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公开(公告)号:US11650898B2
公开(公告)日:2023-05-16
申请号:US17729841
申请日:2022-04-26
Applicant: Micron Technology, Inc.
Inventor: Jackson N. Callaghan , Kazuaki Ohara , Ji-Hye G. Shin , Vyjayanthi Prasad , Rosa M. Avila-Hernandez , Gitanjali T. Ghosh , Rachael R. Skreen
IPC: G06F11/30 , G01R31/3177 , G06F1/06 , G06F13/16
CPC classification number: G06F11/3096 , G01R31/3177 , G06F1/06 , G06F11/3034 , G06F11/3089 , G06F13/1668 , G06F13/1689
Abstract: An on-die logic analyzer (ODLA) can reduce the time and resources that would otherwise be spent in validating or debugging memory system timings. The ODLA can receive an enable signal with respect to a start command and start a count of clock cycles in response to a first issued command matching the start command defined in a first mode register. The ODLA can stop the count of clock cycles in response to a second issued command matching a stop command defined in a second mode register. The ODLA can write a value indicative of the stopped count to a third mode register or an on-die storage array in response to the stopped count exceeding a previously stored count.
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公开(公告)号:US12147691B2
公开(公告)日:2024-11-19
申请号:US17345249
申请日:2021-06-11
Applicant: Micron Technology, Inc.
Inventor: Rosa M. Avila-Hernandez , Rachael R. Skreen , Ji-Hye G. Shin , Kazuaki Ohara
IPC: G06F3/06
Abstract: Memory bank remapping based on sensed temperatures of a memory device can provide an overall reduced power consumption of the memory device. Signaling indicative of sensed temperatures detected by a plurality of temperature sensors within a stack of memory dies of a memory device can be received by address circuitry of the memory device. Based on the sensed temperatures and respective positions of the temperature sensors within the stack of memory dies, a portion of the memory device experiencing an excessive operating temperature can be identified. Logical addresses of a first memory bank of a memory die of the stack of memory dies near or at least partially within the identified portion can be remapped to physical addresses of a second memory bank of the memory die that is further away from the identified portion than the first memory bank.
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公开(公告)号:US20220398026A1
公开(公告)日:2022-12-15
申请号:US17345249
申请日:2021-06-11
Applicant: Micron Technology, Inc.
Inventor: Rosa M. Avila-Hernandez , Rachael R. Skreen , Ji-Hye G. Shin , Kazuaki Ohara
IPC: G06F3/06
Abstract: Memory bank remapping based on sensed temperatures of a memory device can provide an overall reduced power consumption of the memory device. Signaling indicative of sensed temperatures detected by a plurality of temperature sensors within a stack of memory dies of a memory device can be received by address circuitry of the memory device. Based on the sensed temperatures and respective positions of the temperature sensors within the stack of memory dies, a portion of the memory device experiencing an excessive operating temperature can be identified. Logical addresses of a first memory bank of a memory die of the stack of memory dies near or at least partially within the identified portion can be remapped to physical addresses of a second memory bank of the memory die that is further away from the identified portion than the first memory bank.
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公开(公告)号:US20220113349A1
公开(公告)日:2022-04-14
申请号:US17067288
申请日:2020-10-09
Applicant: Micron Technology, Inc.
Inventor: Jackson N. Callaghan , Kazuaki Ohara , Ji-Hye G. Shin , Vyjayanthi Prasad , Rosa M. Avila-Hernandez , Gitanjali T. Ghosh , Rachael R. Skreen
IPC: G01R31/3177 , G06F13/16 , G06F1/06
Abstract: An on-die logic analyzer (ODLA) can reduce the time and resources that would otherwise be spent in validating or debugging memory system timings. The ODLA can receive an enable signal with respect to a start command and start a count of clock cycles in response to a first issued command matching the start command defined in a first mode register. The ODLA can stop the count of clock cycles in response to a second issued command matching a stop command defined in a second mode register. The ODLA can write a value indicative of the stopped count to a third mode register or an on-die storage array in response to the stopped count exceeding a previously stored count.
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公开(公告)号:US20240256160A1
公开(公告)日:2024-08-01
申请号:US18403458
申请日:2024-01-03
Applicant: Micron Technology, Inc.
Inventor: Jihye Gale Shin , Kazuaki Ohara , Rachael R. Skreen , Soujanya Venigalla , Rosa Maria Avila-Hernandez
IPC: G06F3/06
CPC classification number: G06F3/0634 , G06F3/061 , G06F3/0676
Abstract: Methods, systems, and devices for memory device configuration based on host behavior are described. A first memory die of multiple memory dies in a memory device may be programmed to have a first characteristic associated with a first set of performance criteria. Based on programming the first memory die to have the first characteristic, data associated with the first set of performance criteria may be received. Based on the data being associated with the first set of performance criteria, the data may be stored in the first memory die based on the first memory die having the first characteristics associated with the first set of performance criteria.
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公开(公告)号:US11868266B2
公开(公告)日:2024-01-09
申请号:US17198902
申请日:2021-03-11
Applicant: Micron Technology, Inc.
Inventor: Ji-Hye G Shin , Kazuaki Ohara , Rosa M. Avila-Hernandez , Rachael R. Skreen
IPC: G06F12/10 , G06F1/3234 , G11C7/10
CPC classification number: G06F12/10 , G06F1/3275 , G06F2212/657 , G11C7/10
Abstract: Memory bank redistribution based on power consumption of multiple memory banks of a memory die can provide an overall reduced power consumption of a memory device. The respective power consumption of each bank can be determined and memory operations to the banks can be distributed based on the determined power consumption. The memory die can include an interface coupled to each bank. Control circuitry can remap logical to physical addresses of the banks based on one or more parameters such as a power consumption of each bank, counts of memory operations for each bank, and/or a relative physical distance of each bank.
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公开(公告)号:US20220292025A1
公开(公告)日:2022-09-15
申请号:US17198902
申请日:2021-03-11
Applicant: Micron Technology, Inc.
Inventor: Ji-Hye G. Shin , Kazuaki Ohara , Rosa M. Avila-Hernandez , Rachael R. Skreen
IPC: G06F12/10 , G06F1/3234
Abstract: Memory bank redistribution based on power consumption of multiple memory banks of a memory die can provide an overall reduced power consumption of a memory device. The respective power consumption of each bank can be determined and memory operations to the banks can be distributed based on the determined power consumption. The memory die can include an interface coupled to each bank. Control circuitry can remap logical to physical addresses of the banks based on one or more parameters such as a power consumption of each bank, counts of memory operations for each bank, and/or a relative physical distance of each bank.
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公开(公告)号:US20240255567A1
公开(公告)日:2024-08-01
申请号:US18403444
申请日:2024-01-03
Applicant: Micron Technology, Inc.
Inventor: Jihye Gale Shin , Kazuaki Ohara , Rachael R. Skreen , Soujanya Venigalla , Rosa Maria Avila-Hernandez
IPC: G01R31/28
CPC classification number: G01R31/2851
Abstract: Methods, systems, and devices for memory device operation are described. A register of a first memory die of multiple memory dies in a memory device may be configured to indicate that the first memory die has a first characteristic associated with a first set of performance criteria. Also, a register of a second memory die of the multiple memory dies may be configured to indicate that the second memory die has a second characteristic associated with a second set of performance criteria. Data received from a host device that is associated with the first set of performance criteria may be stored in the first memory die based on the first memory die having the first characteristic associated with the first set of performance criteria. In some examples, the registers store relative characteristics of the memory dies in relation to the other memory dies in the memory device.
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公开(公告)号:US20220253365A1
公开(公告)日:2022-08-11
申请号:US17729841
申请日:2022-04-26
Applicant: Micron Technology, Inc.
Inventor: Jackson N. Callaghan , Kazuaki Ohara , Ji-Hye G. Shin , Vyjayanthi Prasad , Rosa M. Avila-Hernandez , Gitanjali T. Ghosh , Rachael R. Skreen
IPC: G06F11/30 , G01R31/3177 , G06F1/06 , G06F13/16
Abstract: An on-die logic analyzer (ODLA) can reduce the time and resources that would otherwise be spent in validating or debugging memory system timings. The ODLA can receive an enable signal with respect to a start command and start a count of clock cycles in response to a first issued command matching the start command defined in a first mode register. The ODLA can stop the count of clock cycles in response to a second issued command matching a stop command defined in a second mode register. The ODLA can write a value indicative of the stopped count to a third mode register or an on-die storage array in response to the stopped count exceeding a previously stored count.
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公开(公告)号:US11327867B2
公开(公告)日:2022-05-10
申请号:US17067288
申请日:2020-10-09
Applicant: Micron Technology, Inc.
Inventor: Jackson N. Callaghan , Kazuaki Ohara , Ji-Hye G. Shin , Vyjayanthi Prasad , Rosa M. Avila-Hernandez , Gitanjali T. Ghosh , Rachael R. Skreen
IPC: G06F11/30 , G01R31/3177 , G06F1/06 , G06F13/16
Abstract: An on-die logic analyzer (ODLA) can reduce the time and resources that would otherwise be spent in validating or debugging memory system timings. The ODLA can receive an enable signal with respect to a start command and start a count of clock cycles in response to a first issued command matching the start command defined in a first mode register. The ODLA can stop the count of clock cycles in response to a second issued command matching a stop command defined in a second mode register. The ODLA can write a value indicative of the stopped count to a third mode register or an on-die storage array in response to the stopped count exceeding a previously stored count.
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