摘要:
A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm3/cm2·sec to 157 cm3/cm2·sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio SO/SP of at least 0.2, wherein SO represents a total area of the perforations and SP represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
摘要翻译:具有热塑性树脂膜的热敏模版和形成在其上的多孔树脂层。 当该部分的热塑性树脂膜被穿孔时,模板的透气度在1.0cm 3 / cm 2·sec至157cm 3 / cm 2·sec的范围内,以形成提供至少为开放比SO / SP的穿孔 0.2,其中SO表示穿孔的总面积,SP表示该部分的面积。 通过将含有多孔树脂层的树脂的涂布液涂布到热塑性树脂膜上并干燥该涂层来制备热敏模版。 涂布液含有良溶剂和不良溶剂不良溶剂的混合物,从而在干燥后形成多孔树脂层。
摘要:
A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm.sup.3 /cm.sup.2 .multidot.sec to 157 cm.sup.3 /cm.sup.2 .multidot.sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio S.sub.O /S.sub.P of at least 0.2, wherein S.sub.O represents a total area of the perforations and S.sub.P represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
摘要:
A heat-sensitive stencil having a thermoplastic resin film, and a porous resin layer formed thereon. The stencil has an air permeability in the range of 1.0 cm.sup.3 /cm.sup.2 .multidot.sec to 157 cm.sup.3 /cm.sup.2 .multidot.sec in a portion thereof when the thermoplastic resin film of the portion is perforated to form perforations providing an open ratio S.sub.O /S.sub.P of at least 0.2, wherein S.sub.O represents a total area of the perforations and S.sub.P represents the area of the portion. The heat-sensitive stencil is prepared by applying a coating liquid containing the resin of the porous resin layer to the thermoplastic resin film and drying the coating. The coating liquid contains a mixture of a good solvent and a poor solvent less vaporizable than the good solvent so that the porous resin layer is formed after drying.
摘要翻译:具有热塑性树脂膜的热敏模版和形成在其上的多孔树脂层。 当该部分的热塑性树脂膜被穿孔以形成提供至少为0.2的开放比率SO / SP的穿孔时,该模版的透气度在1.0cm 3 / cm 2×sec至157cm 3 / cm 2·sec的范围内,其中SO 表示穿孔的总面积,SP表示该部分的面积。 通过将含有多孔树脂层的树脂的涂布液涂布到热塑性树脂膜上并干燥该涂层来制备热敏模版。 涂布液含有良溶剂和不良溶剂不良溶剂的混合物,从而在干燥后形成多孔树脂层。
摘要:
A thermosensitive stencil paper having a thermoplastic resin film and a porous resin layer which is provided on the thermoplastic resin film by coating a porous resin layer formation coating liquid including a water-in-oil emulsion of a resin on the thermoplastic resin film and drying the coating liquid. In addition, the method of producing the above-mentioned thermosensitive stencil paper is also disclosed.
摘要:
A thermosensitive stencil paper having a thermoplastic resin film and a porous resin layer which is provided on the thermoplastic resin film by coating a porous resin layer formation coating liquid including a water-in-oil emulsion of a resin on the thermoplastic resin film and drying the coating liquid. In addition, the method of producing the above-mentioned thermosensitive stencil paper is also disclosed.
摘要:
A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.
摘要:
A stencil base sheet includes a thermoplastic resin film, with a surface of the stencil base sheet on the side of the thermoplastic resin film having a surface smoothness of at least 6000 seconds. From this stencil base sheet, a printing master is prepared by use of a heat-emitting resistor with the application of electric signals thereto with pulse modulation corresponding to image recording density, thereby forming perforations of a different size corresponding to recording image density in the stencil base sheet by thermal fusing. Furthermore, a monochrome or multi-color stencil printing is performed by using the printing master.
摘要:
A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.
摘要:
In a printer using a stencil, a drum and a stencil feed and discharge unit are constructed integrally with each other. Hence, a stencil can be fed, cut by a thermal head, wrapped around the drum, and then discharged without being cut off. Even a stencil substantially implemented by a thermoplastic resin film, which is thin and soft, can be transported without being creased or otherwise deformed.