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公开(公告)号：US20120299683A1
公开(公告)日：2012-11-29
申请号：US13222231
申请日：2011-08-31
申请人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
发明人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
IPC分类号： H01F5/00
CPC分类号： H01F17/0006 , H01F19/00
摘要： An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout.
摘要翻译： 非对称差分电感器包括螺旋地设置在具有第一输入端子，第二输入端子，接地端子和中心导电布线的基板上的第一和第二导电布线。 中心导电布线具有连接接地端子和远离接地端子的中心端的中心接触点。 第一导电布线延伸穿过中心导电布线，并且具有连接第一输入端和连接中心端的第一端的第一触点。 所述第二导电布线延伸穿过所述中心导电布线并与所述第一导电布线交织，并且具有连接所述第二输入端子和连接所述中心端部的第二端部的第二触点。 在中心导电布线的相对侧的第一和第二导电布线的布线部分的相应部分彼此不对称，从而节省基板空间并且便于布线。
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公开(公告)号：US08493168B2
公开(公告)日：2013-07-23
申请号：US13222231
申请日：2011-08-31
申请人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
发明人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
CPC分类号： H01F17/0006 , H01F19/00
摘要： An asymmetric differential inductor includes first and second conductive wirings spirally disposed on a substrate having a first input terminal, a second input terminal, a ground terminal, and a central conductive wiring. The central conductive wiring has a central contact connecting the ground terminal and a central end away from the ground terminal. The first conductive wiring extends across the central conductive wiring and has a first contact connecting the first input terminal and a first end connecting the central end. The second conductive wiring extends across the central conductive wiring and interlaces with the first conductive wiring and has a second contact connecting the second input terminal and a second end connecting the central end. Corresponding portions of wiring sections of the first and second conductive wirings at opposite sides of the central conductive wiring are asymmetrical to one another to thereby save substrate space and facilitate circuit layout.
摘要翻译： 非对称差分电感器包括螺旋地设置在具有第一输入端子，第二输入端子，接地端子和中心导电布线的基板上的第一和第二导电布线。 中心导电布线具有连接接地端子和远离接地端子的中心端的中心接触点。 第一导电布线延伸穿过中心导电布线，并且具有连接第一输入端和连接中心端的第一端的第一触点。 所述第二导电布线延伸穿过所述中心导电布线并与所述第一导电布线交织，并且具有连接所述第二输入端子和连接所述中心端部的第二端部的第二触点。 在中心导电布线的相对侧的第一和第二导电布线的布线部分的相应部分彼此不对称，从而节省基板空间并且便于布线。
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公开(公告)号：US20130034971A1
公开(公告)日：2013-02-07
申请号：US13306051
申请日：2011-11-29
申请人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang , Li-Fang Lin
发明人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang , Li-Fang Lin
IPC分类号： H01R12/71
CPC分类号： H01L23/481 , H01L23/66 , H01L2223/6638 , H01L2924/0002 , H01L2924/00
摘要： An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density.
摘要翻译： 提供了互连机制，其包括配对的第一子互连机制和成对的第二子互连机制。 第一对副互连机构包括第一和第二轴对称的螺旋导电元件。 第二对副互连机构包括第三和第四轴对称的螺旋导电元件。 在具有螺旋形状的差分传输结构中配置副互连机构对被用于反转由小型化制造工艺引起的不同芯片或基板之间的声音和噪声信号或增加的布线密度。
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公开(公告)号：US08305182B1
公开(公告)日：2012-11-06
申请号：US13243138
申请日：2011-09-23
申请人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
发明人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
CPC分类号： H01L23/5227 , H01F19/04 , H01L2924/0002 , H01L2924/00
摘要： A symmetric differential inductor structure includes first, second, third and fourth spiral conductive wirings disposed in four quadrants of a substrate, respectively. Further, a fifth conductive wiring connects the first and fourth spiral conductive wirings, and a sixth conductive wiring connects the second and third spiral conductive wirings. The first and second spiral conductive wirings are symmetric but not intersected with one another, and the third and fourth spiral conductive wirings are symmetric but not intersected with one another. Therefore, the invention attains full geometric symmetry to avoid using conductive wirings that occupy a large area of the substrate as in the prior art and to thereby increase the product profit and yield.
摘要翻译： 对称差分电感器结构包括分别设置在基板的四个象限内的第一，第二，第三和第四螺旋导电布线。 此外，第五导电布线连接第一和第四螺旋导电布线，并且第六导电布线连接第二和第三螺旋导电布线。 第一和第二螺旋导电布线是对称的，但是彼此不相交，第三和第四螺旋导电布线是对称的但彼此不相交。 因此，本发明获得完全的几何对称性，以避免如现有技术那样使用占据基板的大面积的导电布线，从而提高产品利润和产量。
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公开(公告)号：US08736059B2
公开(公告)日：2014-05-27
申请号：US13306051
申请日：2011-11-29
申请人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang , Li-Fang Lin
发明人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang , Li-Fang Lin
IPC分类号： H01L23/52
CPC分类号： H01L23/481 , H01L23/66 , H01L2223/6638 , H01L2924/0002 , H01L2924/00
摘要： An interconnecting mechanism is provide, which includes paired first sub-interconnecting mechanisms and paired second sub-interconnecting mechanisms. The first pair of sub-interconnecting mechanisms includes first and second axially symmetrical spiral conductive elements. The second pair of sub-interconnecting mechanisms includes third and fourth axially symmetrical spiral conductive elements. Configuring the pairs of sub-interconnecting mechanisms in a differential transmission structure having a spiral shape is used to avert sounds and noise signals between different chips or substrates caused by a miniaturizing fabrication process or an increased wiring density.
摘要翻译： 提供了互连机制，其包括配对的第一子互连机制和成对的第二子互连机制。 第一对副互连机构包括第一和第二轴对称的螺旋导电元件。 第二对副互连机构包括第三和第四轴对称的螺旋导电元件。 在具有螺旋形状的差分传输结构中配置副互连机构对被用于反转由小型化制造工艺引起的不同芯片或基板之间的声音和噪声信号或增加的布线密度。
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公开(公告)号：US08399965B2
公开(公告)日：2013-03-19
申请号：US13242941
申请日：2011-09-23
申请人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang
发明人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A layer structure with an electromagnetic interference (EMI) shielding effect is applicable for reducing an EMI effect caused by signal transmission between through silicon vias, so as to effectively provide the EMI shielding effect between electrical interconnections of a three-dimensional (3D) integrated circuit. By forming EMI-shielding through silicon vias at predetermined positions between the through silicon vias used for signal transmission, a good EMI shielding effect can be attended, and signal distortion possibly caused by the EMI effect can be reduced between different chips or substrates.
摘要翻译： 具有电磁干扰（EMI）屏蔽效应的层结构适用于降低通过硅通孔之间的信号传输引起的EMI效应，从而有效地提供三维（3D）集成电路的电互连之间的EMI屏蔽效应 。 通过在用于信号传输的通过硅通孔之间的预定位置处通过硅通孔形成EMI屏蔽，可以考虑良好的EMI屏蔽效应，并且可以在不同的芯片或衬底之间减少可能由EMI效应引起的信号失真。
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公开(公告)号：US20120299682A1
公开(公告)日：2012-11-29
申请号：US13243138
申请日：2011-09-23
申请人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
发明人： Ming-Fan Tsai , Kuan-Yu Chen , Bo-Shiang Fang , Hsin-Hung Lee
IPC分类号： H01F27/29
CPC分类号： H01L23/5227 , H01F19/04 , H01L2924/0002 , H01L2924/00
摘要： A symmetric differential inductor structure includes first, second, third and fourth spiral conductive wirings disposed in four quadrants of a substrate, respectively. Further, a fifth conductive wiring connects the first and fourth spiral conductive wirings, and a sixth conductive wiring connects the second and third spiral conductive wirings. The first and second spiral conductive wirings are symmetric but not intersected with one another, and the third and fourth spiral conductive wirings are symmetric but not intersected with one another. Therefore, the invention attains full geometric symmetry to avoid using conductive wirings that occupy a large area of the substrate as in the prior art and to thereby increase the product profit and yield.
摘要翻译： 对称差分电感器结构包括分别设置在基板的四个象限中的第一，第二，第三和第四螺旋导电布线。 此外，第五导电布线连接第一和第四螺旋导电布线，并且第六导电布线连接第二和第三螺旋导电布线。 第一和第二螺旋导电布线是对称的，但是彼此不相交，第三和第四螺旋导电布线是对称的但彼此不相交。 因此，本发明获得完全的几何对称性，以避免如现有技术那样使用占据基板的大面积的导电布线，从而提高产品利润和产量。
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公开(公告)号：US20130032931A1
公开(公告)日：2013-02-07
申请号：US13242941
申请日：2011-09-23
申请人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang
发明人： Ming-Fan Tsai , Hsin-Hung Lee , Bo-Shiang Fang
IPC分类号： H01L23/552
CPC分类号： H01L23/552 , H01L23/481 , H01L2924/0002 , H01L2924/00
摘要： A layer structure with an electromagnetic interference (EMI) shielding effect is applicable for reducing an EMI effect caused by signal transmission between through silicon vias, so as to effectively provide the EMI shielding effect between electrical interconnections of a three-dimensional (3D) integrated circuit. By forming EMI-shielding through silicon vias at predetermined positions between the through silicon vias used for signal transmission, a good EMI shielding effect can be attended, and signal distortion possibly caused by the EMI effect can be reduced between different chips or substrates.
摘要翻译： 具有电磁干扰（EMI）屏蔽效应的层结构适用于降低通过硅通孔之间的信号传输引起的EMI效应，从而有效地提供三维（3D）集成电路的电互连之间的EMI屏蔽效应 。 通过在用于信号传输的通过硅通孔之间的预定位置处通过硅通孔形成EMI屏蔽，可以考虑良好的EMI屏蔽效应，并且可以在不同的芯片或衬底之间减少可能由EMI效应引起的信号失真。
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公开(公告)号：US20130328584A1
公开(公告)日：2013-12-12
申请号：US13588086
申请日：2012-08-17
CPC分类号： G01R1/0408 , G01R31/2831 , G01R31/2886
摘要： Disclosed is a testing apparatus, including: a base having opposite upper and lower surfaces, and a plurality of electrical circuits formed in the base, each of the electrical circuits extending from the upper surface to the lower surface and bending backwards to the upper surface such that two terminal ends of the electrical circuit are located on the upper surface. While in a testing, an element is disposed on the upper surface of the base such that testing probes are placed on the electrical contact spots of both the element and the upper surface of the base, thus without resorting to double sided testing that testing probes are placed on the upper and lower surfaces of the element as mentioned in the prior art. Hence, the testing apparatus and testing method can simplify the testing process and prevent the element from damage caused by mechanical stresses of the testing probes.
摘要翻译： 公开了一种测试装置，包括：具有相对的上表面和下表面的基座和形成在基部中的多个电路，每个电路从上表面延伸到下表面并向后弯曲到上表面， 电路的两个末端位于上表面。 在测试中，将元件设置在基座的上表面上，使得测试探针放置在基座的元件和上表面的电接触点上，因此不需要进行双面测试，测试探针 放置在元件的上表面和下表面上，如现有技术中所述。 因此，测试装置和测试方法可以简化测试过程，并防止元件受到测试探针的机械应力所造成的损坏。
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公开(公告)号：US20130286685A1
公开(公告)日：2013-10-31
申请号：US13848031
申请日：2013-03-20
申请人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
发明人： Chiao-Chih Yang , Chao-Chun Cheng , Hsin-Hung Lee , Wei-Ching Wu , Yen-Hao Chen
IPC分类号： F21V8/00
CPC分类号： G02B6/0011 , G02B6/0021 , G02B6/0068
摘要： A light source module including a light guide plate, a plurality of light emitting devices, and a plurality of first reflective devices is provided. The light guide plate has a plurality of through holes and a light emitting surface. The through holes pass through the light emitting surface. Each of the through holes has a first side wall and a second side wall opposite the first side wall. At least one of the light emitting devices is disposed in each of the through holes. Each of the light emitting devices is capable emitting a light beam. The light beam enters the light guide plate from the first side wall of the through hole which the light emitting device is disposed in and leaves the light guide plate from the light emitting surface. The first reflective devices are disposed on the second side walls of the through holes.
摘要翻译： 提供了包括导光板，多个发光装置和多个第一反射装置的光源模块。 导光板具有多个通孔和发光面。 通孔穿过发光表面。 每个通孔具有与第一侧壁相对的第一侧壁和第二侧壁。 至少一个发光器件设置在每个通孔中。 每个发光器件都能够发射光束。 光束从设置有发光元件的通孔的第一侧壁进入导光板，并从导光板离开发光面。 第一反射装置设置在通孔的第二侧壁上。
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