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    Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding
    2.
    发明授权
    Method for predicting and avoiding a bad bond when utilizing fiber push connect laser bonding 失效
    使用光纤推连接激光焊接时预测和避免不良键的方法

    公开(公告)号：US06236015B1

    公开(公告)日：2001-05-22

    申请号：US09183957

    申请日：1998-10-31

    申请人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

    发明人： Mohammad Akhavain ,  Say-Teng Lai ,  Robert-Scott Melendrino Lopez

    IPC分类号： B23K2600

    CPC分类号： B23K26/22 ,  B23K2101/42 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/18 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L24/80 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  H01L2924/00

    摘要： The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded. The method of the present invention performs optical fiber push laser bonding operations on electric conductor leads includes providing an optical fiber push laser bonding system having an optical fiber for directing a laser beam, positioning first and second electrical leads in a bonding position, holding the first and second electrical leads in contact at a bond surface with an optical fiber, bonding the first and second electrical leads at the bond surface by directing the laser beam through the optical fiber, repeating said positioning, holding and bonding steps for a plurality of bonds, interrupting the aforesaid laser bonding operations in order to examine the condition of the fiber; wherein the following procedures occur during said interrupting directing the laser beam through the optical fiber, capturing the spatial energy distribution of the laser beam exiting the optical fiber and analyzing the spatial energy distribution of the laser beam to determine condition of the optical fiber in order to determine the need for corrective action.

    摘要翻译： 本公开描述了一种用于通过使用连接到将光引导到待粘合点的光纤系统的激光束来执行电连接两个电导体时预测和避免不良键或连接的方法。 该方法提供在发生坏的连接或连接之前快速检测损坏的光纤。 公开了一种用于通过使用附接到将光导向待结合点的光纤系统的激光束来执行两个接触元件的无焊接电连接来预测和避免不良键合或连接的方法。 本发明的方法对导电引线进行光纤激光激光焊接操作包括提供具有用于引导激光束的光纤的光纤推动激光焊接系统，将第一和第二电引线定位在接合位置，保持第一 以及在与光纤的接合表面处接触的第二电引线，通过将激光束引导通过光纤，将第一和第二电引线接合在接合表面，重复多个键的定位，保持和结合步骤， 中断上述激光焊接操作以检查纤维的状况; 其中在所述中断期间发生以下过​​程：激光束通过光纤，捕获离开光纤的激光束的空间能量分布，并分析激光束的空间能量分布，以确定光纤的状态，以便 确定需要采取纠正措施。

    Fluid ejection head assembly
    7.
    发明申请
    Fluid ejection head assembly 失效
    流体喷射头组件

    公开(公告)号：US20050168513A1

    公开(公告)日：2005-08-04

    申请号：US10769429

    申请日：2004-01-30

    申请人： Benjamin Wood ,  Joseph Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    发明人： Benjamin Wood ,  Joseph Scheffelin ,  Noah Lassar ,  Mohammad Akhavain

    IPC分类号： B41J2/16 ,  B41J2/015

    CPC分类号： B41J2/1623 ,  B41J2/1601 ,  B41J2202/20 ,  Y10T29/49114 ,  Y10T29/49155 ,  Y10T29/49401

    摘要： A fluid ejection head of a fluid ejection device is provided, the fluid ejection head having a substrate, a fluid ejection die coupled with the substrate, an electromagnetic radiation-curable adhesive disposed on the substrate, and a cover coupled with the substrate via the electromagnetic radiation-curable adhesive, wherein the cover includes an opening configured to pass fluids ejected from the fluid ejection die, and wherein the cover is made at least partially of a material transparent to electromagnetic radiation.

    摘要翻译： 提供了一种流体喷射装置的流体喷射头，所述流体喷射头具有基底，与所述基底耦合的流体喷射模具，设置在所述基底上的电磁辐射固化粘合剂，以及经由所述电磁线圈与所述基底结合的盖 可辐射固化的粘合剂，其中所述盖包括被配置为使流体从所述流体喷射模头喷射出的流体的开口，并且其中所述盖至少部分地由对电磁辐射透明的材料制成。

    Joining of different materials of carrier for fluid ejection devices
    9.
    发明授权
    Joining of different materials of carrier for fluid ejection devices 失效
    连接不同材料的载体用于流体喷射装置

    公开(公告)号：US06575559B2

    公开(公告)日：2003-06-10

    申请号：US09999531

    申请日：2001-10-31

    申请人： David K McElfresh ,  Mohammad Akhavain ,  Joseph E Scheffelin ,  Gerald V Rapp ,  Janis Horvath

    发明人： David K McElfresh ,  Mohammad Akhavain ,  Joseph E Scheffelin ,  Gerald V Rapp ,  Janis Horvath

    IPC分类号： B41J215

    CPC分类号： B41J2/15 ,  B41J2/14024 ,  B41J2/1408 ,  B41J2/14201 ,  B41J2/155 ,  B41J2202/03 ,  B41J2202/20

    摘要： A carrier for a plurality of fluid ejection devices includes a substrate and a substructure. The substrate includes a first material and has a first side adapted to receive the fluid ejection devices and a second side opposite the first side, and the substructure is formed of a second material and joined to the second side of the substrate with a lap joint. The lap joint includes a first portion formed by a portion of one of the substrate and the substructure, a second portion formed by a portion of the other of the substrate and the substructure, and a third material interposed between the first portion and the second portion.

    摘要翻译： 用于多个流体喷射装置的载体包括基底和子结构。 衬底包括第一材料并且具有适于容纳流体喷射装置的第一侧和与第一侧相对的第二侧，并且底部结构由第二材料形成并且用搭接接头连接到衬底的第二侧。 搭接接头包括由基板和子结构中的一个的一部分形成的第一部分，由基板和子结构中的另一个的一部分形成的第二部分，以及插入在第一部分和第二部分之间的第三材料 。

    Methods for forming and protecting electrical interconnects and resultant assemblies
    10.
    发明授权
    Methods for forming and protecting electrical interconnects and resultant assemblies 有权
    用于形成和保护电互连和所得组件的方法

    公开(公告)号：US07338149B2

    公开(公告)日：2008-03-04

    申请号：US11166301

    申请日：2005-06-24

    申请人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    发明人： Mohammad Akhavain ,  Joseph E. Scheffelin ,  Noah Lassar ,  Conrad Lepe

    IPC分类号： B41J2/14 ,  B41J2/16

    CPC分类号： H05K3/284 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14491 ,  B41J2202/20 ,  H05K3/3421 ,  H05K2201/10977 ,  H05K2203/0126

    摘要： The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.

    摘要翻译： 所描述的实施例涉及用于形成和保护电互连组件的方法和系统。 在一个实施例中，电互连组件形成方法形成第一支撑结构的一个或多个导体与第二支撑结构的一个或多个导体之间的电互连。 该方法还将通常可流动的材料分布在电互连上并且将大体上可流动的材料暴露于足以使总体上可流动的材料进入通常不可流动的状态以向电互连提供流体保护并支持电互连以减少应力 浓度在电互连。