公开(公告)号：US09218050B2

公开(公告)日：2015-12-22

申请号：US13824713

申请日：2011-09-28

申请人： Min-Gu Kang ,  Ja-Chul Ku ,  Sang-Yoon Lee ,  Ssang-Gun Lim

发明人： Min-Gu Kang ,  Ja-Chul Ku ,  Sang-Yoon Lee ,  Ssang-Gun Lim

IPC分类号： G06F3/00 ,  G06T1/60 ,  H04N5/765

CPC分类号： G06F3/005 ,  G06T1/60 ,  H04N5/765

摘要： Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.

摘要翻译： 提供了一种以高速发送和接收图像数据的方法，其包括以与传输信道的带宽相对应的速度通过一个或多个传输信道顺序地发送从图像传感器输出的图像数据，并且顺序地记录通过 帧存储器中的一个或多个传输信道具有对应于通过对相应的一个或多个传输信道的带宽求和而获得的总带宽的速度，以及用于实现该方法的装置。

公开(公告)号：US20130176443A1

公开(公告)日：2013-07-11

申请号：US13824713

申请日：2011-09-28

申请人： Min-Gu Kang ,  Ja-Chul Ku ,  Sang-Yoon Lee ,  Ssang-Gun Lim

发明人： Min-Gu Kang ,  Ja-Chul Ku ,  Sang-Yoon Lee ,  Ssang-Gun Lim

IPC分类号： G06F3/00

CPC分类号： G06F3/005 ,  G06T1/60 ,  H04N5/765

摘要： Provided are a method of transmitting and receiving image data with high speed, which includes sequentially transmitting image data output from an image sensor through one or more transmission channels with a speed corresponding to a bandwidth of the transmission channels, and sequentially recording image data received through one or more transmission channels in a frame store with a speed corresponding to a total bandwidth obtained by summing bandwidths of the respective one or more transmission channels, and an apparatus for implementing the method.

摘要翻译： 提供了一种以高速发送和接收图像数据的方法，其包括以与传输信道的带宽相对应的速度通过一个或多个传输信道顺序地发送从图像传感器输出的图像数据，并且顺序地记录通过 帧存储器中的一个或多个传输信道具有对应于通过对相应的一个或多个传输信道的带宽求和而获得的总带宽的速度，以及用于实现该方法的装置。

公开(公告)号：US09412159B2

公开(公告)日：2016-08-09

申请号：US14343345

申请日：2012-09-13

申请人： Jai-Ho Son ,  Hyun-Min Lee ,  Min-Gu Kang ,  Sang-Yoon Lee ,  Ssang-Gun Lim

发明人： Jai-Ho Son ,  Hyun-Min Lee ,  Min-Gu Kang ,  Sang-Yoon Lee ,  Ssang-Gun Lim

IPC分类号： H04N7/18 ,  G06T7/00 ,  G01N21/95 ,  G02F1/13

CPC分类号： G06T7/0004 ,  G01N21/95 ,  G01N2021/9513 ,  G02F1/1309 ,  G06T2207/30121 ,  H04N7/18

摘要： Disclosed is a method for inspecting a flat panel. The method for inspecting the flat panel includes the steps of: arranging a camera at a measurement location of the flat panel by horizontally moving at least one of the flat panel and the camera; automatically focusing the camera with respect to a measuring target of the flat panel at the measurement location; acquiring a plurality of images for the measuring target by vertically moving the focused camera within a set region on the basis of the present location of the camera when focusing the camera; selecting the image having the most definition for the measuring target among the acquired images; processing the selected image; and determining whether the measuring target is defective or not.

摘要翻译： 公开了一种用于检查平板的方法。 用于检查平板的方法包括以下步骤：通过水平移动平板和相机中的至少一个来将相机布置在平板的测量位置; 在测量位置相对于平板测量对象自动聚焦相机; 在对照相机进行聚焦时，基于相机的当前位置垂直移动设定区域内的聚焦照相机，来获取测量对象的多个图像; 在所获取的图像中选择具有用于测量目标的最高定义的图像; 处理所选图像; 并且确定测量目标是否有缺陷。

公开(公告)号：US07092105B2

公开(公告)日：2006-08-15

申请号：US10473089

申请日：2001-10-31

申请人： Ssang-Gun Lim ,  Gee-Hong Kim ,  Yi-Bae Choi ,  Sang-Yoon Lee

发明人： Ssang-Gun Lim ,  Gee-Hong Kim ,  Yi-Bae Choi ,  Sang-Yoon Lee

IPC分类号： G01B11/24

CPC分类号： G01B11/2509 ,  G01B2210/50

摘要： A method and apparatus for measuring the three-dimensional surface shape of an object using color informations of light reflected by the object. The method and apparatus for measuring the three-dimensional surface shape of the object, in which a real-time measurement of the three-dimensional surface is performed by projecting a beam of light having color information onto the object and detecting color distribution information according to levels of the object, thereby obtaining level information of the object.

摘要翻译： 一种使用由对象反射的光的颜色信息来测量对象的三维表面形状的方法和装置。 用于测量物体的三维表面形状的方法和装置，其中通过将具有颜色信息的光束投射到物体上并且根据以下方式检测颜色分布信息来进行三维表面的实时测量 对象的级别，从而获得对象的级别信息。

公开(公告)号：US06873421B2

公开(公告)日：2005-03-29

申请号：US10181679

申请日：2001-10-31

申请人： Ssang-Gun Lim ,  Seung-Woo Kim ,  Sang-Yoon Lee ,  Chang-Jin Chung ,  Yi-Bae Choi ,  Young-Sik Cho ,  Kyung-Keun Park

发明人： Ssang-Gun Lim ,  Seung-Woo Kim ,  Sang-Yoon Lee ,  Chang-Jin Chung ,  Yi-Bae Choi ,  Young-Sik Cho ,  Kyung-Keun Park

IPC分类号： H04N13/00 ,  G01B11/25 ,  G01B11/24

CPC分类号： G01B11/2527

摘要： An apparatus and method for measuring a three-dimensional shape of an object using a projection moiré device. The method comprises the steps of obtaining a grid pattern image projected on a reference plane of a moving table and applying a buckets algorithm thereto, thereby achieving a reference phase, obtaining a grid pattern image projected on the object set on the moving table and applying a buckets algorithm thereto, thereby achieving an object phase, calculating a difference phase between the object phase and the reference phase, thereby achieving a moiré phase, and unwrapping the moiré phase, thereby achieving a level information of the object. The apparatus and method measure the three-dimensional shape using a projection grid without a reference grid, thereby achieving compactness of equipment, simplicity in usage and manufacturing cost reduction.

摘要翻译： 一种使用投影莫尔装置测量物体的三维形状的装置和方法。 该方法包括以下步骤：获得投影在移动台的参考平面上的网格图案图像并对其施加桶算法，从而实现参考相位，获得投影在移动台上的对象上的网格图案图像， 从而实现物体相位，计算物体相位与参考相位之间的差分相位，从而实现莫尔相位，并且展开莫尔相位，从而实现物体的等级信息。 该装置和方法使用没有参考网格的投影网格来测量三维形状，从而实现设备的紧凑性，使用简单性和制造成本降低。

公开(公告)号：US20100141937A1

公开(公告)日：2010-06-10

申请号：US12632960

申请日：2009-12-08

申请人： Chang-Hyun Ryu ,  Ssang-Gun Lim ,  Dong-Hae Son ,  Poom-Seong Park

发明人： Chang-Hyun Ryu ,  Ssang-Gun Lim ,  Dong-Hae Son ,  Poom-Seong Park

IPC分类号： G01N21/00

CPC分类号： G01R31/2656 ,  G01N21/95684

摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

摘要翻译： 测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于 焊球的形状，尺寸或位置。 倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息 焊球与球地。 倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。

公开(公告)号：US08319961B2

公开(公告)日：2012-11-27

申请号：US12632960

申请日：2009-12-08

申请人： Chang-Hyun Ryu ,  Ssang-Gun Lim ,  Dong-Hae Son ,  Poom-Seong Park

发明人： Chang-Hyun Ryu ,  Ssang-Gun Lim ,  Dong-Hae Son ,  Poom-Seong Park

IPC分类号： G01N21/00

CPC分类号： G01R31/2656 ,  G01N21/95684

摘要： An apparatus to test a semiconductor package includes a vertical illuminator to supply vertical illumination in the same axial direction as a measurement target and a vertical image unit to capture a vertical image of the measurement target so that a testing apparatus may 2-dimensionally determine information on the shape, size, or position of a solder ball. An inclined illuminator may supply inclined illumination in a different axial direction from the measurement target, and an inclined image capture unit may capture a side image of the measurement target so that the testing apparatus may 3-dimensionally determine information on a state of contact of the solder ball with the ball land. The inclined image capture unit may include a color camera using color information, thereby markedly increasing test reliability and yield.

摘要翻译： 测试半导体封装的装置包括：垂直照明器，用于沿与测量对象相同的轴向方向提供垂直照明;以及垂直图像单元，用于捕获测量对象的垂直图像，使得测试装置可以二维地确定关于 焊球的形状，尺寸或位置。 倾斜照明器可以在与测量对象不同的轴向方向上提供倾斜照明，并且倾斜图像拍摄单元可以捕获测量对象的侧面图像，使得测试装置可以三维地确定关于测量对象的接触状态的信息 焊球与球地。 倾斜图像捕获单元可以包括使用颜色信息的彩色照相机，从而显着提高测试可靠性和产量。