公开(公告)号：US20130087365A1

公开(公告)日：2013-04-11

申请号：US13253388

申请日：2011-10-05

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H05K1/02 ,  H05K3/00 ,  B23K31/00

CPC分类号： H01P3/121 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2203/016 ,  H05K2203/308 ,  H01L2924/00

摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。

公开(公告)号：US09142497B2

公开(公告)日：2015-09-22

申请号：US13253388

申请日：2011-10-05

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H05K3/36 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC分类号： H01P3/121 ,  H01L21/4846 ,  H01L23/498 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2924/0002 ,  H05K3/4614 ,  H05K3/4697 ,  H05K2201/0141 ,  H05K2203/016 ,  H05K2203/308 ,  H01L2924/00

摘要： A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric.

摘要翻译： 已经描述了一种用于制造具有空气电介质的电结构的方法，并且包括形成包括牺牲衬底的第一子单元，在牺牲衬底上包括第一金属的导电层和牺牲衬底上的牺牲电介质层， 导电层。 该方法还包括在其上形成包括电介质层和其上的导电层的第二子单元，其上包括第一金属，并且将第二金属涂覆到第一和第二子单元中的一个或多个的第一金属上。 该方法还包括将第一和第二子单元对齐在一起，加热和压制对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基底和牺牲介电层从而形成 电气结构具有空气电介质。

公开(公告)号：US20130120095A1

公开(公告)日：2013-05-16

申请号：US13293671

申请日：2011-11-10

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H01F5/00 ,  H01F7/06

CPC分类号： H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

摘要翻译： 一种制造电感器的方法。 该方法包括形成具有牺牲衬底的第一子单元和限定电感器并且在牺牲衬底上包括第一金属的导电层。 该方法包括形成具有电介质层和导电层的第二子单元，其上限定电感器端子并具有第一金属，并且将第二金属涂覆到第一和第二子单元之一的第一金属上。 该方法包括将第一和第二子单元对齐在一起，加热和压缩对准的第一和第二子单元以形成将相邻金属部分粘合在一起的第一和第二金属的金属间化合物，以及去除牺牲基板。

公开(公告)号：US08539666B2

公开(公告)日：2013-09-24

申请号：US13293671

申请日：2011-11-10

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Robert Patrick Maloney ,  David M. Smith

IPC分类号： H01F7/06

CPC分类号： H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

摘要： A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

公开(公告)号：US08904632B2

公开(公告)日：2014-12-09

申请号：US13242155

申请日：2011-09-23

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, Jr. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

IPC分类号： H01K3/10 ,  H05K3/46 ,  H05K3/42

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。

公开(公告)号：US20130075137A1

公开(公告)日：2013-03-28

申请号：US13242155

申请日：2011-09-23

申请人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

发明人： Michael Raymond Weatherspoon ,  Louis Joseph Rendek, JR. ,  Lawrence Wayne Shacklette ,  Casey P. Rodriguez

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K3/36 ,  H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/09 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4614 ,  H05K2201/0141 ,  H05K2201/09545 ,  H05K2203/061 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together.

摘要翻译： 一种用于从电路板层制造多层电路板的方法，每个电路板包括介电层和其上包括第一金属的导电迹线。 该方法包括在第一电路板层中形成通孔，将通孔与第一金属电镀，并将第二金属涂覆在第一电路板层的第一金属上，镀通孔和第一金属 金属。 该方法还包括将第一和第二电路板层对准在一起，使得第一电路板层的电镀通孔与第二电路板层上的特征相邻，并且加热并压紧对准的第一和第二电路板层 以将电介质层层叠在一起，并将相邻的金属部分结合在一起的第一和第二金属的金属间化合物。

公开(公告)号：US08708576B2

公开(公告)日：2014-04-29

申请号：US13010422

申请日：2011-01-20

申请人： Lawrence Wayne Shacklette ,  Michael Ray Lange ,  Michael Raymond Weatherspoon ,  Gary M. Singer

发明人： Lawrence Wayne Shacklette ,  Michael Ray Lange ,  Michael Raymond Weatherspoon ,  Gary M. Singer

IPC分类号： G02B6/42 ,  G02B6/12 ,  G02B6/43

CPC分类号： G02B6/42 ,  G02B6/4206 ,  G02B6/4212 ,  G02B6/4214 ,  G02B6/43

摘要： An electro-optical device may include a substrate having opposing first and second surfaces and an opening extending therebetween. The optical device may also include an optical waveguide extending laterally along the first surface and having an end aligned with the opening, and an electro-optical component carried by the second surface and aligned with the opening. The electro-optical device may further include an elastomeric body within the opening and having a first end face adjacent the optical waveguide and having a second end face adjacent the electro-optical component. The elastomeric body and the optical waveguide may have respective gradient refraction indices within ±5% of each other.

摘要翻译： 电光装置可以包括具有相对的第一和第二表面的基板和在它们之间延伸的开口。 光学装置还可以包括沿着第一表面横向延伸并且具有与开口对准的端部的光波导和由第二表面承载并与开口对准的电光部件。 电光装置还可以包括在开口内的弹性体，并且具有邻近光波导的第一端面，并且具有与电光部件相邻的第二端面。 弹性体和光波导可以具有在彼此的±5％以内的相应的梯度折射率。

公开(公告)号：US08559774B2

公开(公告)日：2013-10-15

申请号：US13076563

申请日：2011-03-31

申请人： Lawrence Wayne Shacklette ,  Glenroy Weimar ,  Michael Raymond Weatherspoon

发明人： Lawrence Wayne Shacklette ,  Glenroy Weimar ,  Michael Raymond Weatherspoon

IPC分类号： G02B6/26 ,  G02B6/42

CPC分类号： G02B6/3522 ,  G02B6/3548 ,  G02B6/357 ,  G02B6/3572 ,  G02B6/3596

摘要： An optical device may include a substrate and an optical waveguide carried by the substrate and having a notch therein defining a feed optical waveguide and a longitudinal optical waveguide section on opposite longitudinal sides of the notch. The optical device may also include a transverse optical waveguide section carried by the substrate and transversely aligned with the feed optical waveguide adjacent the notch. The optical device may further include an elastomeric waveguide switch body configured to be moved between a first position within the notch and operative to switch light from the feed optical waveguide to the longitudinal optical waveguide section, and a second position removed from the notch and operative to switch light from the optical waveguide to the transverse optical waveguide section.

摘要翻译： 光学装置可以包括衬底和由衬底承载的光波导，并且在其中限定了馈电光波导的凹口和在凹口的相对的纵向侧上的纵向光波导部分。 光学器件还可以包括由衬底承载的横向光波导部分，并且与邻近切口的进给光波导横向对准。 光学装置还可以包括弹性体波导开关主体，其构造成在凹口内的第一位置之间移动并且可操作以将来自进给光波导的光切换到纵向光波导部分，以及从凹口移除的第二位置， 将光从光波导切换到横向光波导部。

公开(公告)号：US08231281B2

公开(公告)日：2012-07-31

申请号：US12610410

申请日：2009-11-02

申请人： Lawrence Wayne Shacklette ,  Michael Raymond Weatherspoon

发明人： Lawrence Wayne Shacklette ,  Michael Raymond Weatherspoon

IPC分类号： G02B6/00 ,  G02B6/38 ,  B29D11/00 ,  B21D39/03 ,  B23P25/00

CPC分类号： G02B6/138 ,  G02B6/32 ,  G02B6/3506 ,  G02B6/3522 ,  G02B6/382

摘要： A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The interconnection may further include a first index matching elastomeric solid layer having a proximal face coupled to the first end face, and a distal face opposite the proximal face to be repeatably optically coupled to the second end face. The first index matching elastomeric solid layer may have an index of refraction profile matching an index of refraction of the core and the cladding.

摘要翻译： 可重复的光波导互连可以包括具有相应的第一和第二端面的第一和第二光波导。 第一和第二光波导中的每一个可以包括具有纤芯折射率的芯和围绕芯的包层，并且具有不同于芯折射率的包层折射率。 互连可以进一步包括具有耦合到第一端面的近端面的第一折射率匹配弹性体固体层和与近侧面相对的远侧面以可重复地光耦合到第二端面。 第一折射率匹配弹性体固体层可以具有与芯和包层的折射率匹配的折射率分布。

公开(公告)号：US20110103745A1

公开(公告)日：2011-05-05

申请号：US12610404

申请日：2009-11-02

申请人： Lawrence Wayne Shacklette ,  Michael Raymond Weatherspoon

发明人： Lawrence Wayne Shacklette ,  Michael Raymond Weatherspoon

IPC分类号： G02B6/38 ,  G02B6/00

CPC分类号： G02B6/382 ,  G02B6/138 ,  G02B6/3506 ,  G02B6/3522 ,  Y10T29/49826

摘要： A repeatable optical waveguide interconnection may include first and second optical waveguides having respective first and second end faces. Each of the first and second optical waveguides may include a core having a core index of refraction, and a cladding surrounding the core and having a cladding index of refraction different than the core index of refraction. The repeatable optical waveguide interconnection may further include a first index matching elastomeric solid layer having a proximal face chemically bound to the first end face and a low-tack distal face opposite the proximal face to be repeatably optically coupled to the second end face. Further, the first index matching elastomeric solid layer may have an index of refraction matching at least the index of refraction of the core.

摘要翻译： 可重复的光波导互连可以包括具有相应的第一和第二端面的第一和第二光波导。 第一和第二光波导中的每一个可以包括具有纤芯折射率的芯和围绕芯的包层，并且具有不同于芯折射率的包层折射率。 可重复的光波导互连还可以包括具有化学键合到第一端面的近端面的第一折射率匹配弹性体固体层和与近端面相对的低粘性远端面，以可重复地光耦合到第二端面。 此外，第一折射率匹配弹性体固体层可以具有至少匹配芯的折射率的折射率。