公开(公告)号：US07312097B2

公开(公告)日：2007-12-25

申请号：US11135080

申请日：2005-05-23

申请人： Milfred D Hammerbacher ,  Gary D Stevens ,  Paul R Sharrock ,  Aline Wullur ,  Frederic Rivollier

发明人： Milfred D Hammerbacher ,  Gary D Stevens ,  Paul R Sharrock ,  Aline Wullur ,  Frederic Rivollier

IPC分类号： H01L21/00

CPC分类号： H01L31/035281 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0547 ,  Y02E10/52

摘要： A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.

摘要翻译： 提供一种制造光伏太阳能电池的方法。 提供多个大致球形的半导体元件。 每个半导体元件具有形成p-n结的芯和外表面表面。 在每个半导体元件的外表面上沉积防反射涂层，并且将每个半导体元件结合到穿孔铝箔阵列中，从而向p-n结的第一侧提供欧姆接触。 从每个半导体元件的一部分去除防反射涂层，然后将芯暴露，由此允许欧姆接触到p-n结的第二侧。

公开(公告)号：US06897085B2

公开(公告)日：2005-05-24

申请号：US10348253

申请日：2003-01-21

申请人： Milfred Dale Hammerbacher ,  Gary Don Stevens ,  Paul Ray Sharrock ,  Aline Wullur ,  Frederic Rivollier

发明人： Milfred Dale Hammerbacher ,  Gary Don Stevens ,  Paul Ray Sharrock ,  Aline Wullur ,  Frederic Rivollier

IPC分类号： H01L31/0216 ,  H01L31/0352 ,  H01L31/042 ,  H01L21/00

CPC分类号： H01L31/035281 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0547 ,  Y02E10/52

摘要： A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.

摘要翻译： 提供一种制造光伏太阳能电池的方法。 提供多个大致球形的半导体元件。 每个半导体元件具有形成p-n结的芯和外表面表面。 在每个半导体元件的外表面上沉积防反射涂层，并且将每个半导体元件结合到穿孔铝箔阵列中，从而向p-n结的第一侧提供欧姆接触。 从每个半导体元件的一部分去除防反射涂层，然后将芯暴露，由此允许欧姆接触到p-n结的第二侧。

公开(公告)号：US20050217721A1

公开(公告)日：2005-10-06

申请号：US11135080

申请日：2005-05-23

申请人： Milfred Hammerbacher ,  Gary Stevens ,  Paul Sharrock ,  Aline Wullur ,  Frederic Rivollier

发明人： Milfred Hammerbacher ,  Gary Stevens ,  Paul Sharrock ,  Aline Wullur ,  Frederic Rivollier

IPC分类号： H01L31/0216 ,  H01L31/0352 ,  H01L31/042 ,  H01L31/00

CPC分类号： H01L31/035281 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0547 ,  Y02E10/52

摘要： A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.

摘要翻译： 提供一种制造光伏太阳能电池的方法。 提供多个大致球形的半导体元件。 每个半导体元件具有形成p-n结的芯和外表面表面。 在每个半导体元件的外表面上沉积防反射涂层，并且将每个半导体元件结合到穿孔铝箔阵列中，从而向p-n结的第一侧提供欧姆接触。 从每个半导体元件的一部分去除防反射涂层，然后将芯暴露，由此允许欧姆接触到p-n结的第二侧。

公开(公告)号：US09184079B2

公开(公告)日：2015-11-10

申请号：US12750095

申请日：2010-03-30

申请人： Frederic Rivollier ,  Ryan Chubb

发明人： Frederic Rivollier ,  Ryan Chubb

IPC分类号： H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67781 ,  H01L21/67383 ,  H01L21/67766 ,  Y10S414/137

摘要： A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

摘要翻译： 一种用于处理晶片的系统，包括：至少一个卸载站; 设置成以一定角度保持晶片的至少一个中间站; 处理站; 以及配置成在所述站之间移动所述晶片的转移装置。 中间站可以被配置为以背靠背布置接收晶片。 一种用于处理晶片的设备，包括：一方面，构造成夹持单个晶片的真空夹具; 另一方面，重力夹持器构造成在位于晶片下方并支撑一个或多个晶片并提升时。 一种处理晶片的方法，包括：卸载晶片; 将晶片转移到中间站; 将晶片从中间站传送到处理站; 处理晶片; 从处理站卸载晶片; 并将晶片重新装载在载体中，其中晶片由转移装置卸载，转移和重新装载。

公开(公告)号：US20100272544A1

公开(公告)日：2010-10-28

申请号：US12750095

申请日：2010-03-30

申请人： Frederic Rivollier ,  Ryan Chubb

发明人： Frederic Rivollier ,  Ryan Chubb

IPC分类号： H01L31/18 ,  H01L21/677 ,  H01L21/683 ,  B65G65/00

CPC分类号： H01L21/67781 ,  H01L21/67383 ,  H01L21/67766 ,  Y10S414/137

摘要： A system for handling wafers comprising: at least one unload station; at least one intermediate station designed to hold the wafers at an angle; a processing station; and a transfer device configured to move the wafers between the stations. The intermediate station may be configured to receive the wafers in a back-to-back arrangement. An apparatus for handling wafers comprising: on one side, a vacuum gripper configured to grip individual wafers; and, on the other side, a gravity gripper configured to support one or more wafers when positioned beneath the wafers and lifted. A method for handling wafers, comprising: unloading wafers; transferring the wafers to an intermediate station; transferring the wafers from the intermediate station to a processing station; treating the wafers; unloading the wafers from the processing station; and reloading the wafers in a carrier, wherein the wafers are unloaded, transferred and reloaded by a transfer device.

摘要翻译： 一种用于处理晶片的系统，包括：至少一个卸载站; 设置成以一定角度保持晶片的至少一个中间站; 处理站; 以及配置成在所述站之间移动所述晶片的转移装置。 中间站可以被配置为以背靠背布置接收晶片。 一种用于处理晶片的设备，包括：一方面，构造成夹持单个晶片的真空夹具; 另一方面，重力夹持器构造成在位于晶片下方并支撑一个或多个晶片并提升时。 一种处理晶片的方法，包括：卸载晶片; 将晶片转移到中间站; 将晶片从中间站传送到处理站; 处理晶片; 从处理站卸载晶片; 并将晶片重新装载在载体中，其中晶片由转移装置卸载，转移和重新装载。