Configurable Soft Post-Package Repair (SPPR) Schemes

    公开(公告)号:US20210280267A1

    公开(公告)日:2021-09-09

    申请号:US16811691

    申请日:2020-03-06

    Abstract: Systems and methods to perform multiple row repair mode for soft post-packaging repair of previously repaired data groups are disclosed. The devices may have activation circuitry that includes a mode register bit or a control antifuse that sends an input signal upon activation. The devices may also include a logic element that receives the input signal and sends, upon receiving the input signal, a configuration signal that enables a multiple row repair mode.

    Adjusting refresh rate during self-refresh state

    公开(公告)号:US12165690B2

    公开(公告)日:2024-12-10

    申请号:US17849100

    申请日:2022-06-24

    Abstract: Methods, systems, and devices for adjusting a refresh rate during a self-refresh state are described. A memory system may enter a self-refresh state and execute a first set of refresh operations on a set of rows of memory cells at the memory system according to a first rate. The memory system may determine, based on executing the first set of refresh operations, that a counter associated with the set of refresh operations satisfies a threshold for a second time while the memory system is in the self-refresh state. In response to the counter satisfying the threshold for the second time, a flip-flop circuit at the memory system may modify an output of the flip-flop circuit and the memory system may decrease the rate for executing the refresh operations to a second rate based on the modified output of the flip-flop circuit.

    CHARGE PUMP SUPPLY OPTIMIZATION AND NOISE REDUCTION METHOD FOR LOGIC SYSTEMS

    公开(公告)号:US20200098398A1

    公开(公告)日:2020-03-26

    申请号:US16143105

    申请日:2018-09-26

    Abstract: Memory devices may have internal circuitry that employs voltages higher and/or lower than voltages provided by an external power source. Charge pumps are DC/DC converters that may be used to generate the higher voltages internally. The number of available charge pumps in a memory device may be conservatively dimensioned to be high, in some systems to protect yields. Some of the available charge pumps may be disabled during manufacturing or testing to reduce the number of active charge pumps. The testing process may employ dedicated logic in the memory device and the disabling may employ fuse circuitry.

    Post-packaging repair of redundant rows

    公开(公告)号:US10403390B1

    公开(公告)日:2019-09-03

    申请号:US15948585

    申请日:2018-04-09

    Abstract: Systems and methods to perform post-packaging repair of previously repaired data groups are disclosed. The devices may have an array of addressable rows or columns of memory cells, which can be activated. Upon identification of defect in a memory cell row or column, a repair in which the memory cell may be deactivated and a secondary row may be activated in its place may be performed. Volatile and non-volatile storage elements may be used to store the defective memory addresses. Logic circuitry in the device may match a requested address with the stored addresses and generate logic signals that trigger activation of a repaired row in place of the defective row or column. Moreover, defective rows or columns that have been previously repaired once may be further repaired. To that end, logic circuitry implementing a trumping mechanism may be used to prevent activation of multiple data rows or columns for addresses that were repaired multiple times.

    Charge pump supply optimization and noise reduction method for logic systems

    公开(公告)号:US11984189B2

    公开(公告)日:2024-05-14

    申请号:US17205705

    申请日:2021-03-18

    CPC classification number: G11C5/145 H02M3/07

    Abstract: Memory devices may have internal circuitry that employs voltages higher and/or lower than voltages provided by an external power source. Charge pumps are DC/DC converters that may be used to generate the higher voltages internally. The number of available charge pumps in a memory device may be conservatively dimensioned to be high, in some systems to protect yields. Some of the available charge pumps may be disabled during manufacturing or testing to reduce the number of active charge pumps. The testing process may employ dedicated logic in the memory device and the disabling may employ fuse circuitry.

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