公开(公告)号：US20080105984A1

公开(公告)日：2008-05-08

申请号：US11933067

申请日：2007-10-31

Applicant: Min-Ho LEE

Inventor： Min-Ho LEE

IPC: H01L23/48

CPC classification number: H01L23/3128 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05647 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01022 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Provided is a semiconductor chip stack package with a reinforcing member connected to a substrate for preventing package warpage. The semiconductor chip stack package includes a first substrate including first circuit patterns on one surface thereof; a first unit semiconductor chip including a plurality of semiconductor chips stacked vertically on the first substrate and including first connection pads electrically connected to the first circuit patterns of the first substrate on one surface thereof; and a first reinforcing member arranged over the first unit semiconductor chip and including first circuit patterns on one surface thereof. The top semiconductor chip in the first unit semiconductor chip further includes first subsidiary connection pads connected to the first connection pads. The first circuit patterns of the first reinforcing member are electrically connected to the first circuit patterns of the first substrate via the first subsidiary connection pads of the top semiconductor chip.

Abstract translation: 提供了一种半导体芯片堆叠封装，其具有连接到基板的加强构件，用于防止封装翘曲。 半导体芯片堆叠封装包括在其一个表面上包括第一电路图案的第一基板; 第一单元半导体芯片，包括在第一基板上垂直堆叠的多个半导体芯片，并且包括在其一个表面上电连接到第一基板的第一电路图案的第一连接焊盘; 以及布置在所述第一单元半导体芯片上并且在其一个表面上包括第一电路图案的第一加强构件。 第一单元半导体芯片中的顶部半导体芯片还包括连接到第一连接焊盘的第一辅助连接焊盘。 第一加强构件的第一电路图案经由顶部半导体芯片的第一辅助连接焊盘电连接到第一衬底的第一电路图案。

公开(公告)号：US20120079842A1

公开(公告)日：2012-04-05

申请号：US12896287

申请日：2010-10-01

Applicant: Min-Ho LEE

Inventor： Min-Ho LEE

IPC: F25D17/06 ,  F25B1/00

CPC classification number: F25D29/00 ,  F25B2600/0251 ,  F25B2600/112 ,  F25D17/06 ,  Y02B30/743

Abstract: Disclosed is a refrigerator comprising: a compressor ON/OFF detector configured to detect an operation of the compressor when the compressor is operated; a circulation fan operation controller checks an operation of the compressor based on a signal input from the compressor ON/OFF detector and set and output an operation condition of a circulation fan; a circulation fan power source (50) configured to supply drive power to the circulation fan (60) in response to an output signal of the circulation fan operation controller (30); and a circulation fan control switch (40) configured to interrupt the power of the circulation fan power source (50) in response to an output signal of the circulation fan operation controller (30).

Abstract translation: 公开了一种冰箱，包括：压缩机ON / OFF检测器，被配置为当压缩机运行时检测压缩机的运行; 循环风扇操作控制器基于从压缩机ON / OFF检测器输入的信号来检查压缩机的操作，并设置并输出循环风扇的操作状态; 循环风扇电源（50），其响应于所述循环风扇运转控制器（30）的输出信号而向所述循环风扇（60）供给驱动电力; 以及循环风扇控制开关（40），其构造成响应于所述循环风扇运转控制器（30）的输出信号而中断所述循环风扇电源（50）的电力。

公开(公告)号：US20140151845A1

公开(公告)日：2014-06-05

申请号：US14088654

申请日：2013-11-25

Applicant: Moon-Gi CHO ,  Eun-Chul AHN ,  Sang-Young KIM ,  Joo-Weon SHIN ,  Min-Ho LEE

Inventor： Moon-Gi CHO ,  Eun-Chul AHN ,  Sang-Young KIM ,  Joo-Weon SHIN ,  Min-Ho LEE

IPC: H01L23/525

CPC classification number: H01L23/5256 ,  G06F12/0246 ,  H01L23/5329 ,  H01L27/11206 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor device has improved reliability by preventing a fuse cut through a repair process from being electrically reconnected by electrochemical migration. The semiconductor device includes a substrate, a fuse including a first fuse pattern and a second fuse pattern formed at the same level on the substrate, the first fuse pattern and the second fuse pattern being spaced a first width apart from each other such that a gap in the fuse is disposed at a first location between the first fuse pattern and the second fuse pattern, and a first insulation layer formed on the first fuse pattern and the second fuse pattern, the first insulation layer including an opening above the first location and having a second width smaller than the first width.

Abstract translation: 半导体器件通过防止通过修复过程的熔断体被电化学迁移电连接而提高了可靠性。 半导体器件包括衬底，熔丝，其包括形成在衬底上相同电平处的第一熔丝图案和第二熔丝图案，第一熔丝图案和第二熔丝图案彼此间隔开第一宽度，使得间隙 在所述保险丝设置在所述第一熔丝图案和所述第二熔丝图案之间的第一位置处，以及形成在所述第一熔丝图案和所述第二熔丝图案上的第一绝缘层，所述第一绝缘层包括位于所述第一位置上方的开口，并且具有 第二宽度小于第一宽度。

公开(公告)号：US20110171433A1

公开(公告)日：2011-07-14

申请号：US13070345

申请日：2011-03-23

Applicant: Min-Ho LEE ,  Jin-Woo Kim ,  Hyung-Gon Kim

Inventor： Min-Ho LEE ,  Jin-Woo Kim ,  Hyung-Gon Kim

IPC: B32B3/30 ,  C23C14/34

CPC classification number: C23C14/205

Abstract: The present disclosure relates to insert sheets and a method for manufacturing same. A film of the present invention is applicable to a variety of insert moldings or injection moldings to achieve appearance effects such as an excellent metal texture and the like, and maintain excellence in the overall physical properties such as surface properties, formability, scratch resistance, impact resistance, heat resistance, wear resistance, chemical resistance, and light resistance, etc.

Abstract translation: 本公开涉及插入片材及其制造方法。 本发明的薄膜可应用于各种嵌件模制品或注射成型品以实现诸如优异的金属质感等的外观效果，并且保持整体物理性能如表面性能，成型性，耐擦伤性，冲击性的卓越性 电阻，耐热性，耐磨性，耐化学性和耐光性等。