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公开(公告)号：US20090149021A1
公开(公告)日：2009-06-11
申请号：US11954158
申请日：2007-12-11
申请人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Amir Salehi , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , James M. Crowder , Jeffrey J. VanNorden , Jonathan N. Urquhart
发明人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Amir Salehi , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , James M. Crowder , Jeffrey J. VanNorden , Jonathan N. Urquhart
IPC分类号： H01L21/44
CPC分类号： H01L23/42 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Embodiments of a method for applying a thermal-interface material are described. During this method, a first surface of a heat-removal device and a second surface of a semiconductor die are prepared. Next, a region on a given surface, which is at least one of the first surface and the second surface, is defined. Then, the thermal-interface material is applied to at least the region, where the thermal-interface material includes a material that is a liquid metal over a range of operating temperatures of the semiconductor die.
摘要翻译： 描述了用于施加热界面材料的方法的实施例。 在该方法中，制备散热装置的第一表面和半导体管芯的第二表面。 接下来，定义作为第一表面和第二表面中的至少一个的给定表面上的区域。 然后，将热界面材料施加到至少该区域，其中热界面材料在半导体管芯的工作温度范围内包括作为液态金属的材料。
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公开(公告)号：US20090146294A1
公开(公告)日：2009-06-11
申请号：US11954159
申请日：2007-12-11
申请人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , Yves C. Martin , Theodore G. Van Kessel
发明人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson , Yves C. Martin , Theodore G. Van Kessel
IPC分类号： H01L23/46
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Embodiments of an apparatus are described. This apparatus includes a semiconductor-die layer mechanically coupled to a semiconductor die, and a heat-removal-device layer mechanically coupled to a heat-removal device. Moreover, a thermal-interface material is included between the semiconductor die and the heat-removal device, where the thermal-interface material is mechanically coupled to a region of the semiconductor-die layer and to a region of the heat-removal-device layer. Additionally, a boundary material is mechanically coupled to the semiconductor-die layer and the heat-removal-device layer, where the thermal-interface material is contained in a cavity defined, at least in part, by the semiconductor-die layer, the boundary material, and the heat-removal-device layer.
摘要翻译： 描述装置的实施例。 该装置包括机械地耦合到半导体管芯的半导体管芯层，以及机械耦合到散热装置的散热装置层。 此外，在半导体管芯和散热装置之间包括热界面材料，其中热界面材料机械耦合到半导体管芯层的区域和散热装置层的区域 。 另外，边界材料机械耦合到半导体管芯层和除热器件层，其中热界面材料包含在至少部分由半导体管芯层限定的空腔中，边界 材料和除热装置层。
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3.发明申请STORAGE SYSTEM FOR COMPONENTS INCORPORATING A LIQUID-METAL THERMAL INTERFACE 审中-公开配有液体金属热界面的组件的存储系统公开(公告)号：US20090145802A1
公开(公告)日：2009-06-11
申请号：US11954156
申请日：2007-12-11
申请人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson
发明人： Michael D. Hillman , Gregory L. Tice , Oscar Woo , Richard Lidio Blanco, JR. , Ronald J. Smith , Sean A. Bailey , Anwyl M. McDonald , Clayton R. Anderson
CPC分类号： H01L23/42 , H01L23/26 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： Embodiments of an apparatus that functions as a storage system for components are described. This apparatus includes a containment vessel enclosing a desiccant and a device. This device includes a layer mechanically coupled to a component, where the component can be one of a semiconductor die and a heat-removal device. Moreover, a thermal-interface material is coupled to a region of the layer, and a boundary material is mechanically coupled to the layer, where a perimeter defined by the boundary-material surrounds the region.
摘要翻译： 描述用作组件的存储系统的装置的实施例。 该装置包括封闭干燥剂的容器和装置。 该装置包括机械耦合到部件的层，其中部件可以是半导体管芯和散热装置之一。 此外，热界面材料耦合到层的区域，并且边界材料机械地耦合到层，其中由边界材料限定的周界围绕该区域。
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公开(公告)号：US20110228482A1
公开(公告)日：2011-09-22
申请号：US13151144
申请日：2011-06-01
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译： 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。
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公开(公告)号：US20100246133A1
公开(公告)日：2010-09-30
申请号：US12415760
申请日：2009-03-31
申请人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
发明人： Chad C. Schmidt , Richard Lidio Blanco, JR. , Douglas L. Heirich , Michael D. Hillman , Phillip L. Mort , Jay S. Nigen , Gregory L. Tice
CPC分类号： H01L23/367 , H01L23/42 , H01L24/32 , H01L2224/32057 , H01L2224/73253 , H01L2224/83385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/10158 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19043
摘要： Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
摘要翻译： 本发明的实施例提供一种用于分配热界面材料的系统。 该系统包括：集成电路芯片; 散热器 以及集成电路芯片和散热器之间的兼容热界面材料（TIM）。 在组装系统期间，散热器的配合表面和集成电路芯片的配合表面被成形为当TIM被按压在散热器的配合表面和相应的配合表面之间时以预定图案分布 集成电路芯片。
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公开(公告)号：US20090316359A1
公开(公告)日：2009-12-24
申请号：US12141295
申请日：2008-06-18
CPC分类号： H05K7/20336 , F28D15/0275 , F28D2015/0216 , F28F2013/006
摘要： Embodiments of a heat-transfer mechanism are described. This heat-transfer mechanism includes a first heatpipe having a first end and a second end, and a second heatpipe having a third end and a fourth end. Moreover, a heatpipe coupler is thermally coupled to the second end of the first heatpipe and the third end of the second heatpipe. This heatpipe coupler includes a housing surrounding a cavity and a liquid metal contained within the cavity, thereby providing a thermal path from the first end of the first heatpipe, which is configured to couple to a condenser, to the fourth end of the second heatpipe, which is configured to couple to an evaporator.
摘要翻译： 对传热机构的实施例进行说明。 该传热机构包括具有第一端和第二端的第一热管和具有第三端和第四端的第二热管。 此外，热管联接器热耦合到第一热管的第二端和第二热管的第三端。 该热管联接器包括围绕空腔的壳体和容纳在空腔内的液体金属，从而提供从第一热管的第一端（其被配置为连接到冷凝器）到第二热管的第四端的热路径， 其配置成耦合到蒸发器。
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公开(公告)号：US20090044407A1
公开(公告)日：2009-02-19
申请号：US12244192
申请日：2008-10-02
IPC分类号： B21D53/02
CPC分类号： H01L23/433 , H01L23/42 , H01L2924/0002 , H01L2924/10158 , Y10T29/49126 , Y10T29/49128 , Y10T29/49169 , Y10T29/4935 , H01L2924/00
摘要： A thermal contact arrangement. The thermal contact arrangement may mitigate or reduce migration over time of a thermal interface material positioned between a chip and a heat sink. The thermal contact arrangement may include a first zone formed on a first area of the heat sink and a second zone formed on a second area of the heat sink. The processor may overlap or overlie the first zone, with the second zone generally outside the footprint of the processor and optionally surrounding the processor's footprint. The first zone may have a generally smooth surface, while the second zone may have a surface rougher than the first zone. The first zone may be finished to a specific smoothness while the second zone may be finished to second particular smoothness that is generally less than the first zone.
摘要翻译： 热接触布置。 热接触布置可以减轻或减少位于芯片和散热器之间的热界面材料随时间的迁移。 热接触装置可以包括形成在散热器的第一区域上的第一区域和形成在散热器的第二区域上的第二区域。 处理器可以与第一区域重叠或覆盖，其中第二区域通常在处理器的占位面积之外，并且可选地围绕处理器的占用面积。 第一区域可以具有大致平滑的表面，而第二区域可以具有比第一区域更粗糙的表面。 第一区域可以完成到特定的平滑度，而第二区域可以被完成为通常小于第一区域的第二特定平滑度。
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