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    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体存储器件及其制造方法

    公开(公告)号：US20070235799A1

    公开(公告)日：2007-10-11

    申请号：US11763070

    申请日：2007-06-14

    申请人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    发明人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    IPC分类号： H01L29/788

    CPC分类号： H01L29/7881 ,  G11C16/0483 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/513

    摘要： A semiconductor memory device includes a semiconductor substrate, an isolation insulation film filled in a plurality of trenches formed in the semiconductor substrate to define a plurality of element formation regions, a floating gate of polysilicon provided on each of the element formation regions through a first insulation film, a second insulation film, provided on the floating gate, containing a metal element, a control gate of polysilicon, provided on the second insulation film, and source/drain regions provided in the semiconductor substrate, both a polysilicon conductive layer containing a metal element and a mutual diffusion layer composed of a silicate layer of a mixed oxide material composed of a silicon element contained in the floating gate and the control gate and a metal element contained in the second insulation film are provided on a surface of each of the floating gate and the control gate, respectively.

    摘要翻译： 半导体存储器件包括半导体衬底，隔离绝缘膜，填充在形成于半导体衬底中的多个沟槽中，以限定多个元件形成区域;多晶硅浮置栅极，通过第一绝缘层设置在每个元件形成区域上; 设置在浮置栅极上的第二绝缘膜，包含设置在第二绝缘膜上的金属元件，多晶硅控制栅极和设置在半导体衬底中的源极/漏极区域，包含金属的多晶硅导电层 元件和由浮置栅极中包含的硅元素和控制栅极组成的混合氧化物材料的硅酸盐层和包含在第二绝缘膜中的金属元素构成的互扩散层设置在每个浮动栅极的表面上 门和控制门。

    Semiconductor memory device and method of manufacturing the same
    2.
    发明授权
    Semiconductor memory device and method of manufacturing the same 有权
    半导体存储器件及其制造方法

    公开(公告)号：US07368780B2

    公开(公告)日：2008-05-06

    申请号：US11763070

    申请日：2007-06-14

    申请人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    发明人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    IPC分类号： H01L29/788

    CPC分类号： H01L29/7881 ,  G11C16/0483 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/513

    摘要： A semiconductor memory device includes a semiconductor substrate, an isolation insulation film filled in a plurality of trenches formed in the semiconductor substrate to define a plurality of element formation regions, a floating gate of polysilicon provided on each of the element formation regions through a first insulation film, a second insulation film, provided on the floating gate, containing a metal element, a control gate of polysilicon, provided on the second insulation film, and source/drain regions provided in the semiconductor substrate, both a polysilicon conductive layer containing a metal element and a mutual diffusion layer composed of a silicate layer of a mixed oxide material composed of a silicon element contained in the floating gate and the control gate and a metal element contained in the second insulation film are provided on a surface of each of the floating gate and the control gate, respectively.

    摘要翻译： 半导体存储器件包括半导体衬底，隔离绝缘膜，填充在形成于半导体衬底中的多个沟槽中，以限定多个元件形成区域;多晶硅浮置栅极，通过第一绝缘层设置在每个元件形成区域上; 设置在浮置栅极上的第二绝缘膜，包含设置在第二绝缘膜上的金属元件，多晶硅控制栅极和设置在半导体衬底中的源极/漏极区域，包含金属的多晶硅导电层 元件和由浮置栅极中包含的硅元素和控制栅极组成的混合氧化物材料的硅酸盐层和包含在第二绝缘膜中的金属元素构成的互扩散层设置在每个浮动栅极的表面上 门和控制门。

    Semiconductor memory device and method of manufacturing the same
    4.
    发明授权
    Semiconductor memory device and method of manufacturing the same 有权
    半导体存储器件及其制造方法

    公开(公告)号：US08198159B2

    公开(公告)日：2012-06-12

    申请号：US12054089

    申请日：2008-03-24

    申请人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    发明人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    IPC分类号： H01L21/324 ,  H01L29/788

    CPC分类号： H01L29/7881 ,  G11C16/0483 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/513

    摘要： A semiconductor memory device includes a semiconductor substrate, an isolation insulation film filled in a plurality of trenches formed in the semiconductor substrate to define a plurality of element formation regions, a floating gate of polysilicon provided on each of the element formation regions through a first insulation film, a second insulation film, provided on the floating gate, containing a metal element, a control gate of polysilicon, provided on the second insulation film, and source/drain regions provided in the semiconductor substrate, both a polysilicon conductive layer containing a metal element and a mutual diffusion layer composed of a silicate layer of a mixed oxide material composed of a silicon element contained in the floating gate and the control gate and a metal element contained in the second insulation film are provided on a surface of each of the floating gate and the control gate, respectively.

    摘要翻译： 半导体存储器件包括半导体衬底，隔离绝缘膜，填充在形成于半导体衬底中的多个沟槽中，以限定多个元件形成区域;多晶硅浮置栅极，通过第一绝缘层设置在每个元件形成区域上; 设置在浮置栅极上的第二绝缘膜，包含设置在第二绝缘膜上的金属元件，多晶硅控制栅极和设置在半导体衬底中的源极/漏极区域，包含金属的多晶硅导电层 元件和由浮置栅极中包含的硅元素和控制栅极组成的混合氧化物材料的硅酸盐层和包含在第二绝缘膜中的金属元素构成的互扩散层设置在每个浮动栅极的表面上 门和控制门。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    半导体存储器件及其制造方法

    公开(公告)号：US20080176389A1

    公开(公告)日：2008-07-24

    申请号：US12054089

    申请日：2008-03-24

    申请人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    发明人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    IPC分类号： H01L21/4763

    CPC分类号： H01L29/7881 ,  G11C16/0483 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/513

    摘要： A semiconductor memory device includes a semiconductor substrate, an isolation insulation film filled in a plurality of trenches formed in the semiconductor substrate to define a plurality of element formation regions, a floating gate of polysilicon provided on each of the element formation regions through a first insulation film, a second insulation film, provided on the floating gate, containing a metal element, a control gate of polysilicon, provided on the second insulation film, and source/drain regions provided in the semiconductor substrate, both a polysilicon conductive layer containing a metal element and a mutual diffusion layer composed of a silicate layer of a mixed oxide material composed of a silicon element contained in the floating gate and the control gate and a metal element contained in the second insulation film are provided on a surface of each of the floating gate and the control gate, respectively.

    摘要翻译： 半导体存储器件包括半导体衬底，隔离绝缘膜，填充在形成于半导体衬底中的多个沟槽中，以限定多个元件形成区域;多晶硅浮置栅极，通过第一绝缘层设置在每个元件形成区域上; 设置在浮置栅极上的第二绝缘膜，包含设置在第二绝缘膜上的金属元件，多晶硅控制栅极和设置在半导体衬底中的源极/漏极区域，包含金属的多晶硅导电层 元件和由浮置栅极中包含的硅元素和控制栅极组成的混合氧化物材料的硅酸盐层和包含在第二绝缘膜中的金属元素构成的互扩散层设置在每个浮动栅极的表面上 门和控制门。

    Semiconductor memory device and method of manufacturing the same
    6.
    发明授权
    Semiconductor memory device and method of manufacturing the same 有权
    半导体存储器件及其制造方法

    公开(公告)号：US07294878B2

    公开(公告)日：2007-11-13

    申请号：US11088947

    申请日：2005-03-25

    申请人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    发明人： Masayuki Tanaka ,  Yoshio Ozawa ,  Hirokazu Ishida ,  Katsuaki Natori ,  Seiji Inumiya

    IPC分类号： H01L27/108

    CPC分类号： H01L29/7881 ,  G11C16/0483 ,  H01L21/28273 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42324 ,  H01L29/513

    摘要： A semiconductor memory device includes a semiconductor substrate, an isolation insulation film filled in a plurality of trenches formed in the semiconductor substrate to define a plurality of element formation regions, a floating gate provided on each of the element formation regions through a first gate insulation film, a control gate provided on the floating gate through a second gate insulation film, and source/drain regions provided in the semiconductor substrate, wherein a mutual diffusion layer is provided at least at an interface between the second gate insulation film and the control gate.

    摘要翻译： 半导体存储器件包括半导体衬底，隔离绝缘膜，填充在形成于半导体衬底中的多个沟槽中以限定多个元件形成区域;浮置栅极，通过第一栅极绝缘膜设置在每个元件形成区域上 ，通过第二栅极绝缘膜设置在浮置栅极上的控制栅极和设置在半导体衬底中的源极/漏极区域，其中至少在第二栅极绝缘膜和控制栅极之间的界面处设置相互扩散层。

    Semiconductor device and method of manufacturing the same
    9.
    发明授权
    Semiconductor device and method of manufacturing the same 失效
    半导体装置及其制造方法

    公开(公告)号：US07714373B2

    公开(公告)日：2010-05-11

    申请号：US11822437

    申请日：2007-07-05

    申请人： Katsuaki Natori ,  Masayuki Tanaka ,  Katsuyuki Sekine ,  Hirokazu Ishida ,  Masumi Matsuzaki ,  Yoshio Ozawa

    发明人： Katsuaki Natori ,  Masayuki Tanaka ,  Katsuyuki Sekine ,  Hirokazu Ishida ,  Masumi Matsuzaki ,  Yoshio Ozawa

    IPC分类号： H01L29/788

    CPC分类号： H01L27/115 ,  H01L27/11521

    摘要： There is disclosed a semiconductor device including a plurality of memory cell transistors, each memory cell transistor including a floating gate electrode isolated from each other via an isolation insulating film every memory cell transistor, an inter-electrode insulating film comprising a HfxAl1-xOy film (0.8≦x≦0.95) formed on the floating gate electrode, and a control gate electrode formed on the inter-electrode insulating film, wherein the memory cell transistors are arrayed to form a memory cell array.

    摘要翻译： 公开了一种包括多个存储单元晶体管的半导体器件，每个存储单元晶体管包括通过每个存储单元晶体管的隔离绝缘膜彼此隔离的浮栅，包括Hf x Al 1-x O y膜的电极间绝缘膜（ 形成在浮置栅电极上的栅极电极，以及形成在电极间绝缘膜上的控制栅电极，其中存储单元晶体管被排列以形成存储单元阵列。

    Semiconductor device
    10.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US07612404B2

    公开(公告)日：2009-11-03

    申请号：US11783933

    申请日：2007-04-13

    申请人： Akihito Yamamoto ,  Masayuki Tanaka ,  Katsuyuki Sekine ,  Daisuke Nishida ,  Ryota Fujisuka ,  Katsuaki Natori ,  Hirokazu Ishida ,  Yoshio Ozawa

    发明人： Akihito Yamamoto ,  Masayuki Tanaka ,  Katsuyuki Sekine ,  Daisuke Nishida ,  Ryota Fujisuka ,  Katsuaki Natori ,  Hirokazu Ishida ,  Yoshio Ozawa

    IPC分类号： H01L29/788

    CPC分类号： H01L29/7883 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/42336 ,  H01L29/513

    摘要： A semiconductor device includes semiconductor substrate, isolation insulating film, nonvolatile memory cells, each of the cells including tunnel insulating film, FG electrode, CG electrode, interelectrode insulating film between the CG and FG electrodes and including a first insulating film and a second insulating film on the first insulating film and having higher permittivity than the first insulating film, the interelectrode insulating film being provided on a side wall of the floating gate electrode in a cross-section view of a channel width direction of the cell, thickness of the interelectrode insulating film increasing from an upper portion of the side wall toward a lower portion of the side wall, thickness of the second insulating film on an upper corner of the FG electrode being thicker than thickness of the second insulating film on the other portions of the side wall in the cross-section view of the channel width direction.

    摘要翻译： 半导体器件包括半导体衬底，隔离绝缘膜，非易失性存储单元，每个单元包括隧道绝缘膜，FG电极，CG电极，CG和FG电极之间的电极间绝缘膜，并且包括第一绝缘膜和第二绝缘膜 在第一绝缘膜上并且具有比第一绝缘膜高的介电常数，电极间绝缘膜设置在浮栅电极的侧壁上，在电池的沟道宽度方向的横截面图中，绝缘电极的绝缘层的厚度 膜从侧壁的上部向侧壁的下部增加，FG电极的上角上的第二绝缘膜的厚度比侧壁的其他部分上的第二绝缘膜的厚度厚 在通道宽度方向的横截面视图中。