Method of manufacturing a circuit board
    1.
    发明授权
    Method of manufacturing a circuit board 失效
    制造电路板的方法

    公开(公告)号:US06655024B2

    公开(公告)日:2003-12-02

    申请号:US10127477

    申请日:2002-04-23

    IPC分类号: H01K310

    摘要: A method for manufacturing a circuit board having a through-hole for defining via hole, which has a sloped inner wall tilted at a desired tilt angle &thgr;, is provided. The through-hole has an inverted-trapezoidal cross-section and is made using a photomask having a via hole pattern including a light-shielding pattern corresponding to the bottom of the through-hole, and pluralities of light-shielding strips and translucent strips which are arranged alternately and substantially parallel to one another, the pluralities of light-shielding strips and translucent strips corresponding to the sloped inner wall of the through-hole. The tilt angle &thgr; is determined using a polynomial approximation of degree n: f ⁡ ( s ) = θ = φ ⁢ ∑ k = 0 n ⁢ C k ⁢ s k wherein s is the width of the light-shielding strips and &phgr; is a constant relating to the exposure conditions, and is in the range of about 0.17 rad

    摘要翻译: 提供一种具有用于限定通孔的电路板的电路板的制造方法,所述通孔具有以期望的倾斜角θ倾斜的倾斜的内壁。 通孔具有倒梯形截面,并且使用具有通孔图案的光掩模制造,该通孔图案包括对应于通孔底部的遮光图案,以及多个遮光条和半透明条, 交替地且基本上彼此平行地布置,多个遮光条和对应于通孔的倾斜内壁的半透明条。 使用n度的多项式近似来确定倾斜角θ:其中s是遮光条的宽度,phi是与曝光条件有关的常数,并且在约0.17弧度<约1.40的范围内 RAD。