Production Process For A Semi-Conductor Device And Semi-Conductor Device
    2.
    发明申请
    Production Process For A Semi-Conductor Device And Semi-Conductor Device 有权
    半导体器件和半导体器件的生产工艺

    公开(公告)号:US20120032310A1

    公开(公告)日:2012-02-09

    申请号:US13198789

    申请日:2011-08-05

    IPC分类号: H01L29/02 H01L21/22

    摘要: A process for producing a semiconductor device comprises the following process steps: provision of a semiconductor substrate (1); formation of a functional layer (2) on a semiconductor surface (11) of the semiconductor substrate (1); and production of at least one doped section (3) on the semiconductor surface (11) by driving a dopant into the semiconductor substrate (1) from the functional layer (2). The functional layer (2) is formed in such a way that it passivates the semiconductor surface (11), acting as a passivation layer upon completion of the semiconductor device.

    摘要翻译: 一种制造半导体器件的方法包括以下工艺步骤:提供半导体衬底(1); 在半导体衬底(1)的半导体表面(11)上形成功能层(2); 以及通过从功能层(2)将掺杂剂驱动到半导体衬底(1)中,在半导体表面(11)上生产至少一个掺杂部分(3)。 功能层(2)形成为使半导体表面(11)钝化,在半导体器件完成时用作钝化层。