告)日：1997-11-18

申请号：US557943

申请日：1995-11-14

申请人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

发明人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

IPC分类号： H01L21/48 ,  H01L21/60 ,  H05K3/34

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H05K3/3478 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/742 ,  H01L2224/75252 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T156/108

摘要： A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

摘要翻译： 一种形成用于与集成电路电连接的球凸块的工艺，该方法包括以下步骤：将小振幅的振动施加到包含导电材料的小球的容器，以使小球跳到容器上方; 通过将布置基板中设置的吸引开口吸引到对应于一个半导体芯片的至少一组电极焊盘的位置的位置，将小球保持并布置在布置基板上; 去除附着到布置基板或者吸引到开口的小球的多余的小球; 并且将保持和布置在布置基板上的小球同时结合到布置在与所述至少一组电极焊盘的所述位置相对应的位置的结合点。

公开(公告)号：US5857610A

公开(公告)日：1999-01-12

申请号：US845819

申请日：1997-04-28

申请人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

发明人： Hiroshi Hoshiba ,  Kohei Tatsumi ,  Masashi Konda ,  Yoji Kawakami

IPC分类号： H01L21/48 ,  H01L21/60 ,  H05K3/34 ,  B23K1/06

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H05K3/3478 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/742 ,  H01L2224/75252 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2203/0292 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T156/108

摘要： A process of forming ball bumps for electrical connection to an integrated circuit, the process comprising the steps of: applying a vibration at a small amplitude to a vessel containing small balls of an electroconductive material to cause the small balls to jump up above the vessel; holding and arranging the small balls on an arrangement baseplate by attracting the jumping up small balls to attraction openings provided in the arrangement baseplate in positions corresponding to positions of at least one set of the electrode pads of one semiconductor chip; removing excess small balls adhered either to the arrangement baseplate or to the small balls attracted to the openings; and simultaneously bonding the small balls held and arranged on the arrangement baseplate to bonding spots arranged in positions corresponding to said positions of said at least one set of the electrode pads.

摘要翻译： 一种形成用于与集成电路电连接的球凸块的工艺，该方法包括以下步骤：将小振幅的振动施加到包含导电材料的小球的容器，以使小球跳到容器上方; 通过将布置基板中设置的吸引开口吸引到对应于一个半导体芯片的至少一组电极焊盘的位置的位置，将小球保持并布置在布置基板上; 去除附着到布置基板或者吸引到开口的小球的多余的小球; 并且将保持和布置在布置基板上的小球同时结合到布置在与所述至少一组电极焊盘的所述位置相对应的位置的结合点。