公开(公告)号：US6060372A

公开(公告)日：2000-05-09

申请号：US823286

申请日：1997-03-21

申请人： Michael C. Smayling ,  Alister C. Young ,  John A. Rodriguez ,  Jihong Chen

发明人： Michael C. Smayling ,  Alister C. Young ,  John A. Rodriguez ,  Jihong Chen

IPC分类号： H01L21/28 ,  H01L21/762 ,  H01L21/8234 ,  H01L21/822 ,  H01L21/265

CPC分类号： H01L21/28123 ,  H01L21/76216 ,  H01L21/823481

摘要： A semiconductor device (10) of the present invention has a gate (32) insulatively disposed above the substrate, source and drain regions (36, 38) disposed near the surface in the substrate adjacent opposite sides of the gate (32), and a field oxide region (26) disposed in the surface of the substrate surrounding the source and drain regions (36, 38) and defining an active moat region (20). The channel stop region (24) is disposed below the field oxide region (26) and is spaced from the active moat region (20) with a predetermined spacing.

摘要翻译： 本发明的半导体器件（10）具有绝缘地设置在衬底之上的栅极（32），源极和漏极区域（36,38）设置在邻近栅极（32）的相对侧的衬底中的表面附近，以及 设置在围绕源极和漏极区域（36,38）的基板的表面中并且限定活动的护城河区域（20）的场氧化物区域（26）。 通道停止区域（24）设置在场氧化物区域（26）的下方，并且以预定的间隔与活动的护壕区域（20）间隔开。

公开(公告)号：US20090140266A1

公开(公告)日：2009-06-04

申请号：US11948081

申请日：2007-11-30

申请人： Yong Liu ,  Timwah Luk ,  Zhongfa Yuan ,  Alister C. Young

发明人： Yong Liu ,  Timwah Luk ,  Zhongfa Yuan ,  Alister C. Young

IPC分类号： H01L31/12 ,  H01L23/495 ,  H01L21/60 ,  H01L33/00

CPC分类号： H01L31/12 ,  H01L25/167 ,  H01L31/18 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014

摘要： An package such as an optocoupler package is disclosed. The optocoupler package includes a leadframe structure comprising a first die attach pad comprising a first die attach pad surface and a second die attach pad with a second die attach pad surface. The optocoupler package further has an optical emitter device on the first die attach pad, and an optical receiver device on second die attach pad. The optical receiver device is oriented at an angle with respect to the optical emitter device, and an optically transmissive medium is disposed between the optical emitter device and the optical receiver device.

摘要翻译： 公开了诸如光耦合器封装的封装。 光耦合器封装包括引线框架结构，其包括第一管芯附接焊盘，其包括第一管芯附接焊盘表面和具有第二管芯附接焊盘表面的第二管芯附接焊盘。 光耦合器封装还在第一管芯附着焊盘上具有光发射器件，以及在第二管芯附接焊盘上的光接收器件。 光接收器件相对于光发射器件成一角度定向，并且光学透射介质设置在光发射器件和光接收器件之间。