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1.发明申请METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES 有权用于制造具有空气介质和相关电气结构的电气结构的方法公开(公告)号：US20130087365A1
公开(公告)日：2013-04-11
申请号：US13253388
申请日：2011-10-05
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
CPC分类号： H01P3/121 , H01L21/4846 , H01L23/498 , H01L23/66 , H01L2223/6627 , H01L2924/0002 , H05K3/4614 , H05K3/4697 , H05K2201/0141 , H05K2203/016 , H05K2203/308 , H01L2924/00
摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。
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2.发明授权Method for making electrical structure with air dielectric and related electrical structures 有权用空气电介质和相关电气结构制造电气结构的方法公开(公告)号：US09142497B2
公开(公告)日：2015-09-22
申请号：US13253388
申请日：2011-10-05
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
IPC分类号： H05K3/36 , H05K3/46 , H01L23/498 , H01L21/48 , H01L23/66
CPC分类号： H01P3/121 , H01L21/4846 , H01L23/498 , H01L23/66 , H01L2223/6627 , H01L2924/0002 , H05K3/4614 , H05K3/4697 , H05K2201/0141 , H05K2203/016 , H05K2203/308 , H01L2924/00
摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.
摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。
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公开(公告)号：US20130120095A1
公开(公告)日：2013-05-16
申请号：US13293671
申请日：2011-11-10
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, JR. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0006 , H01F41/041 , H01F2017/0046 , H01F2017/0073 , H05K1/165 , H05K3/146 , H05K3/16 , H05K3/20 , H05K2201/0141 , H05K2201/0305 , H05K2201/1003 , H05K2203/016 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075
摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
摘要翻译： 一种制造电感器的方法。 该方法包括形成具有牺牲衬底的第一子单元和限定电感器并且在牺牲衬底上包括第一金属的导电层。 该方法包括形成具有电介质层和导电层的第二子单元，其上限定电感器端子并具有第一金属，并且将第二金属涂覆到第一和第二子单元之一的第一金属上。 该方法包括将第一和第二子单元对齐在一起，加热和压缩对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基板。
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公开(公告)号：US08539666B2
公开(公告)日：2013-09-24
申请号：US13293671
申请日：2011-11-10
申请人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
发明人： Michael Raymond Weatherspoon , Louis Joseph Rendek, Jr. , Lawrence Wayne Shacklette , Robert Patrick Maloney , David M. Smith
IPC分类号： H01F7/06
CPC分类号： H01F27/2804 , H01F5/00 , H01F17/0006 , H01F41/041 , H01F2017/0046 , H01F2017/0073 , H05K1/165 , H05K3/146 , H05K3/16 , H05K3/20 , H05K2201/0141 , H05K2201/0305 , H05K2201/1003 , H05K2203/016 , Y10T29/4902 , Y10T29/49071 , Y10T29/49073 , Y10T29/49075
摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.
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公开(公告)号：US07286095B2
公开(公告)日：2007-10-23
申请号：US11156684
申请日：2005-06-20
IPC分类号： H01Q13/00
摘要： The discone antenna includes a conical antenna element, having an apex, and a disc antenna element adjacent the apex of the conical antenna element. An inverted antenna feed structure, such as a flanged coaxial connector or coaxial cable, is connected to the disc and conical antenna elements and extends outwardly from the disc antenna element on a side thereof opposite the apex of the conical antenna element. The discone antenna with such an inverted feed structure facilitates an inverted positioning, for example, on vehicles, rooftops and/or control towers, etc., that will increase the bandwidth pattern in the direction of the potential target.
摘要翻译： 盘状天线包括具有顶点的锥形天线元件和与锥形天线元件的顶点相邻的盘状天线元件。 诸如法兰同轴连接器或同轴电缆的倒置天线馈电结构连接到盘和锥形天线元件，并且在与圆锥形天线元件的顶点相对的一侧上从盘形天线元件向外延伸。 具有这种反向进给结构的偏振器天线有助于例如在车辆，屋顶和/或控制塔等上的倒置定位，这将增加潜在目标方向上的带宽图案。
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公开(公告)号：US07495629B2
公开(公告)日：2009-02-24
申请号：US11265698
申请日：2005-11-02
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/38
摘要： A microstrip slot dipole antenna of the inverted F type, includes a coplanar feed, and is suitable for easy peel-and-stick adhesive mounting. The antenna includes a ground plane, a dielectric layer, a horizontal element and a pair of spaced apart vertical elements depending therefrom defining an inverted F antenna above the ground plane with the dielectric layer therebetween. The pair of vertical elements may be conductive vias. A first antenna feed point is on an upper surface of the horizontal element, and a second antenna feed point is on an upper surface of a second vertical element of the spaced apart vertical elements. The second feed point may be a conductive pad on the dielectric layer spaced apart from a first vertical element and insulated from the horizontal element.
摘要翻译： 倒F型微带槽偶极天线包括共面馈电，适用于易于剥离和粘贴胶粘剂。 天线包括接地平面，电介质层，水平元件和一对间隔开的垂直元件，从而在接地平面之上限定了倒置的F天线，其间具有介电层。 该对垂直元件可以是导电通孔。 第一天线馈电点在水平元件的上表面上，第二天线馈电点位于间隔开的垂直元件的第二垂直元件的上表面上。 第二馈电点可以是介电层上与第一垂直元件隔开并与水平元件绝缘的导电焊盘。
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