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公开(公告)号：US08168017B2
公开(公告)日：2012-05-01
申请号：US12700049
申请日：2010-02-04
CPC分类号： H01L21/68757 , G03F7/707 , Y10T156/10 , Y10T156/1089 , Y10T428/24744
摘要： A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
摘要翻译： 一种用于光刻设备的晶片卡盘，其包括低热膨胀玻璃陶瓷基板，硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层，所述粘合层将硅硅 描述了到基底的碳化物层。 另外，一种形成用于光刻设备的晶片卡盘的方法，其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分，并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。
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公开(公告)号：US20080174054A1
公开(公告)日：2008-07-24
申请号：US11626747
申请日：2007-01-24
IPC分类号： B28B1/00
CPC分类号： H01L21/68757 , G03F7/707 , Y10T156/10 , Y10T156/1089 , Y10T428/24744
摘要： A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
摘要翻译： 一种用于光刻设备的晶片卡盘，其包括低热膨胀玻璃陶瓷基板，硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层，所述粘合层将硅硅 描述了到基底的碳化物层。 另外，一种形成用于光刻设备的晶片卡盘的方法，其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分，并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。
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公开(公告)号：US20100128242A1
公开(公告)日：2010-05-27
申请号：US12700049
申请日：2010-02-04
CPC分类号： H01L21/68757 , G03F7/707 , Y10T156/10 , Y10T156/1089 , Y10T428/24744
摘要： A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
摘要翻译： 一种用于光刻设备的晶片卡盘，其包括低热膨胀玻璃陶瓷基板，硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层，所述粘合层将硅硅 描述了到基底的碳化物层。 另外，一种形成用于光刻设备的晶片卡盘的方法，其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分，并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。
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公开(公告)号：US07678458B2
公开(公告)日：2010-03-16
申请号：US11626747
申请日：2007-01-24
CPC分类号： H01L21/68757 , G03F7/707 , Y10T156/10 , Y10T156/1089 , Y10T428/24744
摘要： A wafer chuck for use in a lithographic apparatus, which includes a low-thermal expansion glass ceramic substrate, a silicon silicon carbide layer, and a bonding layer comprising silicate having a strength of at least about 5 megapascals, the bonding layer attaching the silicon silicon carbide layer to the substrate is described. Also, a method of forming a wafer chuck for use in a lithographic apparatus, which includes coating a portion of one or both of a low-thermal expansion glass ceramic substrate and a silicon silicon carbide layer with a bonding solution, and contacting the substrate and the silicon silicon carbide layer to bond the substrate and the silicon silicon carbide layer together is described.
摘要翻译： 一种用于光刻设备的晶片卡盘，其包括低热膨胀玻璃陶瓷基板，硅碳化硅层和包括具有至少约5兆帕的强度的硅酸盐的粘合层，所述粘合层将硅硅 描述了到基底的碳化物层。 另外，一种形成用于光刻设备的晶片卡盘的方法，其包括用粘合溶液涂覆低热膨胀玻璃陶瓷基板和硅碳化硅中的一个或两个的一部分，并使基板和 描述了将基板和硅碳化硅层结合在一起的硅碳化硅层。
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公开(公告)号：US08297008B2
公开(公告)日：2012-10-30
申请号：US12935842
申请日：2009-04-02
申请人： Dennis Booth , Timothy O'Neil
发明人： Dennis Booth , Timothy O'Neil
CPC分类号： H02S20/23 , C09J7/24 , C09J2203/322 , C09J2423/106 , C09J2423/166 , C09J2427/006 , F24S2025/011 , F24S2025/601 , H01L31/048 , Y02B10/12 , Y02B10/20 , Y02E10/50
摘要： A spacer used to secure a solar module to a substrate having surface irregularities or unevenness includes a spacer layer located between two adhesive layers. The spacer has a thickness greater than any anticipated irregularities or unevenness on the surface of the substrate. The spacer is comprised of materials that provide sufficient strength and weatherability.
摘要翻译： 用于将太阳能模块固定到具有表面不规则或不均匀的基板的间隔件包括位于两个粘合剂层之间的间隔层。 间隔物的厚度大于衬底表面上任何预期的不规则性或不均匀性。 间隔件由提供足够的强度和耐候性的材料组成。
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公开(公告)号：US20110197955A1
公开(公告)日：2011-08-18
申请号：US13061266
申请日：2009-09-30
申请人： Dennis Booth , Timothy O'Neil , Sharon Loomis , Beverly Zimmerman , Paul Ruede , Paul Snowwhite , James Wood
发明人： Dennis Booth , Timothy O'Neil , Sharon Loomis , Beverly Zimmerman , Paul Ruede , Paul Snowwhite , James Wood
IPC分类号： H01L31/048 , H01L31/0203
CPC分类号： B32B17/1055 , H01L31/048 , Y02E10/50
摘要： A solar module includes a photovoltaic device that is partially encapsulated on a front side by a laminate layer. A front substrate is located over the laminate layer. The photovoltaic device is also at least partially encapsulated on a back side by a pressure sensitive adhesive layer. The adhesive layer acts as an encapsulant to protect the photovoltaic device as well as acts as an adhesive for attachment to a substrate.
摘要翻译： 太阳能模块包括通过层压层部分地封装在前侧的光伏器件。 前衬底位于层压层上。 该光伏器件还通过压敏粘合剂层至少部分地封装在背面上。 粘合剂层用作密封剂以保护光伏器件以及作为粘合剂用于附着到基底上。
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公开(公告)号：US5910088A
公开(公告)日：1999-06-08
申请号：US90361
申请日：1998-06-04
摘要： A method for reducing air infiltration in a building having a frame constructed with wooden components. Glue is applied to abutting wooden surfaces to provide a seal between such surfaces to prevent air flow between such surfaces.
摘要翻译： 一种用于减少建筑物中的空气渗透的方法，其具有由木构件构成的框架。 将粘合剂施加到邻接的木制表面以在这些表面之间提供密封，以防止这些表面之间的空气流动。
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公开(公告)号：US20110024050A1
公开(公告)日：2011-02-03
申请号：US12935842
申请日：2009-04-02
申请人： Dennis Booth , Timothy O'Neil
发明人： Dennis Booth , Timothy O'Neil
CPC分类号： H02S20/23 , C09J7/24 , C09J2203/322 , C09J2423/106 , C09J2423/166 , C09J2427/006 , F24S2025/011 , F24S2025/601 , H01L31/048 , Y02B10/12 , Y02B10/20 , Y02E10/50
摘要： A spacer used to secure a solar module to a substrate having surface irregularities or unevenness includes a spacer layer located between two adhesive layers. The spacer has a thickness greater than any anticipated irregularities or unevenness on the surface of the substrate. The spacer is comprised of materials that provide sufficient strength and weatherability.
摘要翻译： 用于将太阳能模块固定到具有表面不规则或不均匀的基板的间隔件包括位于两个粘合剂层之间的间隔层。 间隔物的厚度大于衬底表面上任何预期的不规则性或不均匀性。 间隔件由提供足够的强度和耐候性的材料组成。
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