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公开(公告)号：US07692892B2
公开(公告)日：2010-04-06
申请号：US11458455
申请日：2006-07-19
CPC分类号： G11B25/043
摘要： An enclosure system includes a motor assembly that has a motor magnet and at least one motor coil. The enclosure system also includes a base coupled to the motor assembly. The base includes a first portion that includes a non-magnetic material and a second portion that includes a magnetic material. The first portion of the base is in closer proximity to the motor magnet than the second portion of the base.
摘要翻译： 外壳系统包括具有马达磁体和至少一个马达线圈的马达组件。 外壳系统还包括联接到马达组件的底座。 底座包括包括非磁性材料的第一部分和包括磁性材料的第二部分。 基座的第一部分比基座的第二部分更靠近马达磁体。
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公开(公告)号：US20080019038A1
公开(公告)日：2008-01-24
申请号：US11458455
申请日：2006-07-19
IPC分类号： G11B17/02
CPC分类号： G11B25/043
摘要： An enclosure system includes a motor assembly that has a motor magnet and at least one motor coil. The enclosure system also includes a base coupled to the motor assembly. The base includes a first portion that includes a non-magnetic material and a second portion that includes a magnetic material. The first portion of the base is in closer proximity to the motor magnet than the second portion of the base.
摘要翻译： 外壳系统包括具有马达磁体和至少一个马达线圈的马达组件。 外壳系统还包括联接到马达组件的底座。 底座包括包括非磁性材料的第一部分和包括磁性材料的第二部分。 基座的第一部分比基座的第二部分更靠近马达磁体。
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公开(公告)号：US07616401B2
公开(公告)日：2009-11-10
申请号：US11241038
申请日：2005-09-30
IPC分类号： G11B5/012
CPC分类号： G11B5/012 , B22F3/225 , B22F2998/10 , G11B25/043 , G11B33/121 , B22F1/0059 , B22F3/10
摘要： The present invention provides a data storage system. The data storage system includes a metal injected molded base. The metal injection molded base includes a metal injection molded platform and at least one metal injection molded three-dimensional feature. The at least one metal injection molded three-dimensional feature is formed integrally and simultaneously with the metal injection molded platform. The at least one three-dimensional feature configured to mount data storage system components to the platform.
摘要翻译： 本发明提供一种数据存储系统。 数据存储系统包括金属注射成型基座。 金属注射成型基座包括金属注射成型平台和至少一种金属注射成型的三维特征。 至少一个金属注射成型的三维特征与金属注射成型平台一体地形成。 所述至少一个三维特征被配置成将数据存储系统组件安装到所述平台。
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公开(公告)号：US20080124239A1
公开(公告)日：2008-05-29
申请号：US11241038
申请日：2005-09-30
CPC分类号： G11B5/012 , B22F3/225 , B22F2998/10 , G11B25/043 , G11B33/121 , B22F1/0059 , B22F3/10
摘要： The present invention provides a data storage system. The data storage system includes a metal injected molded base. The metal injection molded base includes a metal injection molded platform and at least one metal injection molded three-dimensional feature. The at least one metal injection molded three-dimensional feature is formed integrally and simultaneously with the metal injection molded platform. The at least one three-dimensional feature configured to mount data storage system components to the platform.
摘要翻译： 本发明提供一种数据存储系统。 数据存储系统包括金属注射成型基座。 金属注射成型基座包括金属注射成型平台和至少一种金属注射成型的三维特征。 至少一个金属注射成型的三维特征与金属注射成型平台一体地形成。 所述至少一个三维特征被配置成将数据存储系统组件安装到所述平台。
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5.发明授权Base deck with formed-in-place gaskets and impact dissipation members for a data storage device 有权具有成形垫片和数据存储装置的冲击耗散构件的底座公开(公告)号：US07372662B2
公开(公告)日：2008-05-13
申请号：US10640927
申请日：2003-08-14
申请人： Mo Xu , YiRen Hong , PohLye Lim , Niroot Jierapipatanakul
发明人： Mo Xu , YiRen Hong , PohLye Lim , Niroot Jierapipatanakul
IPC分类号： G11B33/08 , G11B33/14 , G11B17/028 , G11B21/08 , G11B25/04
CPC分类号： G11B25/043 , G11B33/1466
摘要： A base deck is provided and includes a base plate having a plurality of parallel surfaces and a plurality of gasket retention grooves formed. A first gasket retention groove is formed in one of the plurality of parallel surfaces that is proximate a top cover. A second gasket retention groove is formed in one of the plurality of parallel surfaces and at least partially surrounds a motor mounting aperture. A third gasket retention groove is formed in one of the plurality of parallel surfaces and at least partially surrounds a connector mounting aperture. A first cured-in-place elastomer is formed on the base plate and is confined by the first gasket retention groove. A second cured-in-place elastomer is formed on the base plate and is confined by the second gasket retention groove. A third cured-in-place elastomer is formed on the base plate and is confined by the third gasket retention groove.
摘要翻译： 提供底座，并且包括具有多个平行表面的基板和形成的多个垫圈保持槽。 第一垫片保持槽形成在靠近顶盖的多个平行表面中的一个中。 第二垫圈保持槽形成在所述多个平行表面中的一个平行表面中，并且至少部分地围绕电动机安装孔。 第三垫片保持槽形成在所述多个平行表面中的一个平行表面中，并且至少部分地围绕连接器安装孔。 第一固化弹性体形成在基板上并被第一垫片保持槽限制。 第二固化弹性体形成在基板上并被第二垫圈保持槽约束。 第三固化弹性体形成在基板上并被第三垫片保持槽约束。
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公开(公告)号：US07271513B2
公开(公告)日：2007-09-18
申请号：US11106952
申请日：2005-04-15
申请人： Mo Xu , Poh Lye Lim , WaiOnn Chee , Niroot Jierapipatanakul
发明人： Mo Xu , Poh Lye Lim , WaiOnn Chee , Niroot Jierapipatanakul
IPC分类号： H02K5/00
CPC分类号： G11B25/043 , B29C45/14778 , B29C71/02 , B29C2045/14893 , B29C2071/022 , B29K2705/00
摘要： A method of manufacturing and an overmolded mounting base. A plate is provided with mounting surfaces having a range of alignments including a nominal alignment. The plate is overmolded to form an overmolded plate. The overmolding changes the alignment of the mounting surfaces. The overmolded plate is maintained at a creep temperature for a time interval sufficient for creep to restore the alignment toward the nominal alignment.
摘要翻译： 一种制造方法和二次成型安装基座。 板上设置有具有包括标称对准的一系列对准的安装表面。 板被包覆成型以形成包覆模制的板。 包覆成型改变了安装表面的对准。 包覆成型的板在蠕变温度下保持足够的时间间隔以使蠕变恢复朝向标称对准的对准。
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公开(公告)号：US20070032103A1
公开(公告)日：2007-02-08
申请号：US11196901
申请日：2005-08-04
申请人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
发明人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
IPC分类号： H05K1/00
CPC分类号： G11B33/02 , G11B33/12 , G11B33/1493
摘要： The invention includes techniques for mounting a printed circuit board (PCB) on a housing for an electronic device. The housing includes a top cover that combines with a base to form an internal space within the housing. The PCB has at least one tab that extends from it and fits within a recess formed by the base to secure the PCB on a side of the base opposite to the internal space. The electronic device may additionally include a shield such that the PCB fits between the shield and the base and the shield assists in securing the PCB to the base. The housing may also include a locking mechanism to constrain the PCB tab to the base. Embodiments of the invention allow for a PCB to be mounted to an electronic device housing without the use of screws.
摘要翻译： 本发明包括用于将印刷电路板（PCB）安装在用于电子设备的外壳上的技术。 壳体包括顶盖，其与基座结合以在壳体内形成内部空间。 PCB具有至少一个从其延伸并且安装在由基座形成的凹部内的突片，以将PCB固定在与内部空间相反的一侧。 电子设备可以另外包括屏蔽，使得PCB配合在屏蔽和基座之间，并且屏蔽件有助于将PCB固定到基座。 壳体还可以包括用于将PCB接头约束到基座的锁定机构。 本发明的实施例允许将PCB安装到电子设备外壳上而不使用螺钉。
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公开(公告)号：US20060232876A1
公开(公告)日：2006-10-19
申请号：US11106952
申请日：2005-04-15
申请人： Mo Xu , Pohlye Lim , WaiOnn Chee , Niroot Jierapipatanakul
发明人： Mo Xu , Pohlye Lim , WaiOnn Chee , Niroot Jierapipatanakul
IPC分类号： G11B17/00
CPC分类号： G11B25/043 , B29C45/14778 , B29C71/02 , B29C2045/14893 , B29C2071/022 , B29K2705/00
摘要： A method of manufacturing and an overmolded mounting base. A plate is provided with mounting surfaces having a range of alignments including a nominal alignment. The plate is overmolded to form an overmolded plate. The overmolding changes the alignment of the mounting surfaces. The overmolded plate is maintained at a creep temperature for a time interval sufficient for creep to restore the alignment toward the nominal alignment.
摘要翻译： 一种制造方法和二次成型安装基座。 板上设置有具有包括标称对准的一系列对准的安装表面。 板被包覆成型以形成包覆模制的板。 包覆成型改变了安装表面的对准。 包覆成型的板在蠕变温度下保持足够的时间间隔以使蠕变恢复朝向标称对准的对准。
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公开(公告)号：US20060187579A1
公开(公告)日：2006-08-24
申请号：US11230838
申请日：2005-09-20
申请人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
发明人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
IPC分类号： G11B33/14
CPC分类号： G11B25/043
摘要： A base assembly for use in an airtight enclosure. The base assembly includes a metal stamped section and an overmold section formed adjacent to the metal stamped section. The overmold section includes at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
摘要翻译： 用于密封外壳的基座组件。 基座组件包括金属冲压部分和邻近金属冲压部分形成的包覆模制部分。 包覆模制部分包括至少一个应力消除特征，用于消除由包覆模制部分施加在金属冲压部分上的变形应力。
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公开(公告)号：US07652845B2
公开(公告)日：2010-01-26
申请号：US11230838
申请日：2005-09-20
申请人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
发明人： Mo Xu , YiRen Hong , Pohlye Lim , Niroot Jierapipatanakul
IPC分类号： G11B5/33
CPC分类号： G11B25/043
摘要： A base assembly for use in an airtight enclosure. The base assembly includes a metal stamped section and an overmold section formed adjacent to the metal stamped section. The overmold section includes at least one stress relief feature for eliminating distortion stresses exerted on the metal stamped section by the overmold section.
摘要翻译： 用于密封外壳的基座组件。 基座组件包括金属冲压部分和邻近金属冲压部分形成的包覆模制部分。 包覆模制部分包括至少一个应力消除特征，用于消除由包覆模制部分施加在金属冲压部分上的变形应力。
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