公开(公告)号：US10433427B2

公开(公告)日：2019-10-01

申请号：US15319549

申请日：2015-06-02

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Yuji Sutou ,  Daisuke Ando

IPC: H05K3/12 ,  B05D3/04 ,  B22F3/10 ,  B05D3/02 ,  H01B1/22 ,  H01B5/02 ,  H01B5/14 ,  H01B13/00 ,  H01L21/48 ,  H01B1/00 ,  B22F1/00

Abstract: To provide a method for firing a copper paste, which improves sinterability of copper particles for the purpose of forming a copper wiring line that is decreased in the electrical conductivity. A method for firing a copper paste, which comprises: an application step wherein a copper paste is applied over a substrate; a first heating step wherein the substrate is heated in a nitrogen gas atmosphere containing from 500 ppm to 2,000 ppm (inclusive) of an oxidizing gas in terms of volume ratio after the application step, thereby oxidizing and sintering copper particles in the copper paste; and a second heating step wherein the substrate is heated in a nitrogen gas atmosphere containing 1% or more of a reducing gas in terms of volume ratio after the first heating step, thereby reducing the oxidized and sintered copper oxide.

公开(公告)号：US10355147B2

公开(公告)日：2019-07-16

申请号：US15539430

申请日：2015-12-17

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Yuji Sutou ,  Daisuke Ando ,  Makoto Wada

IPC: H01L31/18 ,  H01L31/048 ,  H01L31/0216 ,  H01L31/0224

Abstract: A solar cell module capable of preventing the occurrence of a PID failure in a solar photovoltaic power generation system with a MW capacity, said system being used in a high-temperature high-humidity environment; and a method for manufacturing this solar cell module. A solar cell module which comprises a protection glass material and a sealing material on a light receiving surface side of a substrate, and which also comprises an oxide layer between the substrate and the protection glass material, said oxide layer containing a metal element and silicon. It is preferable that the oxide layer contains at least one metal element selected from the group consisting of magnesium, aluminum, titanium, vanadium, chromium, manganese, zirconium, niobium and molybdenum. It is also preferable that the oxide layer has a refractive index of from 1.5 to 2.3 (inclusive) with respect to incident light having a wavelength of 587 nm.

公开(公告)号：US10529875B2

公开(公告)日：2020-01-07

申请号：US15106963

申请日：2014-12-22

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Yuji Sutou ,  Daisuke Ando ,  Tri Hai Hoang

IPC: H01L31/0224 ,  H01L31/068 ,  H01L31/0216 ,  H01L31/18

Abstract: The present invention is provided with an interface layer that minimizes interdiffusion between a silicon substrate and copper electrode wiring that are used as a solar cell, that improves the adhesive properties of copper wiring, and that is used to obtain ohmic contact characteristics. This silicon solar cell comprises a silicon substrate and is provided with a metal oxide layer that is formed on the silicon substrate and wiring that is formed on the metal oxide layer and that comprises mainly copper. The metal oxide layer contains (a) one of either titanium or manganese, (b) one of vanadium, niobium, tantalum, or silicon, and (c) at least one of copper and nickel. In addition, the metal oxide layer comprises copper or nickel as metal particles that are diffused in the interior of the metal oxide layer.

公开(公告)号：US09795032B2

公开(公告)日：2017-10-17

申请号：US15325289

申请日：2015-07-10

Applicant: Material Concept, Inc.

Inventor： Junichi Koike ,  Daisuke Ando ,  Yuji Sutou

IPC: B32B15/04 ,  H05K1/09 ,  H05K3/38 ,  H05K1/03 ,  H05K3/10 ,  H05K1/11

CPC classification number: H05K1/09 ,  H01G2/06 ,  H01G4/008 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K3/10 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4007 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2203/086 ,  H05K2203/087

Abstract: To provide: an electronic component which comprises a copper electrode on an inorganic material substrate and wherein the adhesion strength between the substrate and the copper electrode is high, thereby achieving improved adhesion of the copper electrode; and a method for manufacturing this electronic component. An electronic component which comprises a copper electrode on an inorganic material substrate and wherein an interface layer containing copper, manganese, silicon and oxygen is provided at the interface between the substrate and the copper electrode, and the interface layer contains crystal grains that are mainly formed of copper and dispersed in the interface layer. A method for manufacturing this electronic component comprises: an interface layer formation step for forming an interface layer on the substrate; and an electrode formation step for forming the copper electrode on the interface layer.