Heat-sensitive stencil, process of fabricating same and method of
producing printing master using same
    7.
    发明授权
    Heat-sensitive stencil, process of fabricating same and method of producing printing master using same 有权
    热敏模板,其制造方法以及使用其制造印刷母版的方法

    公开(公告)号:US6092461A

    公开(公告)日:2000-07-25

    申请号:US469537

    申请日:1999-12-22

    摘要: A heat-sensitive stencil including a porous support, and a thermoplastic resin film laminated on the support and having a surface smoothness of at least 10,000 seconds. The stencil is fabricated by bonding a thermoplastic resin film to a porous support with an adhesive having a specific viscosity and a specific volatile matter content, while maintaining each of the support and the film under a specific tension. The stencil may also be fabricated by applying a coating composition containing a resin and first and second solvents having a specific solubility and specific evaporation rates, and drying the applied composition to form a porous support. A printing master is produced by heating the above stencil imagewise by a thermal head with a heating energy of not greater than 0.05 mJ/dot.

    摘要翻译: 包括多孔载体的热敏模板和层压在载体上的表面平滑度至少为10,000秒的热塑性树脂膜。 通过用具有特定粘度和特定挥发性物质含量的粘合剂将热塑性树脂膜粘合到多孔载体上,同时将每个载体和膜保持在特定张力下来制造模版。 模板也可以通过涂布含有树脂的涂料组合物和具有特定溶解度和特定蒸发速率的第一溶剂和第二溶剂,并干燥所施加的组合物以形成多孔载体来制造。 通过以不大于0.05mJ /点的加热能量的热头加热上述模版来制造印刷母版。