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公开(公告)号：US11594464B2
公开(公告)日：2023-02-28
申请号：US17075795
申请日：2020-10-21
发明人： Tetsuo Yamashita , Koichi Masuda , Hiroki Muraoka
IPC分类号： H01L23/367 , H01L23/373 , H01L23/31 , H01L23/433
摘要： A semiconductor device includes a semiconductor element, a base plate, and a plurality of contact materials. The base plate has a front surface holding the semiconductor element and a rear surface to which a cooling body to cool the semiconductor element is attachable. The plurality of contact materials are discretely arranged on the rear surface of the base plate. The plurality of contact materials are materials for bridging a gap on a heat dissipation path between the base plate and the cooling body. The plurality of contact materials each have a volume based on a bowed shape of the rear surface of the base plate. From among the plurality of contact materials, a contact material at a concave of the bowed shape has a greater volume than a contact material at a convex of the bowed shape.
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公开(公告)号：US10790242B2
公开(公告)日：2020-09-29
申请号：US16385683
申请日：2019-04-16
IPC分类号： H01L23/00 , H01L21/48 , H01L21/52 , H01L23/045 , H01L23/053 , H01L23/10 , H01L23/24
摘要： According to the present invention, a semiconductor device includes a substrate having a metallic pattern formed on a top surface of the substrate, a semiconductor chip provided on the metallic pattern, a back surface electrode terminal in flat plate form connected to the metallic pattern with a wire, a front surface electrode terminal in flat plate form, the front surface electrode terminal being in parallel to the back surface electrode terminal above the back surface electrode terminal, extending immediately above the semiconductor chip, and being directly joined to a top surface of the semiconductor chip, a case surrounding the substrate and a seal material for sealing an inside of the case.
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公开(公告)号：US20140367069A1
公开(公告)日：2014-12-18
申请号：US14370545
申请日：2013-02-14
发明人： Kouji Yamaguchi , Hideyuki Ogata , Takashi Ikeda , Masatomo Hatta , Keichi Ochiai , Tetsuo Yamashita , Tetsuya Tazawa , Keisuke Tomomura , Toshiya Yamauchi
CPC分类号： F24F7/10 , F24F1/0007 , F24F1/0011 , F24F3/00 , F24F7/007 , F24F11/79 , F24F13/14 , F24F2001/004
摘要： A floor-positioned air-conditioning apparatus including a housing including a fan and a heat exchanger; a forward blowing control member rotatably arranged at a forward air outlet formed in a housing front surface at a position near a housing top surface; and an upward blowing control member rotatably arranged at an upward air outlet formed near the housing front surface are included. The forward blowing control member closes the forward air outlet and the upward blowing control member closes the upward air outlet during operation stop. The forward blowing control member closes the forward air outlet and the upward blowing control member is rotated and opens the upward air outlet during cooling operation. The upward blowing control member closes the upward air outlet and the forward blowing control member is rotated and opens the forward air outlet during heating operation.
摘要翻译： 一种地板式空调装置，包括：壳体，包括风扇和热交换器; 前吹风控制构件，其可旋转地布置在形成在壳体前表面中的靠近壳体顶表面的位置的前进气出口处; 并且包括可旋转地布置在形成在壳体前表面附近的向上的空气出口处的向上吹送控制构件。 前进吹出控制部件关闭前进气出口，向上吹出控制部件在运转停止期间闭合向上的出气口。 前吹风控制构件关闭前进气出口，并且向上吹送控制构件旋转，并且在制冷操作期间打开向上的空气出口。 向上吹风控制构件关闭向上的空气出口，并且向前吹送控制构件旋转，并且在加热操作期间打开前进气出口。
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公开(公告)号：US10347593B2
公开(公告)日：2019-07-09
申请号：US15841355
申请日：2017-12-14
IPC分类号： H01L23/00 , H01L21/48 , H01L21/52 , H01L23/045 , H01L23/10 , H01L23/053
摘要： According to the present invention, a semiconductor device includes a substrate having a metallic pattern formed on a top surface of the substrate, a semiconductor chip provided on the metallic pattern, a back surface electrode terminal in flat plate form connected to the metallic pattern with a wire, a front surface electrode terminal in flat plate form, the front surface electrode terminal being in parallel to the back surface electrode terminal above the back surface electrode terminal, extending immediately above the semiconductor chip, and being directly joined to a top surface of the semiconductor chip, a case surrounding the substrate and a seal material for sealing an inside of the case.
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公开(公告)号：US10564048B2
公开(公告)日：2020-02-18
申请号：US16271412
申请日：2019-02-08
摘要： According to the present invention, a semiconductor device includes a semiconductor chip, resistance of which changes in accordance with temperature, an external resistor connected in series with the semiconductor chip and a detector configured to detect, while a first voltage is applied between both ends of a series circuit formed by the semiconductor chip and the external resistor, a second voltage applied between both ends of the external resistor, wherein the detector calculates a temperature of the semiconductor chip from the second voltage.
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公开(公告)号：US09721861B2
公开(公告)日：2017-08-01
申请号：US14687371
申请日：2015-04-15
发明人： Yoshitaka Otsubo , Takuya Takahashi , Masaomi Miyazawa , Tetsuo Yamashita , Tomohiro Hieda , Mituharu Tabata
IPC分类号： H05K7/20 , H01L23/24 , H01L23/36 , H01L23/373 , H01L23/498 , H01L23/057 , H01L23/473
CPC分类号： H01L23/24 , H01L23/057 , H01L23/36 , H01L23/3735 , H01L23/49811 , H01L2224/48091 , H01L2224/49113 , H01L2224/73265 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor device includes a semiconductor element and a ceramic circuit substrate on which the semiconductor element is mounted. The ceramic circuit substrate includes a ceramic substrate having one surface and the other surface facing each other, a metal circuit board joined to the one surface of the ceramic substrate and electrically connected to the semiconductor element, and a metal heat-dissipation plate joined to the other surface of the ceramic substrate. The metal circuit board is greater in thickness than the metal heat-dissipation plate. A surface of the metal heat-dissipation plate on a side opposite to the ceramic substrate is larger in area than a surface of the metal circuit board on a side opposite to the ceramic substrate. Thereby, a semiconductor device capable of suppressing warpage of the ceramic substrate can be achieved.
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公开(公告)号：US09157673B2
公开(公告)日：2015-10-13
申请号：US14527163
申请日：2014-10-29
发明人： Takashi Ikeda , Tetsuo Yamashita
CPC分类号： F25D17/06 , F04D17/04 , F04D29/4206 , F24F1/0007 , F24F1/0025 , F24F13/24 , F24F2001/0048
摘要： An upper suction port is formed in a main-body upper part of an air-conditioning apparatus main body, a suction opening part is formed in a front grill disposed on a main-body front face of the air-conditioning apparatus, a suction opening whose opening is directed upward is formed by consecutively providing an air guide wall inclined downward inside the main body on the upper edge of the suction opening, and the suction opening is located between a part, in the main-body height direction, lower than a straight line passing through a rotation center of an impeller and a closest contact point between the impeller and a front-face heat exchanger and a part, in the main-body height direction, higher than a straight line parallel with the straight line and passing through the impeller and a tongue part of a stabilizer.
摘要翻译： 在空调装置主体的主体上部形成有上吸入口，在设置在空调装置的主体前面的前格栅上形成吸入口部，吸入口 其开口朝向上方形成有连续地设置在吸入口的上边缘的主体内向下倾斜的导气壁，吸入口位于主体高度方向的一部分之间，低于 通过叶轮的旋转中心的直线和叶轮与前表面热交换器之间的最接近的接触点，并且在主体高度方向上的直线高于与直线平行的直线并通过 叶轮和稳定器的舌部分。
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