公开(公告)号：US20050266607A1

公开(公告)日：2005-12-01

申请号：US10856371

申请日：2004-05-27

申请人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Hui Lee ,  Altaf Hasan

发明人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Hui Lee ,  Altaf Hasan

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/60 ,  H01L21/673

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

摘要翻译： 一种包装方法包括在加工过程中将限制器放置在包装上。 该方法包括将限制器固定就位，然后将包装暴露于高温。 处理后，限制器被移除。 替代方法将组件模具附接到在第一表面中具有腔的衬底。 然后，该方法可以包括在空腔中分配和固化底部填充材料，以及将盖附接到基底的第一表面。

公开(公告)号：US20070155059A1

公开(公告)日：2007-07-05

申请号：US11687154

申请日：2007-03-16

申请人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Lee ,  Altaf Hasan

发明人： Michael Lee ,  Mun Loke ,  Soon Ong ,  Hooi Teng ,  Lisa Lee ,  Altaf Hasan

IPC分类号： H01L21/00 ,  H01L23/12

CPC分类号： H01L21/563 ,  H01L21/50 ,  H01L21/6735 ,  H01L23/04 ,  H01L23/055 ,  H01L23/562 ,  H01L24/28 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81001 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/00

摘要： A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.