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公开(公告)号:US5192944A
公开(公告)日:1993-03-09
申请号:US626276
申请日:1990-12-12
申请人: Masatoshi Otsuki , Yasuyoshi Kawanishi , Kenji Sawada , Yoshinori Kaido , Takayuki Mizumura , Masayoshi Maeba
发明人: Masatoshi Otsuki , Yasuyoshi Kawanishi , Kenji Sawada , Yoshinori Kaido , Takayuki Mizumura , Masayoshi Maeba
CPC分类号: G09F9/33 , G02F2001/13324 , G02F2203/09 , Y10S136/291 , Y10S323/906
摘要: A display device has a front panel including a solar battery on its surface. At least one window is formed in the solar battery to permit viewing a character formed in the front panel. Energy produced by the solar battery is stored in a storage battery for illuminating light emitting devices situated behind the front panel. The illumination provides background lighting for characters in the window of the front panel. Another embodiment of the invention uses a solar battery with an illuminated layer behind the front panel on which characters are displayed by either removing unwanted segments of a pre-formed character on the front panel or by adding segments of the characters with masking material.
摘要翻译: 显示装置具有在其表面上包括太阳能电池的前面板。 在太阳能电池中形成至少一个窗口以允许观察在前面板中形成的字符。 由太阳能电池产生的能量存储在用于照亮位于前面板后面的发光装置的蓄电池中。 照明为前面板窗口中的字符提供背景照明。 本发明的另一实施例使用具有在前面板后面的照明层的太阳能电池,通过去除前面板上的预先形成的字符的不想要的部分,或者通过用掩蔽材料添加字符段,在其上显示字符。
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公开(公告)号:US5872050A
公开(公告)日:1999-02-16
申请号:US919158
申请日:1997-08-28
申请人: Takahiro Haga , Yoshinori Kaido , Takayoshi Yasuda
发明人: Takahiro Haga , Yoshinori Kaido , Takayoshi Yasuda
CPC分类号: H01L24/05 , H01L23/3164 , H01L23/564 , H01L24/48 , H01L31/0201 , H01L31/02013 , H01L2224/02166 , H01L2224/04042 , H01L2224/05082 , H01L2224/05647 , H01L2224/4847 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12042 , Y02E10/50
摘要: A semiconductor device has a semiconductor element, an output terminal coupled to the semiconductor element and a thin metal member or foil secured to an output terminal. A protective layer covers the semiconductor element including the periphery of the metal foil to define an opening located at the metal foil. By covering the periphery of the metal foil, the protective layer secures the metal foil to the semiconductor element. A lead element is affixed to the metal foil by soldering through the opening. The resulting structure increases the adhesion of the lead element. Furthermore, because the protective film covers and seals the periphery of the metal foil, the advance of moisture into the inside of the semiconductor device is retarded. Accordingly the moisture resistance of the semiconductor device is improved.
摘要翻译: 半导体器件具有半导体元件,耦合到半导体元件的输出端子和固定到输出端子的薄金属构件或箔。 保护层覆盖包括金属箔的周边的半导体元件,以限定位于金属箔的开口。 通过覆盖金属箔的周边,保护层将金属箔固定在半导体元件上。 引线元件通过开口焊接固定在金属箔上。 所得到的结构增加了引线元件的附着力。 此外,由于保护膜覆盖并密封金属箔的周边,所以延迟了进入半导体器件内部的水分。 因此,提高了半导体器件的耐湿性。
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公开(公告)号:US5717255A
公开(公告)日:1998-02-10
申请号:US386232
申请日:1995-02-09
申请人: Takahiro Haga , Yoshinori Kaido , Takayoshi Yasuda
发明人: Takahiro Haga , Yoshinori Kaido , Takayoshi Yasuda
CPC分类号: H01L24/05 , H01L23/3164 , H01L23/564 , H01L24/48 , H01L31/0201 , H01L31/02013 , H01L2224/02166 , H01L2224/04042 , H01L2224/05082 , H01L2224/05647 , H01L2224/4847 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12036 , H01L2924/12042 , Y02E10/50
摘要: A semiconductor device has a semiconductor element, an output terminal coupled to the semiconductor element and a thin metal member or foil secured to an output terminal. A protective layer covers the semiconductor element including the periphery of the metal foil to define an opening located at the metal foil. By covering the periphery of the metal foil, the protective layer secures the metal foil to the semiconductor element. A lead element is affixed to the metal foil by soldering through the opening. The resulting structure increases the adhesion of the lead element. Furthermore, because the protective film covers and seals the periphery of the metal foil, the advance of moisture into the inside of the semiconductor device is retarded. Accordingly the moisture resistance of the semiconductor device is improved.
摘要翻译: 半导体器件具有半导体元件,耦合到半导体元件的输出端子和固定到输出端子的薄金属构件或箔。 保护层覆盖包括金属箔的周边的半导体元件,以限定位于金属箔的开口。 通过覆盖金属箔的周边,保护层将金属箔固定在半导体元件上。 引线元件通过开口焊接固定在金属箔上。 所得到的结构增加了引线元件的附着力。 此外,由于保护膜覆盖并密封金属箔的周边,所以延迟了进入半导体器件内部的水分。 因此,提高了半导体器件的耐湿性。
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公开(公告)号:US5217921A
公开(公告)日:1993-06-08
申请号:US886924
申请日:1992-05-22
申请人: Yoshinori Kaido , Otsuki Masatoshi
发明人: Yoshinori Kaido , Otsuki Masatoshi
IPC分类号: H01L31/04 , H01L27/142
CPC分类号: H01L31/046 , H01L31/0463 , Y02E10/50 , Y10S438/94
摘要: This method of photovoltaic device manufacture has process steps to form a transparent electrode layer comprising at least a tin oxide layer on a transparent substrate, to divide the transparent electrode layer into a plurality of unit areas by laser scribing, and to subsequently heat treat (anneal) the device. The laser for scribing the transparent electrode layer into a plurality of unit areas has an energy density greater than or equal to 21 J/cm.sup.2. Further, when the diameter of the laser beam spot on the transparent electrode layer is D and the distance between pulses is X, the laser satisfies the condition 0.5 D.ltoreq.X.ltoreq.0.85 D.
摘要翻译: 这种光电器件制造方法具有在透明基板上形成至少含有氧化锡层的透明电极层,通过激光划线将透明电极层分割成多个单位区域的步骤,然后进行热处理 ) 装置。 用于将透明电极层划刻成多个单位区域的激光器具有大于或等于21J / cm 2的能量密度。 此外,当透明电极层上的激光束点的直径为D并且脉冲之间的距离为X时,激光器满足条件0.5 D = X <0.85。
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