公开(公告)号：US08703574B2

公开(公告)日：2014-04-22

申请号：US13140531

申请日：2009-12-08

申请人： Michael Gaynor ,  Brian Collins

发明人： Michael Gaynor ,  Brian Collins

IPC分类号： H01L21/76

CPC分类号： H01L23/66 ,  H01L21/565 ,  H01L23/3107 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01Q1/2283 ,  H01L2924/00

摘要： There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as an antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.

摘要翻译： 公开了至少包括嵌入在非导电模制材料中的集成电路的封装。 模制材料在其至少一个表面上包括至少一个模制图案，以及图案中的至少一个导电轨迹。 还提供了电连接至少一个导电轨道的至少两个部分之间的至少一个电容，电感或电流元件。 导电轨道可以配置为天线，电容，电感或电流分量用于调整天线的调谐和其他特性。

公开(公告)号：US20110291233A1

公开(公告)日：2011-12-01

申请号：US13140531

申请日：2009-12-08

申请人： Michael Gaynor ,  Brian Collins

发明人： Michael Gaynor ,  Brian Collins

IPC分类号： H01L29/02 ,  H01L21/56

CPC分类号： H01L23/66 ,  H01L21/565 ,  H01L23/3107 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01Q1/2283 ,  H01L2924/00

摘要： There is disclosed a package comprising at least an integrated circuit embedded in an electrically non-conductive moulded material. The moulded material includes at least one moulded pattern on at least one surface thereof, and at least one electrically conductive track in the pattern. There is further provided at least one capacitive, inductive or galvanic component electrically connecting between at least two parts of the at least one electrically conductive track. The conductive track can be configured as an antenna, and the capacitive, inductive or galvanic component is used to adjust tuning and other characteristics of the antenna.

摘要翻译： 公开了至少包括嵌入在非导电模制材料中的集成电路的封装。 模制材料在其至少一个表面上包括至少一个模制图案，以及图案中的至少一个导电轨迹。 还提供了电连接至少一个导电轨道的至少两个部分之间的至少一个电容，电感或电流元件。 导电轨道可以配置为天线，电容，电感或电流分量用于调整天线的调谐和其他特性。

公开(公告)号：US20110240187A1

公开(公告)日：2011-10-06

申请号：US13042353

申请日：2011-03-07

申请人： Michael Gaynor

发明人： Michael Gaynor

IPC分类号： B67D1/08 ,  B65D65/22

CPC分类号： B67D1/0872

摘要： A handle cover to indicate that a container holding a consumable such as beer is empty or “tapped out.” The cover is made of a flexible material such as neoprene to permit the cover to fit over beer tap handles of various shapes. The outer surface of the cover may be colored or printed with indicators to inform patrons of the establishment where the beer tap is being used that the draft beer is empty or tapped out, or another status of the keg associated with the beer tap.

摘要翻译： 指示容纳诸如啤酒的消费品的容器是空的或“轻敲”的手柄盖。盖由诸如氯丁橡胶的柔性材料制成，以允许盖适合各种形状的啤酒桶手柄。 盖子的外表面可以是彩色的或印有指示器以通知啤酒桶被使用的场所的用户，啤酒啤酒是空的或抽出的，或与啤酒水龙头相关的小桶的另一状态。

公开(公告)号：US20070176287A1

公开(公告)日：2007-08-02

申请号：US10812274

申请日：2004-03-29

申请人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

发明人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/66 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

摘要翻译： 一种半导体封装，其包括限定相对的顶部和底部膜表面的非导电膜，并且包括设置在其中的多个通孔。 设置在顶部薄膜表面上的是多个上引线，其绕过各个通孔。 类似地，设置在底部薄膜表面上的是多个下引线，其围绕相应的通孔并电连接到相应的上引线。 至少一个传输线元件也设置在顶部膜表面上并电连接到至少一个上部引线。 连接到顶部膜表面并电连接到上引线和传输线元件中的至少一个是至少一个半导体管芯。 封装体至少部分地覆盖半导体管芯，上部引线，传输线元件和顶部膜表面。

公开(公告)号：US20050004808A1

公开(公告)日：2005-01-06

申请号：US10612653

申请日：2003-07-02

申请人： Michael Gaynor ,  Scott Waterbury

发明人： Michael Gaynor ,  Scott Waterbury

IPC分类号： G06Q30/00 ,  G06F7/00

CPC分类号： G06Q30/06 ,  G06Q20/204 ,  G06Q30/0611 ,  Y10S707/99931 ,  Y10S707/99933 ,  Y10S707/99939

摘要： A system and method for distributing a plurality of electronic articles is provided. Articles are received from a plurality of users and stored retrievably in memory. A request is received for the purchase of an article from one of a plurality of users. An electronic funding account associated with the one of a plurality of users is debited, and the article is transmitted to the one of the plurality of users.

摘要翻译： 提供一种用于分发多个电子物品的系统和方法。 文章从多个用户接收并且被可检索地存储在存储器中。 接收到用于从多个用户之一购买物品的请求。 与多个用户中的一个相关联的电子资金帐户被借记，并且将文章发送给多个用户中的一个。