Bank remapping based on sensed temperature

    公开(公告)号:US12147691B2

    公开(公告)日:2024-11-19

    申请号:US17345249

    申请日:2021-06-11

    Abstract: Memory bank remapping based on sensed temperatures of a memory device can provide an overall reduced power consumption of the memory device. Signaling indicative of sensed temperatures detected by a plurality of temperature sensors within a stack of memory dies of a memory device can be received by address circuitry of the memory device. Based on the sensed temperatures and respective positions of the temperature sensors within the stack of memory dies, a portion of the memory device experiencing an excessive operating temperature can be identified. Logical addresses of a first memory bank of a memory die of the stack of memory dies near or at least partially within the identified portion can be remapped to physical addresses of a second memory bank of the memory die that is further away from the identified portion than the first memory bank.

    BANK REMAPPING BASED ON SENSED TEMPERATURE

    公开(公告)号:US20220398026A1

    公开(公告)日:2022-12-15

    申请号:US17345249

    申请日:2021-06-11

    Abstract: Memory bank remapping based on sensed temperatures of a memory device can provide an overall reduced power consumption of the memory device. Signaling indicative of sensed temperatures detected by a plurality of temperature sensors within a stack of memory dies of a memory device can be received by address circuitry of the memory device. Based on the sensed temperatures and respective positions of the temperature sensors within the stack of memory dies, a portion of the memory device experiencing an excessive operating temperature can be identified. Logical addresses of a first memory bank of a memory die of the stack of memory dies near or at least partially within the identified portion can be remapped to physical addresses of a second memory bank of the memory die that is further away from the identified portion than the first memory bank.

    BANK REDISTRIBUTION BASED ON POWER CONSUMPTION

    公开(公告)号:US20220292025A1

    公开(公告)日:2022-09-15

    申请号:US17198902

    申请日:2021-03-11

    Abstract: Memory bank redistribution based on power consumption of multiple memory banks of a memory die can provide an overall reduced power consumption of a memory device. The respective power consumption of each bank can be determined and memory operations to the banks can be distributed based on the determined power consumption. The memory die can include an interface coupled to each bank. Control circuitry can remap logical to physical addresses of the banks based on one or more parameters such as a power consumption of each bank, counts of memory operations for each bank, and/or a relative physical distance of each bank.

    MEMORY DEVICE OPERATION BASED ON DEVICE CHARACTERISTICS

    公开(公告)号:US20240255567A1

    公开(公告)日:2024-08-01

    申请号:US18403444

    申请日:2024-01-03

    CPC classification number: G01R31/2851

    Abstract: Methods, systems, and devices for memory device operation are described. A register of a first memory die of multiple memory dies in a memory device may be configured to indicate that the first memory die has a first characteristic associated with a first set of performance criteria. Also, a register of a second memory die of the multiple memory dies may be configured to indicate that the second memory die has a second characteristic associated with a second set of performance criteria. Data received from a host device that is associated with the first set of performance criteria may be stored in the first memory die based on the first memory die having the first characteristic associated with the first set of performance criteria. In some examples, the registers store relative characteristics of the memory dies in relation to the other memory dies in the memory device.

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