公开(公告)号：US4008858A

公开(公告)日：1977-02-22

申请号：US598121

申请日：1975-07-22

申请人： Masatora Yamada ,  Shigeo Tasaka ,  Tadayuki Okawa ,  Taichi Suzuki

发明人： Masatora Yamada ,  Shigeo Tasaka ,  Tadayuki Okawa ,  Taichi Suzuki

IPC分类号： B29B17/00 ,  B29C45/46 ,  B29C48/38 ,  B29C48/67 ,  B29C48/76 ,  B02C7/175

CPC分类号： B29B17/0042 ,  B29C45/46 ,  B29C47/50 ,  B29C47/6043 ,  B29C47/76 ,  B29C47/766 ,  B29C47/0009 ,  B29K2105/26 ,  Y02W30/62

摘要： An apparatus for treating synthetic resin waste containing thermoplastic synthetic resin and various foreign matter which often contain volatile matter. This apparatus makes it possible to produce articles, from the resin waste, having good mechanical properties by first driving off volatile matter. The apparatus is especially usable for producing long, bar-shaped products, large-sized cylindrical products, piles, sleepers, or molding flasks for concrete works.

摘要翻译： 一种用于处理含有热塑性合成树脂的合成树脂废料和通常含挥发性物质的各种异物的设备。 该装置可以通过首先驱除挥发性物质从树脂废料制造具有良好机械性能的物品。 该设备特别适用于制造长型棒状产品，大型圆柱形产品，桩，轨枕或混凝土工程用烧瓶。

公开(公告)号：US06655024B2

公开(公告)日：2003-12-02

申请号：US10127477

申请日：2002-04-23

申请人： Masayuki Suzuki ,  Makoto Tose ,  Koji Yoshida ,  Tadayuki Okawa

发明人： Masayuki Suzuki ,  Makoto Tose ,  Koji Yoshida ,  Tadayuki Okawa

IPC分类号： H01K310

CPC分类号： H05K3/0023 ,  H05K3/0082 ,  H05K3/4644 ,  H05K2201/09509 ,  H05K2201/09827 ,  H05K2203/056 ,  Y10T29/49165

摘要： A method for manufacturing a circuit board having a through-hole for defining via hole, which has a sloped inner wall tilted at a desired tilt angle &thgr;, is provided. The through-hole has an inverted-trapezoidal cross-section and is made using a photomask having a via hole pattern including a light-shielding pattern corresponding to the bottom of the through-hole, and pluralities of light-shielding strips and translucent strips which are arranged alternately and substantially parallel to one another, the pluralities of light-shielding strips and translucent strips corresponding to the sloped inner wall of the through-hole. The tilt angle &thgr; is determined using a polynomial approximation of degree n: f ⁡ ( s ) = θ = φ ⁢ ∑ k = 0 n ⁢ C k ⁢ s k wherein s is the width of the light-shielding strips and &phgr; is a constant relating to the exposure conditions, and is in the range of about 0.17 rad

摘要翻译： 提供一种具有用于限定通孔的电路板的电路板的制造方法，所述通孔具有以期望的倾斜角θ倾斜的倾斜的内壁。 通孔具有倒梯形截面，并且使用具有通孔图案的光掩模制造，该通孔图案包括对应于通孔底部的遮光图案，以及多个遮光条和半透明条， 交替地且基本上彼此平行地布置，多个遮光条和对应于通孔的倾斜内壁的半透明条。 使用n度的多项式近似来确定倾斜角θ：其中s是遮光条的宽度，phi是与曝光条件有关的常数，并且在约0.17弧度<约1.40的范围内 RAD。

公开(公告)号：US6156672A

公开(公告)日：2000-12-05

申请号：US443671

申请日：1999-11-19

申请人： Yoshihiro Koshido ,  Kei Fujibayashi ,  Yuji Toyota ,  Tadayuki Okawa ,  Ryoichiro Takahashi

发明人： Yoshihiro Koshido ,  Kei Fujibayashi ,  Yuji Toyota ,  Tadayuki Okawa ,  Ryoichiro Takahashi

IPC分类号： H05K3/46 ,  H01L21/02 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/316 ,  H01P3/16 ,  H05K1/02 ,  H05K3/04 ,  H01L21/31

CPC分类号： H01L28/40 ,  H01L21/0272 ,  H01L21/31604 ,  H05K1/024 ,  H05K3/048 ,  Y10S438/951

摘要： A method of forming a dielectric thin film pattern, comprises the steps of: depositing a dielectric thin film on a substrate having a resist pattern thereon by a vapor deposition method, wherein as a material for the dielectric thin film, at least one of CeO.sub.2, Sm.sub.2 O.sub.3, Dy.sub.2 O.sub.3, Y.sub.2 O.sub.3, TiO.sub.2, Al.sub.2 O.sub.3, and MgO is used; and removing the resist pattern whereby the dielectric thin film is patterned.

摘要翻译： 一种形成电介质薄膜图案的方法包括以下步骤：通过气相沉积方法在其上具有抗蚀剂图案的基板上沉积电介质薄膜，其中作为电介质薄膜的材料，CeO 2， 使用Sm2O3，Dy2O3，Y2O3，TiO2，Al2O3和MgO; 并去除抗蚀剂图案，由此电介质薄膜被图案化。