Direct mounting system for a disk drive
    1.
    发明授权
    Direct mounting system for a disk drive 失效
    用于磁盘驱动器的直接安装系统

    公开(公告)号:US06215074B1

    公开(公告)日:2001-04-10

    申请号:US08236771

    申请日:1994-04-29

    IPC分类号: H01B1724

    CPC分类号: G11B33/121 G11B33/08

    摘要: Disclosed is a disk drive for storing data which includes disks and an actuator mounted on a frame or first housing part. A second housing part, when joined with the first housing part, forms a disk enclosure. The disk enclosure includes rails which have openings therein for mounting the disk drive to the user frame of a computer system. Deformable inserts are placed into the openings in the rails and screws are passed through openings in the frame of the computer system and into the inserts in the openings in the rails of the disk drive. The inserts are more forgiving and result in less distortion than in a mounting system in which the screws are passed directly into tapped holes in the rails of the disk drive. The inserts also electrically insulate the disk drive from the user frame of the computer system.

    摘要翻译: 公开了一种用于存储包括盘和安装在框架或第一壳体部分上的致动器的数据的磁盘驱动器。 当与第一壳体部件接合时,第二壳体部件形成盘壳体。 磁盘盒包括其中具有开口的轨道,用于将磁盘驱动器安装到计算机系统的用户框架。 可变形插入件被放置在轨道中的开口中,并且螺钉穿过计算机系统的框架中的开口并进入盘驱动器的轨道中的开口中的插入件中。 插入件比在安装系统中更为宽容并且导致较少的失真,其中螺钉直接通过磁盘驱动器的轨道中的螺纹孔。 插入件还将磁盘驱动器与计算机系统的用户框架电绝缘。

    System and method for cooling a module
    2.
    发明授权
    System and method for cooling a module 有权
    冷却模块的系统和方法

    公开(公告)号:US07558066B2

    公开(公告)日:2009-07-07

    申请号:US12044015

    申请日:2008-03-07

    IPC分类号: H05K7/20 H01L23/36

    摘要: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

    摘要翻译: 本文公开了一种模块冷却系统,包括:与电路板可操作地连通的模块,邻接电路板的加强件,邻近模块的散热器,朝向模块偏置散热器的第一偏置构件,多个不影响 紧固件位置地固定散热器;以及第二偏置构件,将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法,包括:将模块电连接到电路板,将加强件邻接到电路板,将散热器邻接到模块,用偏置构件偏置散热器朝向 模块,用不影响紧固件固定散热器,并且用电路板和模块朝向散热器的第二偏置构件偏置。

    SYSTEM AND METHOD FOR COOLING A MODULE
    5.
    发明申请
    SYSTEM AND METHOD FOR COOLING A MODULE 有权
    用于冷却模块的系统和方法

    公开(公告)号:US20080151504A1

    公开(公告)日:2008-06-26

    申请号:US12044015

    申请日:2008-03-07

    IPC分类号: H05K7/20

    摘要: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

    摘要翻译: 本文公开了一种模块冷却系统,包括:与电路板可操作地连通的模块,邻接电路板的加强件,邻近模块的散热器,朝向模块偏置散热器的第一偏置构件,多个不影响 紧固件位置地固定散热器;以及第二偏置构件,将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法,包括:将模块电连接到电路板,将加强件邻接到电路板,将散热器邻接到模块,用偏置构件偏置散热器朝向 模块,用不影响紧固件固定散热器,并且用电路板和模块朝向散热器的第二偏置构件偏置。

    System and method for cooling a module
    6.
    发明授权
    System and method for cooling a module 有权
    冷却模块的系统和方法

    公开(公告)号:US07375963B2

    公开(公告)日:2008-05-20

    申请号:US11279266

    申请日:2006-04-11

    IPC分类号: H05K7/20

    摘要: Disclosed herein is a module cooling system, comprising, a module in operable communication with a circuit board, a stiffener abutting the circuit board, a heatsink abutting the module, a first biasing member biasing the heatsink towards the module, a plurality of non-influencing fasteners positionally fixing the heatsink, and a second biasing member biasing the circuit board and module towards the heatsink. Further disclosed herein is a method of mounting a module cooling system, comprising, connecting electrically a module to a circuit board, abutting a stiffener to the circuit board, abutting a heatsink to the module, biasing with a biasing member the heatsink in a direction towards the module, fixing the heatsink with non-influencing fasteners, and biasing with a second biasing member the circuit board and module towards the heatsink.

    摘要翻译: 本文公开了一种模块冷却系统,包括:与电路板可操作地连通的模块,邻接电路板的加强件,邻近模块的散热器,朝向模块偏置散热器的第一偏置构件,多个不影响 紧固件位置地固定散热器;以及第二偏置构件,将电路板和模块朝向散热器偏置。 本文进一步公开的是一种安装模块冷却系统的方法,包括:将模块电连接到电路板,将加强件邻接到电路板,将散热器邻接到模块,用偏置构件偏置散热器朝向 模块,用不影响紧固件固定散热器,并且用电路板和模块朝向散热器的第二偏置构件偏置。