公开(公告)号：US20210202316A1

公开(公告)日：2021-07-01

申请号：US16728374

申请日：2019-12-27

Applicant: Micron Technology, Inc.

Inventor： Suresh K. Upadhyayula ,  Thiam Chye Lim

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/67 ,  H01L21/687

Abstract: A method of manufacturing a microelectronic device may include forming a wiring layer on a first surface of a wafer. The method may also include forming a modified layer along separation regions for each microelectronic device of the wafer by focusing a laser on an inside portion of the wafer. The method may also include removing material from the second surface of the wafer. The wafer may be cooled to a temperature where a low dielectric constant layer extending across the separation regions is brittle while the material is removed from the second surface of the wafer. The method may further include separating the wafer along the separation region to form separate microelectronic devices.

公开(公告)号：US20240071979A1

公开(公告)日：2024-02-29

申请号：US17898368

申请日：2022-08-29

Applicant: Micron Technology, Inc.

Inventor： Chin Hui Chong ,  Hong Wan Ng ,  Suresh K. Upadhyayula

IPC: H01L23/00

CPC classification number: H01L24/48 ,  H01L24/06 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/06131 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85

Abstract: An assembly comprising a substrate with a first and second bond pad at a top surface; and a semiconductor die with a lower surface coupled to the top surface, an upper surface with a third and fourth bond pad thereat, and a side surface perpendicular to the upper and lower surfaces. The first bond pad can be a first distance, the second bond pad can be a second distance, the third bond pad can be a third distance, and the fourth bond pad can be a fourth distance, respectively, from the side surface. The first and third distances summed can be the same as the second and fourth distances summed. A first wire can extend between the first and third bond pads, and a second wire can extend between the second and fourth bond pads.

公开(公告)号：US11282746B2

公开(公告)日：2022-03-22

申请号：US16728374

申请日：2019-12-27

Applicant: Micron Technology, Inc.

Inventor： Suresh K. Upadhyayula ,  Thiam Chye Lim

IPC: H01L21/78 ,  H01L21/268 ,  H01L21/304 ,  H01L21/687 ,  H01L21/67

Abstract: A method of manufacturing a microelectronic device may include forming a wiring layer on a first surface of a wafer. The method may also include forming a modified layer along separation regions for each microelectronic device of the wafer by focusing a laser on an inside portion of the wafer. The method may also include removing material from the second surface of the wafer. The wafer may be cooled to a temperature where a low dielectric constant layer extending across the separation regions is brittle while the material is removed from the second surface of the wafer. The method may further include separating the wafer along the separation region to form separate microelectronic devices.

公开(公告)号：US12080616B2

公开(公告)日：2024-09-03

申请号：US17552217

申请日：2021-12-15

Applicant: Micron Technology, Inc.

Inventor： Suresh K. Upadhyayula ,  Yeow Chon Ong ,  Hong Wan Ng

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065

CPC classification number: H01L23/3135 ,  H01L21/56 ,  H01L23/295 ,  H01L23/562 ,  H01L25/0657 ,  H01L23/3121 ,  H01L2225/0651 ,  H01L2225/06562

Abstract: The subject application relates to reinforced semiconductor device packaging and associated systems and methods. The device generally includes a substrate and one or more integrated circuit dies electrically coupled to the substrate with wire bonds. The device includes an encapsulant enclosing the one or more dies and the wire bonds. The package can include a reinforcing layer positioned on one or more surfaces of the encapsulant, a reinforcing wire extending through the encapsulant, or entrained reinforcing fiber portions positioned throughout the encapsulant. The reinforcing layer can be textile woven from synthetic or natural fibers, such as aramid, carbon, or glass. The package can be formed by disposing a reinforcing textile layer in a mold, placing a die and substrate in the mold with a liquid encapsulant, and hardening the liquid encapsulant to adhere the reinforcing textile layer, the encapsulant, the die, and the substrate together.

公开(公告)号：US20220208632A1

公开(公告)日：2022-06-30

申请号：US17552217

申请日：2021-12-15

Applicant: Micron Technology, Inc.

Inventor： Suresh K. Upadhyayula ,  Yeow Chon Ong ,  Hong Wan Ng

IPC: H01L23/31 ,  H01L23/29 ,  H01L23/00 ,  H01L25/065 ,  H01L21/56

Abstract: Systems and methods for a semiconductor device having reinforced packaging are provided. The device generally includes a substrate and one or more integrated circuit dies electrically coupled to the substrate with wire bonds. The device includes an encapsulant enclosing the one or more dies and the wire bonds. The package can include a reinforcing layer positioned on one or more surfaces of the encapsulant, a reinforcing wire extending through the encapsulant, or entrained reinforcing fiber portions positioned throughout the encapsulant. The reinforcing layer can be textile woven from synthetic or natural fibers, such as aramid, carbon, or glass. The package can be formed by disposing a reinforcing textile layer in a mold, placing a die and substrate in the mold with a liquid encapsulant, and hardening the liquid encapsulant to adhere the reinforcing textile layer, the encapsulant, the die, and the substrate together.