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1.发明授权Materials and structure for a high reliability bga connection between LTCC and PB boards 有权LTCC和PB板之间的高可靠性bga连接的材料和结构公开(公告)号：US06800815B1
公开(公告)日：2004-10-05
申请号：US10051984
申请日：2002-01-15
IPC分类号： H05K111
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L2224/0401 , H01L2224/05571 , H01L2224/10126 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/113 , H05K3/248 , H05K3/3452 , H05K3/3457 , H05K3/4061 , H05K2201/017 , H05K2201/035 , H05K2201/09909 , Y10T29/49149 , Y10T29/49165 , H01L2924/00012 , H01L2224/05552
摘要： A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.
摘要翻译： 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。
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2.发明授权Materials and structure for a high reliability BGA connection between LTCC and PB boards 有权LTCC和PB板之间的高可靠性BGA连接的材料和结构公开(公告)号：US07287323B1
公开(公告)日：2007-10-30
申请号：US10837015
申请日：2004-04-30
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49822 , H01L2224/0401 , H01L2224/05571 , H01L2224/10126 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K1/113 , H05K3/248 , H05K3/3452 , H05K3/3457 , H05K3/4061 , H05K2201/017 , H05K2201/035 , H05K2201/09909 , Y10T29/49149 , Y10T29/49165 , H01L2924/00012 , H01L2224/05552
摘要： A ceramic circuit structure comprising a plurality of ceramic layers and at least one electronic component embedded within the plurality of ceramic layers. Within a first one of the ceramic layers is a via that passes through the ceramic layer. A contact pad is formed on a surface of the ceramic layer. A barrier cap is formed between the via and the contact pad. A dielectric ring covers a peripheral portion of the contact pad and an adjacent portion of the dielectric material layer surface immediately surrounding the contact pad, such that any solder that is applied to the contact does not contact the peripheral portion of the contact pad or the ceramic material.
摘要翻译： 一种陶瓷电路结构，包括多个陶瓷层和至少一个嵌入在所述多个陶瓷层内的电子部件。 在第一陶瓷层之中的是通过陶瓷层的通孔。 在陶瓷层的表面上形成接触垫。 在通孔和接触垫之间形成阻挡帽。 介电环覆盖接触焊盘的周边部分和电介质材料层表面的相邻部分，其紧邻围绕接触焊盘，使得施加到接触件的任何焊料不接触接触焊盘或陶瓷的周边部分 材料。
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