公开(公告)号：US20120186852A1

公开(公告)日：2012-07-26

申请号：US13326370

申请日：2011-12-15

申请人： Ming-Hung Lin ,  Tasi-Tung Kuo ,  Kuan-Cheng Liu ,  Ying-Chien Lee ,  Kuo-Pin Chiu

发明人： Ming-Hung Lin ,  Tasi-Tung Kuo ,  Kuan-Cheng Liu ,  Ying-Chien Lee ,  Kuo-Pin Chiu

IPC分类号： B21D39/00 ,  B23K1/20 ,  H01B5/00 ,  H05K3/00

CPC分类号： H01L24/05 ,  C23C18/165 ,  C23C18/54 ,  H01L24/03 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48844 ,  H01L2224/85 ,  H01L2224/85444 ,  H01L2924/00011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15787 ,  Y10T428/12535 ,  H01L2924/00014 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/01006

摘要： Disclosed is a structure of electrolessly palladium (Pd) and gold (Au) plated films on a bonding pad, comprising a Pd plated layer on the bonding pad; and an Au plated layer on the Pd plated layer. Also disclosed is an assembled structure formed of the electrolessly Pd—Au plated films wire-bonded with a copper (Cu) or Pd—Cu wire to the Au plated layer. In addition, a process for producing the structure of the electrolessly Pd—Au plated films and an assembling process for the assembled structure are disclosed. According to the present invention, the Pd plated layer is used to replace the conventional nickel layer so as to enhance the wire-bonding strength between the Cu or Pd—Cu wire and the bonding pad.

摘要翻译： 公开了一种在接合焊盘上的无电解钯（Pd）和金（Au）镀膜的结构，包括在焊盘上的Pd镀层; 以及Pd镀层上的Au镀层。 还公开了由与Cu（Cu）或Pd-Cu线引线键合到Au镀层的无电Pd-Au电镀膜形成的组装结构。 另外，公开了一种用于制造无电解Pd-Au镀膜的结构的方法和组装结构的组装工艺。 根据本发明，使用Pd镀层来代替常规的镍层，以增强Cu或Pd-Cu线与接合焊盘之间的引线接合强度。