公开(公告)号：US09543166B2

公开(公告)日：2017-01-10

申请号：US14931806

申请日：2015-11-03

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L21/00 ,  H01L21/76 ,  H01L21/46 ,  H01L21/322 ,  B32B7/12 ,  H01J7/18 ,  H01L23/20 ,  H01L23/28 ,  H01L23/26 ,  H01L21/56 ,  H01L23/00 ,  H01L27/146 ,  H01L31/18 ,  H01L51/52 ,  H01L23/31

CPC分类号： H01L23/26 ,  H01L21/3221 ,  H01L21/3225 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/564 ,  H01L27/14698 ,  H01L31/186 ,  H01L51/5259 ,  H01L2224/16225 ,  H01L2924/15311 ,  Y10T428/28

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

摘要翻译： 公开的实施例包括由电子包装提供的外部吸气。 公开了一种用于半导体衬底的外部吸杂元件，其​​可以被结合作为用于该结构的电子封装的一部分。 还公开了包括外部吸杂元件的半导体结构和堆叠半导体结构。 还公开了提供外部吸气剂的封装模具化合物。 还公开了制造这种装置的方法。

公开(公告)号：US10892202B2

公开(公告)日：2021-01-12

申请号：US16512146

申请日：2019-07-15

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L23/26 ,  H01L21/322 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L27/146 ,  H01L31/18 ,  H01L51/52

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

公开(公告)号：US20160056051A1

公开(公告)日：2016-02-25

申请号：US14931806

申请日：2015-11-03

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L21/322 ,  H01L21/56

CPC分类号： H01L23/26 ,  H01L21/3221 ,  H01L21/3225 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/564 ,  H01L27/14698 ,  H01L31/186 ,  H01L51/5259 ,  H01L2224/16225 ,  H01L2924/15311 ,  Y10T428/28

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

摘要翻译： 公开的实施例包括由电子包装提供的外部吸气。 公开了一种用于半导体衬底的外部吸杂元件，其​​可以被结合作为用于该结构的电子封装的一部分。 还公开了包括外部吸杂元件的半导体结构和堆叠半导体结构。 还公开了提供外部吸气剂的封装模具化合物。 还公开了制造这种装置的方法。

公开(公告)号：US20190341321A1

公开(公告)日：2019-11-07

申请号：US16512146

申请日：2019-07-15

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L23/26 ,  H01L21/322 ,  H01L23/31 ,  H01L21/56

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

公开(公告)号：US10453761B2

公开(公告)日：2019-10-22

申请号：US15395169

申请日：2016-12-30

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L23/26 ,  H01L21/322 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L27/146 ,  H01L31/18 ,  H01L51/52

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.

公开(公告)号：US20170110381A1

公开(公告)日：2017-04-20

申请号：US15395169

申请日：2016-12-30

申请人： Micron Technology, Inc.

发明人： Michael Tan ,  Cheng P. Pour

IPC分类号： H01L23/26 ,  H01L21/56 ,  H01L23/31 ,  H01L21/322

CPC分类号： H01L23/26 ,  H01L21/3221 ,  H01L21/3225 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/564 ,  H01L27/14698 ,  H01L31/186 ,  H01L51/5259 ,  H01L2224/16225 ,  H01L2924/15311 ,  Y10T428/28

摘要： Disclosed embodiments include external gettering provided by electronic packaging. An external gettering element for a semiconductor substrate, which may be incorporated as part of an electronic packaging for the structure, is disclosed. Semiconductor structures and stacked semiconductor structures including an external gettering element are also disclosed. An encapsulation mold compound providing external gettering is also disclosed. Methods of fabricating such devices are also disclosed.