公开(公告)号：US07854365B2

公开(公告)日：2010-12-21

申请号：US12258675

申请日：2008-10-27

申请人： Ming Li ,  Ying Ding ,  Ping Liang Tu ,  King Ming Lo ,  Kwok Kee Chung

发明人： Ming Li ,  Ying Ding ,  Ping Liang Tu ,  King Ming Lo ,  Kwok Kee Chung

IPC分类号： B23K31/02

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

摘要翻译： 提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到​​低于Tm的衬底设定温度T2。 然后，接合头拾取模具并将模具朝向温度T1加热，以熔化焊料层。 将模具的焊料层压在基板上，以将模具结合到基板上，然后将结合头与模具分离，使得焊料层朝T2冷却并固化。

公开(公告)号：US20100105172A1

公开(公告)日：2010-04-29

申请号：US12258675

申请日：2008-10-27

申请人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

发明人： Ming LI ,  Ying DING ,  Ping Liang TU ,  King Ming LO ,  Kwok Kee Chung

IPC分类号： H01L21/00

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

摘要翻译： 提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到​​低于Tm的衬底设定温度T2。 然后，接合头拾取模具并将模具朝向温度T1加热，以熔化焊料层。 将模具的焊料层压在基板上，以将模具结合到基板上，然后将结合头与模具分离，使得焊料层朝T2冷却并固化。

公开(公告)号：US07810698B2

公开(公告)日：2010-10-12

申请号：US12274410

申请日：2008-11-20

申请人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

发明人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

IPC分类号： B23K20/00 ,  B23K37/00

CPC分类号： G05B19/4015 ,  G05B2219/37559 ,  G05B2219/45033 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

摘要翻译： 用于在接合操作期间校正接合工具的位置偏移的装置包括与位于接合工具上的第一基准标记间隔开的第一基准标记和第二基准标记。 当第一和第二基准标记在参考位置被照亮时，第一成像路径从第一基准标记发出并且第二成像路径从第二基准标记发出。 沿着第一和第二成像路径定位光学系统以观看第一和第二基准标记的图像。 处理器可操作以计算接合工具的当前位置并将其与期望位置进行比较，使得可以通过将接合工具的位置偏移移动到期望位置来校正接合工具的位置偏移。

公开(公告)号：US08293043B2

公开(公告)日：2012-10-23

申请号：US11459503

申请日：2006-07-24

申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

公开(公告)号：US20080017293A1

公开(公告)日：2008-01-24

申请号：US11459503

申请日：2006-07-24

申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

IPC分类号： B32B37/00

CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。