Abstract:
This invention provides a configuring apparatus and a processing method for a thermal conductive plate, which uses high-temperature fusion to seal a top plate and a bottom plate of the thermal conductive plate together. Thereby, the sealing condition is improved to enhance yield. Further, the processing method speeds up fabrication of the thermal conductive plate to aid in execution of automatic process.
Abstract:
An improved structure of a uniform thermal conductive heat dissipation device, having a thermal conductor and a plurality of heat pipes. The thermal conductor includes a convex body member, on which a plurality of parallel connecting parts is formed to allow the heat pipes embedded therein. Each of the heat pipes has a wick structure and a working fluid therein. Each heat pipe has a heat absorbing portion and a heat dissipation portion. The heat absorption portion is closely in contact with the thermal conductor. Thereby, each of the heat is subject to the same amount of heat to result in a uniform thermal conduction and dissipation effect.
Abstract:
The heat sink fastener includes a heat conductive board and a flexible metallic wire. The heat conductive board has a pair of pivot portions. The flexible metallic wire has a pair of flexible arms and a middle portion connecting therebetween. Each flexible arm connects to the pivot portion. The pivot portion side of the heat conductive board is formed with a blocking sheet. The middle portion is provided with a bend for being blocked by the blocking sheet. When the flexible metallic wire is hooked to a ring on a circuit board, it will generate pressure to the heat conductive board resulting from the bent flexible arms and the blocked middle portion.
Abstract:
An anti-breaking structure of an end closure of a heat pipe is formed at a tapered end of the heat pipe, and a soldering joint is formed at an upper end of the anti-breaking structure. The anti-breaking structure includes an uneven rib coupled longitudinally between the tapered end and the soldering joint, and two wing portions extended outward from the left and right outer sides of the uneven rib, and one surface of the uneven rib is convex and another backside surface of the uneven rib is concave, and both uneven rib and wing portions are formed by pressing the heat pipe to constitute the anti-breaking structure.
Abstract:
The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.
Abstract:
An integral heat dissipating device includes a radiating plate, a fan blade and a cover. The radiating plate has a heat dissipating channel. A fan blade receiving chamber is communicated with the heat dissipating channel and a heat conductive plate is connected to the bottom of the outer wall of the heat dissipating channel. The bottom of the fan blade receiving chamber is installed with an axial hole which serves to be installed with a fan blade. The axial hole can be installed with a fan blade with power. An inclined surface is formed at the upper side of the fan blade receiving chamber. A plate shape heat tube is welded between the heat conductive plate and the bottom of the heat dissipating channel. A plurality of screw retaining posts capable of being screwedly fixed to a circuit board being suspended from the lateral side of the heat conductive plate. The cover is a thin plate with a hole for sealing the upper side of the heat dissipating channel and the fan blade receiving chamber. The hole is placed above the fan blade receiving chamber for being formed as a tilt wind opening. In the present invention, the radiating plate is made integrally and can be directly connected to the fan. The shape of the heat conductive plate may include with a heat dissipating element as required. The heat conductive glue adheres to a heat conductive medium for achieving the object of high heat dissipation and low cost.
Abstract:
A vane type electric heater includes a heat generator and a vane structure, and the heat generator includes a rod, and the vane structure includes a plate and at least one heat pipe attached on a surface of the plate, and the plate includes a through hole for passing the rod, and the heat pipe surrounds the periphery of the through hole for enhancing the speed of thermal conduction and the effect of uniform temperature, so as to improve the heat output performance of the invention.
Abstract:
An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.
Abstract:
A capillary structure of a heat pipe includes a hollow pipe body and a capillary structure adhered to the inner wall of the pipe body. The main part of the pipe body is provided with at least one heated section. The capillary structure within the heated section is constituted by sintered powder, and the capillary structure within the remaining portion of the main part of the pipe body is constituted by woven web or groove. By using two different kinds of capillary structures to form the capillary structure of the inner wall of the heat pipe, the heat pipe can withstand a heat source of higher temperature, and can also be suitable for a curved pipe.
Abstract:
The present invention provides a combination heat radiator, which is a plate body formed by cutting thermal conductive material like aluminum, copper, or graphite. A plurality of spaced openings are formed by punching one side of the plate body. A connection portion is disposed on the other side of the plate body. Remaining materials of the openings are bent upwards to form a plurality of heat-radiating fins. The openings of the plate body are staggered with openings of another plate body to facilitate engagement of the two plate bodies. Complete heat-radiating fins are thus formed. The size of the connection portion can be enlarged to be directly placed on different heat-emitting devices for use. The connection portion can be bent to match the shape of a heat-radiating device, thereby enhancing practicability of the heat-radiating fins. Moreover, the production cost can be effectively reduced, and heat-radiating efficiency can be greatly enhanced.