摘要:
A protection circuit is inserted between a signal input pad and an internal circuit. The protection circuit includes a parasitic bipolar transistor which is obtained by forming high-impurity concentration semiconductor regions in the major-surface region of a substrate. In practice, it is hard to provide a parasitic bipolar transistor of a sufficiently large size, since the reduction of the size of a chip is a recent trend. With this in mind, a third semiconductor region serving as an electron-trapping region is formed in a region outside of the location where the parasitic bipolar transistor is formed. If an excessive voltage produced by ESD or the like is applied to the pad, and the excessive voltage uncontrollable by the parasitic bipolar transistor, the third semiconductor region absorbs the excessive voltage. In particular, where the current capacity of the parasitic bipolar transistor is small, the third semiconductor region reliably prevents electrostatic destruction of a circuit element. Accordingly, the protection circuit enables the parasitic bipolar transistor to be reduced in size, thus contributing to miniaturization of a chip. Moreover, the protection circuit is reliable in operation.
摘要:
A semiconductor device comprises a semiconductor chip and a memory array constituted by a plurality of memory blocks formed in the semiconductor chip and each having the essentially same construction and a plurality of bit lines arranged in columns at a predetermined interval. The semiconductor device further comprises a dummy wiring pattern arranged ajacent to the memory array in the semiconductor chip and including a dummy wiring layer set apart from outermost bit lines of each memory block a distance equal to the predetermined interval.
摘要:
A p-well region (16) is formed in the main surface area of an n-type semiconductor substrate (11). A potential (V.sub.BB) which is lower than an externally input potential is applied to the p-well region (16). In the surface area of the p-well region (16), a first impurity diffused layer (12) of n-type to which the externally input potential (Vin) is applied and a second impurity diffused layer (13) of n-type to which a reference potential is applied are formed. The first impurity diffused layer (12) serves as the drain region of a first MOS transistor (Q9) of n-channel formed in the p-well region (16) and the second impurity diffused layer (13) serves as the drain region of a second MOS transistor (Q10) of n-channel which is also formed in the p-well region (16). The first and second MOS transistors (Q9 and Q10) constitute the input section of an input circuit. The input circuit detects the level of the externally input potential (Vin) by comparing the externally input potential (Vin) with the reference potential (Vref).
摘要:
A method of controlling a programming of a flash memory with memory blocks. The method includes checking whether a selected block among the memory blocks belongs to a first group or a second group. The method further includes executing the programming from a least bit address when the selected block belongs to the first group. The method also includes executing the programming from a most bit address when the selected block belongs to the second group.
摘要:
An ASIC includes a first-wire extended in a first-direction and a second-wire extended in a parallel direction to the first-wire and both are placed on a first-wire layer; and a third-wire placed on a second-wire layer above the first-wire layer and is extended above the wire and above the second-wire in a second-direction which intersects the first-direction and passing through a first via-hole is connected to the first-wire, and a fourth-wire separated from the third-wire extended in a parallel direction above the first-wire and above the second-wire and a fifth-wire separated from both the third-wire and the fourth-wire and extended in a parallel direction in a smallest space and passing through a second via-hole is connected to the second-wire, wherein, one end of the fifth-wire is extended to the center between the second-wire and the first-wire from above the second-wire.
摘要:
In a dynamic type memory, a memory cell array is divided into a plurality of sub arrays on a memory chip. Each of the sub arrays is provided with a data line formed in parallel with word lines. Data buffer and multiplexer circuits and I/O pads are arranged on one side of the memory chip in parallel with bit lines. This arrangement allows a data path to be shortened and enables data to be transferred at high speed.
摘要:
A dynamic memory comprises a control circuit for controlling the selection of the row decoder and the activation of the sense amplifiers in accordance with a RAS signal externally supplied thereto and a word line control circuit for controlling a selected word line to turn the electric potentials read out from the memory cells connected to the word line on the bit lines connected to the respective memory cells back to an inactive level after the electric potentials are sensed and amplified by the sense amplifiers corresponding to the respective bit lines during the time period from the time when the RAS signal is turned to an active level and the time when it is turned back to the inactive level. A dynamic memory has gate oxide films are designed to be subjected to a less electric field strength in order to minimize the degradation of reliability and the memory can effectively reduce the fall of the word line driving stepped-up voltage to eliminate the necessity of a leak current compensation circuit. Additionally, the memory reduces the time required to restore the electric potentials for a data reading operation and also the cycle time required for a data writing operation.
摘要:
An ASIC includes a first-wire extended in a first-direction and a second-wire extended in a parallel direction to the first-wire and both are placed on a first-wire layer; and a third-wire placed on a second-wire layer above the first-wire layer and is extended above the wire and above the second-wire in a second-direction which intersects the first-direction and passing through a first via-hole is connected to the first-wire, and a fourth-wire separated from the third-wire extended in a parallel direction above the first-wire and above the second-wire and a fifth-wire separated from both the third-wire and the fourth-wire and extended in a parallel direction in a smallest space and passing through a second via-hole is connected to the second-wire, wherein, one end of the fifth-wire is extended to the center between the second-wire and the first-wire from above the second-wire.
摘要:
A semiconductor memory device includes a silicon chip and sub-arrays formed in the chip. In each of the sub-arrays, memory cells arranged in a matrix form, word lines provided for respective rows of each of the sub-arrays, and bit lines provided for respective columns of each of the sub-arrays are arranged. Further, in the chip, amplifier groups for amplifying data read out from the memory cells are arranged for the respective sub-arrays. Amplifiers connected to respective bit lines are provided in the amplifier groups and the amplifiers each have a function of continuously holding data read out from the memory cell.
摘要:
A NAND flash memory according to examples of the invention includes a memory cell array comprised of first, second, and third NAND blocks disposed in order in a first direction and first and second transfer transistor blocks disposed in order in the first direction at one end in a second direction intersecting with the first direction of the memory cell array. An address allocation to the word lines in the first NAND block is inverted against an address allocation to the word lines in the third NAND block.