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公开(公告)号：US20230091035A1
公开(公告)日：2023-03-23
申请号：US17994985
申请日：2022-11-28
Inventor： Martin L. Zucker , Peter J. Lembesis , Ted Tevis , Ryan M. Pakulski , Michael X. Yang
IPC: H01J37/32 , H01L21/677 , H01L21/68 , B25J11/00 , B25J15/00 , H01L21/67 , H01L21/683 , H01L21/687 , H01L21/02
Abstract: Systems and methods for processing workpieces, such as semiconductor workpieces are provided. One example embodiment is directed to a processing system for processing a plurality of workpieces. The processing system can include a loadlock chamber, a transfer chamber, and at least two processing chamber having two or more processing stations. The processing system further includes a storage chamber for storing replaceable parts. The transfer chamber includes a workpiece handling robot. The workpiece handling robot can be configured to transfer a plurality of replaceable parts from the processing stations to the storage chamber.
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公开(公告)号：US20180286640A1
公开(公告)日：2018-10-04
申请号：US15936764
申请日：2018-03-27
Applicant: Mattson Technology, Inc.
Inventor： Jeffrey Cue , Martin L. Zucker
IPC: H01J37/32 , H01L21/683 , H01L21/67
Abstract: Focus ring assemblies for plasma processing apparatus are provided. In one example implementation, an apparatus includes a plasma source configured to generate a plasma. The apparatus includes a chamber configured to receive a workpiece. The apparatus includes a workpiece support contained in the chamber and configured to support the workpiece. The apparatus includes a focus ring assembly. The focus ring assembly includes a focus ring having an upper tier and a lower tier. An inner edge of the upper tier can be separated a lateral distance of at least about 3 mm from an outer edge of the workpiece located on the workpiece support.
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公开(公告)号：US11515127B2
公开(公告)日：2022-11-29
申请号：US15930924
申请日：2020-05-13
Inventor： Martin L. Zucker , Peter J. Lembesis , Ryan M. Pakulski
IPC: H01J37/32 , H01L21/203 , H01L21/677 , H01L21/68 , B25J11/00 , B25J15/00 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: An end effector for moving workpieces and replaceable parts within a system for processing workpieces. The end effector may include an arm portion extending between a first arm end and a second arm end along the axial direction. The end effector may further include a spatula portion extending between a first spatula end and a second spatula end, the first spatula end being adjacent the second arm end. Further, the end effector may include a first support member extending outwardly from the spatula portion, a second support member extending outwardly from the spatula portion, and a shared support member extending outwardly from the arm portion. The shared support member and the first support member together to support workpieces of a first diameter, and the shared support member and the second support member together support replaceable parts of a second diameter.
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公开(公告)号：US20190088512A1
公开(公告)日：2019-03-21
申请号：US16103100
申请日：2018-08-14
Applicant: Mattson Technology, Inc.
Inventor： Martin L. Zucker
IPC: H01L21/67 , H01J37/32 , H01L21/683
Abstract: A pedestal assembly for use in a plasma processing apparatus for processing a substrate includes a baseplate. The pedestal assembly can further include a puck configured to support a substrate. The pedestal assembly can further include a focus ring arranged relative to the puck such that at least a portion of the focus ring at least partially surrounds a periphery of the substrate when the substrate is positioned on the puck. In addition, the focus ring can be spaced apart from the puck so that a gap is defined therebetween. The pedestal assembly can further include a thermally conductive member spaced apart from the puck. The thermally conductive member can be in thermal communication with the focus ring surrounded by the inner insulator ring and configured to be in thermal communication with the focus ring and the baseplate.
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Patent Agency Ranking
公开(公告)号：US11508560B2
公开(公告)日：2022-11-22
申请号：US15930910
申请日：2020-05-13
Inventor： Martin L. Zucker , Peter J. Lembesis , Ryan M. Pakulski , Shawming Ma
IPC: H01L21/20 , H01J37/32 , H01L21/203 , H01L21/677 , H01L21/68 , B25J11/00 , B25J15/00 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: A focus ring adjustment assembly of a system for processing workpieces under vacuum, where the focus ring may include a lower side having a first surface portion and a second surface portion, the first surface portion being vertically above the second surface portion. The adjustment assembly may include a pin configured to selectively contact the first surface portion of the focus ring, and an actuator operable to move the pin along the vertical direction between an extended position and a retracted position. The extended position of the pin may be associated with the distal end of the pin contacting the first surface of the focus ring and the focus ring being accessible for removal by a workpiece handling robot from the vacuum process chamber.
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公开(公告)号：US20180286639A1
公开(公告)日：2018-10-04
申请号：US15936744
申请日：2018-03-27
Applicant: Mattson Technology, Inc.
Inventor： Martin L. Zucker , Tinghao Frank Wang
IPC: H01J37/32 , H01L21/67 , H01L21/683
Abstract: Pedestal assemblies for processing apparatus, such as plasma processing apparatus are provided. In one example implementation, a plasma processing apparatus can include a processing chamber having a processing chamber interior. The apparatus can include a plasma source configured to induce a plasma in the processing chamber interior. The apparatus can include a pedestal configured to support a substrate in the processing chamber interior during processing of the substrate. The apparatus can include a focus ring configured to be disposed around a periphery of the substrate when the substrate is supported on the pedestal. The focus ring can have a plurality of uniformly spaced apart slots. Each slot can be configured to engage with a corresponding protrusion located on the pedestal.
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公开(公告)号：US11348767B2
公开(公告)日：2022-05-31
申请号：US15930874
申请日：2020-05-13
Inventor： Martin L. Zucker , Peter J. Lembesis , Ryan M. Pakulski , Shawming Ma
IPC: H01J37/32 , H01L21/68 , H01L21/203 , H01L21/677 , B25J11/00 , B25J15/00 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: A plasma processing apparatus is provided. The plasma processing apparatus includes a processing chamber defining a vertical direction and a lateral direction. The plasma processing apparatus includes a pedestal disposed within the processing chamber. The pedestal is configured to support the substrate. The plasma processing apparatus includes a radio frequency (RF) disposed within the processing chamber. The RF bias electrode defines a RF zone extending between a first end of the RF bias electrode and a second end of the RF bias electrode along the lateral direction. The plasma processing apparatus includes a focus ring disposed within the processing chamber. The plasma processing apparatus further includes a focus ring adjustment assembly. The focus ring adjustment assembly includes a lift pin positioned outside of the RF zone. The lift pin is movable along the vertical direction to adjust a distance between the pedestal and the focus ring along the vertical direction.
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公开(公告)号：US11251026B2
公开(公告)日：2022-02-15
申请号：US15936764
申请日：2018-03-27
Inventor： Jeffrey Cue , Martin L. Zucker
IPC: H01J37/32 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: Focus ring assemblies for plasma processing apparatus are provided. In one example implementation, an apparatus includes a plasma source configured to generate a plasma. The apparatus includes a chamber configured to receive a workpiece. The apparatus includes a workpiece support contained in the chamber and configured to support the workpiece. The apparatus includes a focus ring assembly. The focus ring assembly includes a focus ring having an upper tier and a lower tier. An inner edge of the upper tier can be separated a lateral distance of at least about 3 mm from an outer edge of the workpiece located on the workpiece support.
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公开(公告)号：US11195704B2
公开(公告)日：2021-12-07
申请号：US15936744
申请日：2018-03-27
Inventor： Martin L. Zucker , Tinghao Frank Wang
IPC: H01J37/32 , H01L21/67 , H01L21/683 , H01L21/687
Abstract: Pedestal assemblies for processing apparatus, such as plasma processing apparatus are provided. In one example implementation, a plasma processing apparatus can include a processing chamber having a processing chamber interior. The apparatus can include a plasma source configured to induce a plasma in the processing chamber interior. The apparatus can include a pedestal configured to support a substrate in the processing chamber interior during processing of the substrate. The apparatus can include a focus ring configured to be disposed around a periphery of the substrate when the substrate is supported on the pedestal. The focus ring can have a plurality of uniformly spaced apart slots. Each slot can be configured to engage with a corresponding protrusion located on the pedestal.
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