公开(公告)号：US3999282A

公开(公告)日：1976-12-28

申请号：US71810

申请日：1970-09-14

申请人： Minoru Ono ,  Toshimitsu Momoi ,  Youji Kawachi

发明人： Minoru Ono ,  Toshimitsu Momoi ,  Youji Kawachi

IPC分类号： H01L21/3105 ,  H01L21/326 ,  H01L29/00 ,  H01L29/04 ,  B01J17/00

CPC分类号： H01L29/045 ,  H01L21/3105 ,  H01L21/326 ,  H01L29/00 ,  Y10S438/91

摘要： A silicon crystal body having a major surface lying parallel to a {110} or {100} crystal plane is prepared. A silicon oxide film is formed on the major surface by heating the body in an atmosphere containing steam. Then, an aluminum layer is formed on the oxide film. Thereby the amount of surface donors induced in the major surface of the body by the existence of the oxide film is smaller than the amount of induced surface donors to be obtained in a crystal plane of a like silicon body but lying parallel to a {111} plane covered with a like oxide film. The amount of induced surface donors is further reduced by subjecting said body to a heat treatment under application across said oxide film of such a voltage as that which renders the aluminum layer provided on the oxide film negative polarity. This invention is applied to the manufacture of, for example, MOS field effect transistors, MOS diodes and so-called planar transistors.

摘要翻译： 制备具有平行于{110}或{100}晶面平行的主表面的硅晶体。 通过在包含蒸汽的气氛中加热身体，在主表面上形成氧化硅膜。 然后，在氧化膜上形成铝层。 因此，通过氧化膜的存在，在主体表面诱发的表面供体的量小于在类似硅体的晶面中获得的诱导表面供体的数量，但平行于{111} 平面被类似氧化膜覆盖。 通过在所述氧化膜上施加使得在氧化膜上设置的铝层为负极的电压的电压使所述体进行热处理，进一步降低了诱导表面供体的量。 本发明适用于例如MOS场效应晶体管，MOS二极管和所谓的平面晶体管的制造。

公开(公告)号：US4977441A

公开(公告)日：1990-12-11

申请号：US515344

申请日：1990-04-30

申请人： Hideya Ohtani ,  Toshimitsu Momoi ,  Eiji Ooi ,  Shuhei Sakuraba ,  Masayuki Morita ,  Yoshiaki Wakashima

发明人： Hideya Ohtani ,  Toshimitsu Momoi ,  Eiji Ooi ,  Shuhei Sakuraba ,  Masayuki Morita ,  Yoshiaki Wakashima

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/58

CPC分类号： H01L22/32 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/82 ,  H01L24/86 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2224/7665 ,  H01L2224/7965 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14

摘要： According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier, the control signal lead being formed on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length. This provision enables a plurality of semiconductor devices mounted on the tape carrier to be subjected to an aging, namely, a reliability test under a thermal environment and in the operating state, and hence an efficient reliability test can be achieved with an effect of the mass production. Consequently, a highly reliable semiconductor device can be provided.

摘要翻译： 根据本发明，制备了一种载带，其包括一个电源主干线，该电源主干线包括作为用于每个载带单元的电源引线的分支的电连接，以及具有电连接作为接地引线的分支的地线， 每个载带单元，沿着带载体的纵向方向连续形成的电源线和主干线，以及用于控制信号的引线，用于经由用于半导体芯片的老化布线沿着带状物的纵向方向建立导电， 在带载体上进行同时多点（组合）接合，控制信号引线形成在载带上。 通过将具有老化布线的半导体芯片安装在带载体上，能够施加电源电压并将控制信号提供给多个半导体颗粒中的每一个，因此可以同时进行半导体的操作测试 安装在具有任意长度的带状载体上的颗粒。 通过这样的配置，能够使安装在带载体上的多个半导体装置经受老化，即在热环境下和运行状态下的可靠性试验，因此可以实现质量的有效的可靠性试验 生产。 因此，可以提供高度可靠的半导体器件。

公开(公告)号：US4792532A

公开(公告)日：1988-12-20

申请号：US946951

申请日：1986-12-29

申请人： Hideya Ohtani ,  Toshimitsu Momoi ,  Eiji Ooi ,  Shuhei Sakuraba ,  Masayuki Morita ,  Yoshiaki Wakashima

发明人： Hideya Ohtani ,  Toshimitsu Momoi ,  Eiji Ooi ,  Shuhei Sakuraba ,  Masayuki Morita ,  Yoshiaki Wakashima

IPC分类号： H01L21/60 ,  H01L23/495 ,  H01L23/498 ,  H01L23/58 ,  H01L23/48

CPC分类号： H01L22/32 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/24 ,  H01L24/82 ,  H01L24/86 ,  H01L2224/24137 ,  H01L2224/24226 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  Y10T29/49004 ,  Y10T29/49121

摘要： According to the present invention, a tape carrier is prepared which comprises a power trunk line including an electric connection as a branch of a power lead for each tape carrier unit and a ground trunk line having an electric connection as a branch of a ground lead for each tape carrier unit, the power and trunk lines being continuously formed along the longitudinal direction of the tape carrier, and a lead for a control signal for establishing an electric conduction along the longitudinal direction of the tape carrier via an aging wiring for semiconductor pellets to conduct a simultaneous multipoint (gang) bonding on the tape carrier. By mounting the semiconductor pellets having the aging wiring on the tape carrier, it is enabled to apply the power voltage and to supply the control signal to each of the plurality of the semiconductor pellets, and hence the operation test can be simultaneously conducted for the semiconductor pellets mounted on the tape carrier having an arbitrary length. This provision enables a plurality of semiconductor devices mounted on the tape carrier to be subjected to an aging, namely, a reliability test under a thermal environment and in the operating state, and hence an efficient reliability test can be achieved with an effect of the mass production. Consequently, a highly reliable semiconductor device can be provided.

摘要翻译： 根据本发明，制备了一种载带，其包括一个电源主干线，该电源主干线包括作为用于每个载带单元的电源引线的分支的电连接，以及具有作为接地引线分支的电连接的地线， 每个载带单元，沿着带载体的纵向方向连续形成的电源线和主干线，以及用于控制信号的引线，用于经由用于半导体芯片的老化布线沿着带状物的纵向方向建立导电， 在胶带载体上进行同时多点（帮派）接合。 通过将具有老化布线的半导体芯片安装在带载体上，能够施加电源电压并将控制信号提供给多个半导体颗粒中的每一个，因此可以同时进行半导体的操作测试 安装在具有任意长度的带状载体上的颗粒。 通过这样的配置，能够使安装在带载体上的多个半导体装置经受老化，即在热环境下和运行状态下的可靠性试验，因此可以实现质量的有效的可靠性试验 生产。 因此，可以提供高度可靠的半导体器件。