公开(公告)号：US11107795B2

公开(公告)日：2021-08-31

申请号：US16455590

申请日：2019-06-27

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US10388630B2

公开(公告)日：2019-08-20

申请号：US15829428

申请日：2017-12-01

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US20180082983A1

公开(公告)日：2018-03-22

申请号：US15829428

申请日：2017-12-01

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US20200073754A1

公开(公告)日：2020-03-05

申请号：US16669343

申请日：2019-10-30

Applicant: Micron Technology, Inc.

Inventor： Yihua Zhang ,  Paolo E. Mangalindan ,  Jianfei Lei ,  Andrew D. Proescholdt ,  Gerard A. Kreifels

IPC: G06F11/10 ,  G11C29/52 ,  G11C29/50

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

公开(公告)号：US20190319013A1

公开(公告)日：2019-10-17

申请号：US16455590

申请日：2019-06-27

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.

公开(公告)号：US10067827B2

公开(公告)日：2018-09-04

申请号：US15197446

申请日：2016-06-29

Applicant: Micron Technology, Inc.

Inventor： Yihua Zhang ,  Paolo E. Mangalindan ,  Jianfei Lei ,  Andrew D. Proescholdt ,  Gerard A. Kreifels

IPC: G11C29/00 ,  G06F11/10 ,  G11C29/50 ,  G11C29/52 ,  G11C29/04

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

公开(公告)号：US10949300B2

公开(公告)日：2021-03-16

申请号：US16669343

申请日：2019-10-30

Applicant: Micron Technology, Inc.

Inventor： Yihua Zhang ,  Paolo E. Mangalindan ,  Jianfei Lei ,  Andrew D. Proescholdt ,  Gerard A. Kreifels

IPC: G06F11/10 ,  G11C29/50 ,  G11C29/52 ,  G11C29/04 ,  G11C16/04

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

公开(公告)号：US20180314593A1

公开(公告)日：2018-11-01

申请号：US16030599

申请日：2018-07-09

Applicant: Micron Technology, Inc.

Inventor： Yihua Zhang ,  Paolo E. Mangalindan ,  Jianfei Lei ,  Andrew D. Proescholdt ,  Gerard A. Kreifels

IPC: G06F11/10 ,  G11C29/50 ,  G11C29/52 ,  G11C29/04

CPC classification number: G06F11/1068 ,  G06F11/1048 ,  G11C29/50 ,  G11C29/52 ,  G11C2029/0411 ,  G11C2029/5004 ,  G11C2029/5006

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

公开(公告)号：US20180004596A1

公开(公告)日：2018-01-04

申请号：US15197446

申请日：2016-06-29

Applicant: Micron Technology, Inc.

Inventor： Yihua Zhang ,  Paolo E. Mangalindan ,  Jianfei Lei ,  Andrew D. Proescholdt ,  Gerard A. Kreifels

IPC: G06F11/10 ,  G11C29/50 ,  G11C29/52

CPC classification number: G06F11/1068 ,  G06F11/1048 ,  G11C29/50 ,  G11C29/52 ,  G11C2029/0411 ,  G11C2029/5004 ,  G11C2029/5006

Abstract: Methods, systems, and devices for operating a memory cell or cells are described. An error in stored data may be detected by an error correction code (ECC) operation during sensing of the memory cells used to store the data. The error may be indicated in hardware by generating a measurable signal on an output node. For example, the voltage at the output node may be changed from a first value to a second value. A device monitoring the output node may determine an error has occurred for a set of data based at least in part on the change in the signal at the output node.

公开(公告)号：US20170207195A1

公开(公告)日：2017-07-20

申请号：US14995925

申请日：2016-01-14

Applicant: Micron Technology, Inc.

Inventor： Nathan J. Sirocka ,  Trismardawi Tanadi ,  Andrew D. Proescholdt

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06582 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture are disclosed herein. In one embodiment, a semiconductor device package includes a plurality of package contacts and a semiconductor die having a plurality of first die bond pads, a plurality of second die bond pads, and a plurality of duplicate die bond pads having the same pin assignments as the first die bond pads. The semiconductor die further includes an integrated circuit operably coupled to the package contacts via the plurality of first die bond pads and either the second die bond pads or the duplicate die bond pads, but not both. The integrated circuit is configured to be programmed into one of (1) a first pad state in which the first and second die bond pads are enabled for use with the package contacts and (2) a second pad state in which the first and duplicate die bond pads are enabled for use with the package contacts.