公开(公告)号：US20070176287A1

公开(公告)日：2007-08-02

申请号：US10812274

申请日：2004-03-29

申请人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

发明人： Sean Crowley ,  Ludovico Bancod ,  Terry Davis ,  Robert Darveaux ,  Michael Gaynor

IPC分类号： H01L23/34

CPC分类号： H01L23/3121 ,  H01L23/66 ,  H01L24/28 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising a non-conductive film which defines opposed top and bottom film surfaces and includes a plurality of vias disposed therein. Disposed on the top film surface is a plurality of upper leads which circumvent respective ones of the vias. Similarly, disposed on the bottom film surface is a plurality of lower leads which circumvent respective ones of the vias and are electrically connected to respective ones of the upper leads. At least one transmission line element is also disposed on the top film surface and electrically connected to at least one of the upper leads. Attached to the top film surface and electrically connected to at least one of the upper leads and the transmission line element is at least one semiconductor die. A package body at least partially covers the semiconductor die, the upper leads, the transmission line element, and the top film surface.

摘要翻译： 一种半导体封装，其包括限定相对的顶部和底部膜表面的非导电膜，并且包括设置在其中的多个通孔。 设置在顶部薄膜表面上的是多个上引线，其绕过各个通孔。 类似地，设置在底部薄膜表面上的是多个下引线，其围绕相应的通孔并电连接到相应的上引线。 至少一个传输线元件也设置在顶部膜表面上并电连接到至少一个上部引线。 连接到顶部膜表面并电连接到上引线和传输线元件中的至少一个是至少一个半导体管芯。 封装体至少部分地覆盖半导体管芯，上部引线，传输线元件和顶部膜表面。

公开(公告)号：US06807218B1

公开(公告)日：2004-10-19

申请号：US10144905

申请日：2002-05-13

申请人： Jonathon Greenwood ,  Robert Darveaux ,  Jicheng Yang

发明人： Jonathon Greenwood ,  Robert Darveaux ,  Jicheng Yang

IPC分类号： H01S304

CPC分类号： H01S5/02248 ,  G02B6/262 ,  G02B6/4214 ,  H01L31/167 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01S5/02252 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02284 ,  H01S5/02292 ,  H01S5/02415 ,  H01S5/0683 ,  H01L2224/05599

摘要： A laser module includes an alignment plate having a template plate having a laser diode aperture and a photodiode aperture. A weld plate and a reflector are coupled to the template plate. The structure further includes a heat sink coupled to the alignment plate. A photodiode subassembly is mounted within the photodiode aperture and to the heat sink. Further, a laser diode subassembly is mounted within the laser diode aperture and to the heat sink. In the above manner, the photodiode subassembly, laser diode subassembly and reflected are precisely aligned.

摘要翻译： 激光模块包括具有模板板的对准板，其具有激光二极管孔径和光电二极管孔径。 焊接板和反射器耦合到模板板。 该结构还包括耦合到对准板的散热器。 光电二极管子组件安装在光电二极管孔和散热片内。 此外，激光二极管子组件安装在激光二极管孔和散热片内。 以上述方式，光电二极管组件，激光二极管组装和反射精确对准。