摘要:
The invention provides a heat exchanger assembly for cooling an electronic device wherein the upper portion of the housing includes a plurality of condensing tubes extending upwardly from the lower portion of the housing. A plurality of air heat transfer fins zigzag transversely to a primary axis (A) between adjacent ones of the condensing tubes for dissipating heat from vapor boiled off of the refrigerant. At least two next adjacent condensing tubes of the plurality diverge upwardly from the bottom ends toward the top distal ends thereof. Accordingly, the space containing the air heat transfer fins between the two next adjacent condensing tubes is greater at the top distal ends than at the bottom ends of the condensing tubes. The condensing tubes can either have a constant cross-section with diverging tube axes or can have a decreasing cross-section from bottom to top with parallel tube axes.
摘要:
A thermosiphon cooling assembly for dissipating heat generated by an electronic device includes a housing having a housing top, housing bottom and opposing sides. The opposing sides extend between the housing top and the housing bottom to define a low profile entrance and a low profile exit. A refrigerant is disposed within one or more boiling chambers. Heat generated by the electronic device is transferred to the refrigerant by the boiling chambers for liquid-to-vapor transformation. Condenser tubes having a bottom end and a top end extend from the boiling chambers at a diagonally upward angle across the sides between the housing bottom and housing top. The condenser tubes receive and condense vapor boiled off from the refrigerant. Air moving devices axially move air through the housing. Air is flowed across the condenser tubes to facilitate condensation.
摘要:
A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.
摘要:
A thermosiphon cooling assembly includes a refrigerant disposed in a lower portion of a housing for undergoing a liquid-to-vapor-to-condensate cycle. A mixing device is disposed within the lower portion of the housing for increasing the transfer of heat from the electronic device during the liquid-to-vapor-to-condensate cycle. The mixing device may include a vapor stirrer disposed above the liquid of the refrigerant and/or a liquid stirrer disposed in the liquid of the refrigerant for moving the liquid of the refrigerant over a boiler plate.
摘要:
An orientation insensitive heat exchanger assembly includes a housing having an upper portion including condensing tubes extending upwardly and intersecting a top wall of the lower portion. The condensing tubes are spaced equally from one another circumferentially and radially from the central axis and extend outwardly at a predetermined angle from the central axis. A fan assembly is disposed along a central axis extending upwardly from a center of the housing wherein the condensing tubes surround the fan assembly and the fan moves air radially out through the spaces between the condensing tubes.
摘要:
A fluid heat exchanger assembly having an upper wall and a lower wall extending between the inlet and the outlet for establishing a direction of flow to cool an electronic device. A plurality of projections extend linearly transversely across the direction of flow to define rows of projections with linear cavities between adjacent projections so that fluid flows into and out of the cavities as the fluid flows across the rows of projections for contraction and expansion of the coolant flow to maximize heat transfer. The projections may be rectangular, triangular or convex, as viewed in cross section.
摘要:
The invention provides a fluid heat exchange assembly comprising a housing containing a liquid refrigerant presenting a surface. A tube is coiled in adjacent coils around an axis parallel to the surface of the liquid refrigerant with a first sector of each coil disposed below the liquid surface and a second sector of each coil disposed above the liquid surface whereby said tube runs into and out of said liquid refrigerant.
摘要:
An electronics cabinet for storing a plurality of electronic devices therein is provided and includes a fan and an evaporative cooler. The fan draws a flow of air into the cabinet, circulates the flow of air through the evaporative cooler, and then across the electronic devices for removing heat produced by the electronic devices. The evaporative cooler removes heat from the flow of air by absorbing heat from the flow of air and then dissipating the heat by evaporating a liquid into a secondary airflow, which is directed out of the cabinet. The cabinet includes a cold air plenum having an actuator for adjusting a cross-sectional area of the cold air plenum to control the airflow through each of the supports.
摘要:
A portable air conditioner comprises a tank for storing a liquid therein, a plurality of tubes, and at least one fin disposed between adjacent tubes. The tubes are spaced from one another defining an air passageway therebetween having an air inlet and a dry air outlet. Each tube has a first end extending into the tank in fluid communication with the liquid and a second end extending opposite the tank defining a wet air outlet and a wicking material disposed therein and in fluid communication with the liquid. A sheet valve sealingly engages the dry air outlet and the wet air outlet and is moveable for adjusting an amount of air flow exiting from the dry air outlet and the wet air outlet. At least one aperture is defined within each of the tubes between the ends to divert air flowing through the air passageway into the tubes.
摘要:
A thermosiphon cooling assembly includes a housing having a lower portion and an upper portion. A refrigerant is disposed in the lower portion for liquid-to-vapor transformation. A boiler plate defines an outer bottom wall of the housing for transferring heat from the electronic device to the refrigerant. This transfer of heat to the refrigerant leads to a liquid-to-vapor transformation and a pressure build up in the housing. The boiler plate is flexible for reacting with the electronic device in response to the pressure build up in the housing. The boiler plate includes an inflexible first area for overlying the electronic device and a flexible second area which surrounds the first area of the boiler plate. The second area has a thickness t2 less than the thickness t, of the first area thus allowing the boiler plate to flex in the second area.