公开(公告)号：US20110307089A1

公开(公告)日：2011-12-15

申请号：US12964531

申请日：2010-12-09

申请人： Masayuki TOMOYASU ,  Merritt Lane Funk ,  Kevin Augustine Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

发明人： Masayuki TOMOYASU ,  Merritt Lane Funk ,  Kevin Augustine Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

IPC分类号： G06F17/00

CPC分类号： H01L21/67253 ,  C23C16/4405 ,  C25D11/02 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67155 ,  H01L21/67207 ,  H01L21/67248 ,  H01L22/20

摘要： A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

摘要翻译： 提出了一种用于化学氧化物去除（COR）的处理系统和方法，其中处理系统包括第一处理室和第二处理室，其中第一和第二处理室彼此耦合。 第一处理室包括提供温度控制室的化学处理室和用于支撑用于化学处理的基板的独立温度控制的基板保持器。 在包括表面温度和气体压力的受控条件下，将基底暴露于气态化学物质，例如HF / NH 3。 第二处理室包括热处理室，其提供与化学处理室热绝缘的温度控制室。 热处理室提供用于控制基板的温度以热处理基板上化学处理的表面的基板保持器。

公开(公告)号：US07877161B2

公开(公告)日：2011-01-25

申请号：US10736983

申请日：2003-12-17

申请人： Masayuki Tomoyasu ,  Merritt Lane Funk ,  Kevin Augustine Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

发明人： Masayuki Tomoyasu ,  Merritt Lane Funk ,  Kevin Augustine Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

IPC分类号： G06F19/00 ,  H01L21/302

CPC分类号： H01L21/67253 ,  C23C16/4405 ,  C25D11/02 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67155 ,  H01L21/67207 ,  H01L21/67248 ,  H01L22/20

摘要： A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

摘要翻译： 提出了一种用于化学氧化物去除（COR）的处理系统和方法，其中处理系统包括第一处理室和第二处理室，其中第一和第二处理室彼此耦合。 第一处理室包括提供温度控制室的化学处理室和用于支撑用于化学处理的基板的独立温度控制的基板保持器。 在包括表面温度和气体压力的受控条件下，将基底暴露于气态化学物质，例如HF / NH 3。 第二处理室包括热处理室，其提供与化学处理室热绝缘的温度控制室。 热处理室提供用于控制基板的温度以热处理基板上化学处理的表面的基板保持器。

公开(公告)号：US08175736B2

公开(公告)日：2012-05-08

申请号：US12964531

申请日：2010-12-09

申请人： Masayuki Tomoyasu ,  Merritt Funk ,  Kevin A. Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

发明人： Masayuki Tomoyasu ,  Merritt Funk ,  Kevin A. Pinto ,  Masaya Odagiri ,  Lemuel Chen ,  Asao Yamashita ,  Akira Iwami ,  Hiroyuki Takahashi

IPC分类号： G06F19/00 ,  H01L21/302

CPC分类号： H01L21/67253 ,  C23C16/4405 ,  C25D11/02 ,  H01L21/0337 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67155 ,  H01L21/67207 ,  H01L21/67248 ,  H01L22/20

摘要： A processing system and method for chemical oxide removal (COR) is presented, wherein the processing system comprises a first treatment chamber and a second treatment chamber, wherein the first and second treatment chambers are coupled to one another. The first treatment chamber comprises a chemical treatment chamber that provides a temperature controlled chamber, and an independently temperature controlled substrate holder for supporting a substrate for chemical treatment. The substrate is exposed to a gaseous chemistry, such as HF/NH3, under controlled conditions including surface temperature and gas pressure. The second treatment chamber comprises a heat treatment chamber that provides a temperature controlled chamber, thermally insulated from the chemical treatment chamber. The heat treatment chamber provides a substrate holder for controlling the temperature of the substrate to thermally process the chemically treated surfaces on the substrate.

摘要翻译： 提出了一种用于化学氧化物去除（COR）的处理系统和方法，其中处理系统包括第一处理室和第二处理室，其中第一和第二处理室彼此耦合。 第一处理室包括提供温度控制室的化学处理室和用于支撑用于化学处理的基板的独立温度控制的基板保持器。 在包括表面温度和气体压力的受控条件下，将基底暴露于气态化学物质，例如HF / NH 3。 第二处理室包括热处理室，其提供与化学处理室热绝缘的温度控制室。 热处理室提供用于控制基板的温度以热处理基板上化学处理的表面的基板保持器。

公开(公告)号：US07555406B2

公开(公告)日：2009-06-30

申请号：US10986310

申请日：2004-11-12

申请人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

发明人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

IPC分类号： G06F11/34

CPC分类号： H01L21/67276 ,  G05B19/4067 ,  G05B2219/45031

摘要： According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).

摘要翻译： 根据本发明，随着处理装置的驱动开始，实时监视用于驱动处理装置的软件的运行状态，以诊断异常是否发生（S110）。 如果通过在S110中执行的诊断来判断没有发生异常，则允许工件处理不间断地继续，然后作出关于工件处理是否已经完成的决定（S130）。 如果处理完成，则处理装置停止（S140）。 另一方面，如果通过在S110中进行的诊断来判断发生异常，则记录有发生异常的诊断项目的日志（S120）。 然后停止处理装置（S140）。

公开(公告)号：US20050090926A1

公开(公告)日：2005-04-28

申请号：US10986290

申请日：2004-11-12

申请人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

发明人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

IPC分类号： G05B19/4067 ,  H01L21/00 ,  G06F19/00

CPC分类号： H01L21/67276 ,  G05B19/4067 ,  G05B2219/45031

摘要： According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).

摘要翻译： 根据本发明，随着处理装置的驱动开始，实时监视用于驱动处理装置的软件的运行状态，以诊断是否发生异常（S110）。 如果通过在S110中执行的诊断来判断没有发生异常，则允许工件处理不间断地继续，然后作出关于工件处理是否已经完成的决定（S130）。 如果处理已经完成，则处理装置停止（S140）。 另一方面，如果通过在S110中进行的诊断来判断异常发生，则记录出发生了异常的诊断项目的日志（S120）。 然后停止处理装置（S140）。

公开(公告)号：US07386423B2

公开(公告)日：2008-06-10

申请号：US10986290

申请日：2004-11-12

申请人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

发明人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

IPC分类号： G06F19/00

CPC分类号： H01L21/67276 ,  G05B19/4067 ,  G05B2219/45031

摘要： According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).

摘要翻译： 根据本发明，随着处理装置的驱动开始，实时监视用于驱动处理装置的软件的运行状态，以诊断是否发生异常（S110）。 如果通过在S110中执行的诊断来判断没有发生异常，则允许工件处理不间断地继续，然后作出关于工件处理是否已经完成的决定（S130）。 如果处理已经完成，则处理装置停止（S140）。 另一方面，如果通过在S110中进行的诊断来判断异常发生，则记录出发生了异常的诊断项目的日志（S120）。 然后停止处理装置（S140）。

公开(公告)号：US06954716B2

公开(公告)日：2005-10-11

申请号：US10332126

申请日：2001-07-04

申请人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

发明人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

IPC分类号： G05B19/4067 ,  H01L21/00 ,  G06F11/30

CPC分类号： H01L21/67276 ,  G05B19/4067 ,  G05B2219/45031

摘要： According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).

摘要翻译： 根据本发明，随着处理装置的驱动开始，实时监视用于驱动处理装置的软件的运行状态，以诊断是否发生异常（S110）。 如果通过在S110中执行的诊断来判断没有发生异常，则允许工件处理不间断地继续，然后作出关于工件处理是否已经完成的决定（S130）。 如果处理已经完成，则处理装置停止（S140）。 另一方面，如果通过在S110中进行的诊断来判断异常发生，则记录出发生了异常的诊断项目的日志（S120）。 然后停止处理装置（S140）。

公开(公告)号：US20050090927A1

公开(公告)日：2005-04-28

申请号：US10986310

申请日：2004-11-12

申请人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

发明人： Hisato Tanaka ,  Akira Obi ,  Akira Iwami ,  Kazushi Tahara ,  Shigeaki Kato

IPC分类号： G05B19/4067 ,  H01L21/00 ,  G06F19/00

CPC分类号： H01L21/67276 ,  G05B19/4067 ,  G05B2219/45031

摘要： According to the present invention, as processing apparatus drive starts, the operating state of software used to drive the processing apparatus is monitored in real time to diagnose whether or not an abnormality has occurred (S110). If it is judged through the diagnosis performed in S110 that no abnormality has occurred, the workpiece processing is allowed to continue uninterrupted and then a decision is made as to whether or not the workpiece processing has been completed (S130). If the processing has been completed, the processing apparatus is stopped (S140). If, on the other hand, it is judged through the diagnosis performed in S110 that an abnormality has occurred, a log of the diagnosis item with regard to which the abnormality has occurred is recorded (S120). The processing apparatus is then stopped (S140).

摘要翻译： 根据本发明，随着处理装置的驱动开始，实时监视用于驱动处理装置的软件的运行状态，以诊断是否发生异常（S110）。 如果通过在S110中执行的诊断来判断没有发生异常，则允许工件处理不间断地继续，然后作出关于工件处理是否已经完成的决定（S130）。 如果处理已经完成，则处理装置停止（S140）。 另一方面，如果通过在S110中进行的诊断来判断异常发生，则记录出发生了异常的诊断项目的日志（S120）。 然后停止处理装置（S140）。