公开(公告)号：US4273393A

公开(公告)日：1981-06-16

申请号：US76975

申请日：1979-09-20

申请人： Michael S. Foley ,  Mark V. Pierson

发明人： Michael S. Foley ,  Mark V. Pierson

IPC分类号： H05K13/00 ,  B23P19/00 ,  B65G1/04 ,  B65G1/06 ,  B65G1/10 ,  B65G1/133 ,  B65G59/06 ,  A47F5/02 ,  H05K13/04

CPC分类号： B65G1/045 ,  B65G1/10 ,  Y10T29/515

摘要： A dispensing device for small parts arranged in a compact shape from when the parts can be withdrawn from a single point including a plurality of vertically stacked trays slidably disposed upon banks of spaced flanges which are rotatable about a central axis of the device and reciprocable in a plane parallel to the central axis. The uppermost and lowermost trays in the stack are free to rotate with the flanges and the balance of the trays are restrained from rotation so as to be disengaged from one bank of flanges and received between the planes of another bank of flanges.

摘要翻译： 一种用于小部件的分配装置，其布置成紧凑的形状，从零件可以从包括多个垂直堆叠的托盘中的单个点撤出时，该托盘可滑动地设置在间隔开的凸缘组上，该凸缘可围绕装置的中心轴线旋转， 平行于中心轴的平面。 堆叠中的最上面和最下面的托盘随着凸缘自由旋转，并且托盘的平衡被限制在旋转中，以便与一组凸缘分离并容纳在另一组凸缘的平面之间。

公开(公告)号：US4560880A

公开(公告)日：1985-12-24

申请号：US533823

申请日：1983-09-19

申请人： Paul F. Petric ,  Michael S. Foley ,  John J. Waz ,  Robert W. Milgate, III

发明人： Paul F. Petric ,  Michael S. Foley ,  John J. Waz ,  Robert W. Milgate, III

IPC分类号： H01J37/20 ,  H01J37/18 ,  H01J37/28 ,  H01J37/30 ,  H01L21/027 ,  H01L21/265 ,  H01L21/68 ,  H01J33/02

CPC分类号： H01L21/68

摘要： Apparatus for positioning a semiconductor wafer with respect to a localized vacuum envelope so as to maintain a prescribed gap between the tip of the vacuum envelope and the wafer includes an x-y table, a stage assembly movable along the z-axis for holding the wafer and a z-axis actuator assembly. The z-axis actuator assembly includes a plurality of fluid-containing bellows coupled between the x-y table and the stage assembly and a hydraulic controller operated by a linear stepper motor for varying the fluid volume in each of the bellows in response to an actuator control signal so as to move the stage assembly along the z-axis. The z-axis actuator assembly can further include a flexible disk positioned in the plane of x-y movement and coupled between the x-y table and the stage assembly for preventing lateral and rotational movement of the stage assembly relative to the x-y table. The positioning apparatus is suitable for use in an electron beam lithography system.

摘要翻译： 用于将半导体晶片相对于局部真空外壳定位以便在真空外壳和晶片的尖端之间保持规定间隙的装置包括xy台，可沿z轴移动以保持晶片的台架组件和 z轴致动器组件。 z轴致动器组件包括耦合在xy台和台组件之间的多个含流体的波纹管和由线性步进电机操作的液压控制器，用于响应于致动器控制信号改变每个波纹管中的流体体积 以使台架组件沿z轴移动。 z轴致动器组件还可以包括定位在x-y运动平面中并耦合在x-y工作台和台架组件之间的柔性盘，用于防止平台组件相对于x-y工作台的横向和旋转运动。 定位装置适用于电子束光刻系统。

公开(公告)号：US4776745A

公开(公告)日：1988-10-11

申请号：US7212

申请日：1987-01-27

申请人： Michael S. Foley

发明人： Michael S. Foley

IPC分类号： H01L21/00 ,  H01L21/677 ,  C23C13/08

CPC分类号： H01L21/6715 ,  H01L21/67784 ,  Y10S414/136 ,  Y10S414/139

摘要： A substrate handling system supplies new wafers to a vacuum chamber containing a lithography system, and outputs processed semiconductor wafers to an environment with normal atmospheric pressure. New wafers on a transplate pass by way of an air film track to a transload which feeds them from a load platform to a vacuum lock elevator. The inner door of the vacuum lock elevator opens and a completed transplate is transferred to the top shelf of the vacuum lock elevator. Next the vacuum lock elevator lifts to its upper position and the subsequent transfer of a new transplate onto a worktable occurs. There follows the closing of an inner door, (venting of the vacuum lock), the opening of an outer door, and the insertion of a new transplate from the load platform to the bottom shelf of the elevator. Finally, the completed transplate is removed. In cases where negative photoresists are used, this last step is replaced by routing the transplate to the post cure chamber for a period of up to 30 minutes.

摘要翻译： 基板处理系统将新的晶片提供到包含光刻系统的真空室中，并将经处理的半导体晶片输出到具有正常大气压的环境。 转板上的新晶片通过空气胶片轨道穿过，将其从负载平台馈送到真空锁定电梯。 真空锁定升降机的内门打开，完成的变速器被传送到真空锁定升降机的顶架。 接下来，真空锁定电梯升高到其上部位置，并且随后将新的变速器传送到工作台上。 随后关闭内门，（真空锁的排气），外门的打开，以及从负载平台插入到电梯的底架上的新的换板。 最后，完成的换板被移除。 在使用负光致抗蚀剂的情况下，最后一步是通过将传感器布置到后固化室取代长达30分钟的时间。

公开(公告)号：US4528451A

公开(公告)日：1985-07-09

申请号：US435177

申请日：1982-10-19

申请人： Paul F. Petric ,  Michael S. Foley ,  Mark W. Utlaut ,  Joseph A. Laiacano

发明人： Paul F. Petric ,  Michael S. Foley ,  Mark W. Utlaut ,  Joseph A. Laiacano

IPC分类号： H01J37/20 ,  H01J37/18 ,  H01J37/28 ,  H01J37/30 ,  H01J37/305 ,  H01J37/317 ,  H01L21/027 ,  H01L21/68 ,  H01J33/02

CPC分类号： H01J37/30 ,  H01L21/68

摘要： Apparatus for controlling the gap between localized vacuum processing envelope apparatus and a workpiece as the workpiece, typically a semiconductor wafer, is moved laterally with respect to the envelope apparatus. The envelope apparatus includes an envelope which defines an internal vacuum processing zone and a generally planar tip spaced from the workpiece during processing by the gap. The gap control apparatus includes a gap sensor for measuring the gap, a control circuit for comparing the measured gap with a required gap and generating an error signal, and an actuating means for varying the gap in response to the error signal. The gap can be sensed by sensing the pressure level in the vacuum processing apparatus. The actuating means can include a plurality of piezoelectric actuators which can vary both the gap and the angle of the workpiece with respect to the tip of the vacuum processing apparatus. The disclosed apparatus is particularly useful in connection with particle beam systems such as electron beam lithography systems. In another embodiment, the gap is controlled by an air bearing between the envelope apparatus and the workpiece.

摘要翻译： 用于控制局部真空处理包络装置和作为工件（通常为半导体晶片）的工件之间的间隙的装置相对于包络装置横向移动。 信封装置包括限定内部真空处理区域的封套和在由间隙处理期间与工件间隔开的大致平面的尖端。 间隙控制装置包括用于测量间隙的间隙传感器，用于将所测量的间隙与所需间隙进行比较并产生误差信号的控制电路，以及响应于误差信号改变间隙的致动装置。 可以通过感测真空处理装置中的压力水平来感测间隙。 致动装置可以包括多个压电致动器，其能够相对于真空处理装置的尖端改变工件的间隙和角度。 所公开的装置对于诸如电子束光刻系统的粒子束系统是特别有用的。 在另一个实施例中，间隙由包封装置和工件之间的空气轴承控制。

公开(公告)号：US4153082A

公开(公告)日：1979-05-08

申请号：US897781

申请日：1978-04-19

申请人： Michael S. Foley

发明人： Michael S. Foley

IPC分类号： B21D11/00 ,  B23P23/04 ,  H05K13/04 ,  B21F11/00

CPC分类号： H05K13/0473 ,  Y10T29/53183

摘要： The mechanism cuts component lead portions projecting from a support such as a circuit board though the leads may be spaced apart at different distances, and then clinches them against the board. Additionally, the mechanism is movable heightwise relative to the support for clearance purposes and adapted to be shifted both in X-Y directions and with selected radial orientation between preset angles. The clinching is done in opposite directions and normal to a line interconnecting the points from which the leads protrude thereby stabilizing the position of a component body.

摘要翻译： 该机构通过引线可以间隔开不同的距离来切断从诸如电路板的支撑件突出的部件引线部分，然后将它们抵靠板。 另外，该机构相对于用于间隙目的的支撑件可高度移动，并且适于在X-Y方向上移动并且在预设角度之间以选定的径向取向。 铆接在相反的方向上进行，并且垂直于互连引线突出的点的线，从而稳定部件主体的位置。

公开(公告)号：USD310025S

公开(公告)日：1990-08-21

申请号：US55778

申请日：1987-05-29

申请人： Michael S. Foley

设计人： Michael S. Foley

公开(公告)号：US4524261A

公开(公告)日：1985-06-18

申请号：US533822

申请日：1983-09-19

申请人： Paul F. Petric ,  Michael S. Foley

发明人： Paul F. Petric ,  Michael S. Foley

IPC分类号： B01J3/00 ,  H01J37/18 ,  H01J37/317 ,  H01L21/027 ,  B23K15/00

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  H01J37/18 ,  H01J37/3174 ,  H01J2237/0264 ,  H01J2237/162 ,  H01J2237/188 ,  H01J2237/2006

摘要： Localized vacuum envelope apparatus includes a housing member having a bottom plate with a downwardly extending first sleeve and an upwardly extending flange. The flange includes ports for vacuum pumping and is adapted for attachment to an electron beam column. The apparatus further includes a lower plate having a second downwardly extending sleeve and an upper plate having a third downwardly extending sleeve. The first, second and third sleeves, which can have a truncated conical shape and are concentric, define vacuum zones. Channels are provided for connecting the vacuum zones to individual ports. The tips of the sleeves are coplanar and form the tip of the vacuum envelope. A noncontacting graded vacuum seal is formed between the tip of the vacuum envelope and a workpiece. The housing member and the upper plate can be ferromagnetic material to provide double magnetic shielding.

摘要翻译： 局部真空包封装置包括具有底板的壳体构件，底板具有向下延伸的第一套筒和向上延伸的凸缘。 凸缘包括用于真空泵送的端口，并且适于附接到电子束柱。 该装置还包括具有第二向下延伸套筒的下板和具有第三向下延伸套筒的上板。 可以具有截头圆锥形并且同心的第一，第二和第三套筒限定了真空区域。 提供通道用于将真空区域连接到各个端口。 袖子的尖端是共面的并形成真空外壳的尖端。 在真空外壳的尖端和工件之间形成非接触式分级真空密封。 外壳构件和上板可以是铁磁材料，以提供双重磁屏蔽。

公开(公告)号：US4403406A

公开(公告)日：1983-09-13

申请号：US20709

申请日：1979-03-15

申请人： Michael S. Foley

发明人： Michael S. Foley

IPC分类号： H05K13/00 ,  H05K13/04 ,  B23P21/00

CPC分类号： H05K13/0053 ,  H05K13/04 ,  Y10T29/49131 ,  Y10T29/515 ,  Y10T29/53091 ,  Y10T29/53183

摘要： Equipment to visually identify insertion points to an operator of a pre-programmed, semi-automatic electronic assembly station. This equipment includes a pair of illuminators disposed at opposite ends of a cut-clinch mechanism and arranged to shine on the underside of the circuit board. The illuminators are carried by the cut-clinch mechanism and are free to move transversely and rotate axially, as the mechanism rotates and moves during the assembly steps.

摘要翻译： 用于在视觉上识别对预编程的半自动电子组装站的操作者的插入点的设备。 该设备包括一对照明器，其设置在切割机构的相对端，并布置成照射在电路板的下侧上。 照明器由剪切机构承载，并且随着机构在组装步骤中旋转和移动而自由地横向移动并且轴向旋转。