公开(公告)号：US06787389B1

公开(公告)日：2004-09-07

申请号：US09695311

申请日：2000-10-25

申请人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

发明人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.

摘要翻译： 提供分立半导体器件，特别是用于具有较小封装面积的小信号操作的分立半导体器件，并且具有优异的高频特性和良好的散热性能及其制造方法。 分立半导体元件安装在芯片接合焊盘和引线接合焊盘上，封装表面用树脂密封，并将芯片焊盘和背面焊盘的背面直接连接到母板上。

公开(公告)号：US6163069A

公开(公告)日：2000-12-19

申请号：US70724

申请日：1998-05-01

申请人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

发明人： Minoru Oohira ,  Kenji Ohgiyama ,  Teruhisa Fujihara

IPC分类号： H01L23/28 ,  H01L21/56 ,  H01L21/68 ,  H01L23/12 ,  H01L23/31 ,  H05K1/02 ,  H05K3/34 ,  H01L23/34 ,  H05K1/18

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2224/0603 ,  H01L2224/32013 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19043 ,  H05K1/0201 ,  H05K3/341 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012

摘要： Provide a discrete semiconductor device, particularly a discrete semiconductor device for small signal operation with a smaller packaging area and has excellent high frequency characteristics and good heat dissipation performance, and a method for producing the same. The discrete semiconductor elements are mounted on die bond pads and wire bond pads with the packaging surface being sealed with a resin, and connecting the back faces of the die bond pads and the wire bond pads directly to a mother board.

摘要翻译： 提供分立半导体器件，特别是用于具有较小封装面积的小信号操作的分立半导体器件，并且具有优异的高频特性和良好的散热性能及其制造方法。 分立半导体元件安装在芯片接合焊盘和引线接合焊盘上，封装表面用树脂密封，并将芯片焊盘和背面焊盘的背面直接连接到母板上。

公开(公告)号：US06462406B2

公开(公告)日：2002-10-08

申请号：US09234712

申请日：1999-01-21

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Atsushi Yamasaki

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Atsushi Yamasaki

IPC分类号： H01L2348

CPC分类号： H01L21/6836 ,  H01L23/3107 ,  H01L23/544 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2223/54473 ,  H01L2224/29007 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/4826 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device including at least one die bond pad; at least one semiconductor element mounted on the at least one die bond pad; a plurality of substantially parallel wire bond pads connected to electrodes of the at least one semiconductor element, and disposed substantially in parallel to the at least one die bond pad in a longitudinal direction; and a sealing resin configured to mold the at least one semiconductor element, wherein back surfaces of the at least one die bond pad and the plurality of parallel wire bond pads are free from the sealing resin.

摘要翻译： 一种半导体器件，包括至少一个管芯接合焊盘; 安装在所述至少一个管芯接合焊盘上的至少一个半导体元件; 连接到所述至少一个半导体元件的电极并且沿纵向方向基本上平行于所述至少一个管芯接合焊盘设置的多个基本平行的引线接合焊盘; 以及密封树脂，其被配置为模制所述至少一个半导体元件，其中所述至少一个管芯接合焊盘和所述多个平行引线接合焊盘的后表面不与所述密封树脂一起形成。

公开(公告)号：US06372546B2

公开(公告)日：2002-04-16

申请号：US09828132

申请日：2001-04-09

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

摘要翻译： 提供一种制造半导体器件的方法，其中半导体元件通过使用相同的引线等方式用树脂密封而与半导体元件的规格无关，以及可以减小尺寸和重量并具有良好散热性的半导体器件 性能和高频性能。半导体器件可以通过将多个半导体元件安装在具有彼此大致平行布置的引线的引线框架上，用树脂密封整体并切断各个半导体器件来制造。

公开(公告)号：US06252306B1

公开(公告)日：2001-06-26

申请号：US09234321

申请日：1999-01-21

申请人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

发明人： Kenji Ohgiyama ,  Teruhisa Fujihara ,  Tamotsu Ueda

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： Providing a method of producing a semiconductor device wherein semiconductor element are sealed with a resin by using the same lead and other means regardless of the specifications of the semiconductor elements, and a semiconductor device which can be reduced in size and weight and has good heat dissipation performance and high-frequency performance. The semiconductor devices can be produced by mounting a plurality of the semiconductor elements on the lead frame having leads disposed substantially parallel to each other, sealing the whole with a resin, and cutting off the individual semiconductor devices.

摘要翻译： 提供一种制造半导体器件的方法，其中半导体元件通过使用相同的引线等方式用树脂密封而与半导体元件的规格无关，以及可以减小尺寸和重量并具有良好散热性的半导体器件 性能和高频性能。 半导体器件可以通过将多个半导体元件安装在具有彼此大致平行布置的引线的引线框架上，用树脂密封整体并切断各个半导体器件来制造。