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    Monolithic duplexer and fabrication method thereof
    5.
    发明申请
    Monolithic duplexer and fabrication method thereof 有权
    单片双工器及其制造方法

    公开(公告)号：US20070024391A1

    公开(公告)日：2007-02-01

    申请号：US11392624

    申请日：2006-03-30

    申请人： Sang-chul Sul ,  Duck-hwan Kim ,  Chul-soo Kim ,  In-sang Song ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jea-shik Shin

    发明人： Sang-chul Sul ,  Duck-hwan Kim ,  Chul-soo Kim ,  In-sang Song ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jea-shik Shin

    IPC分类号： H03H7/46

    CPC分类号： H03H3/02 ,  H03H9/0571 ,  H03H9/706

    摘要： A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a plurality of first ground planes formed between the plurality of elements. A cap wafer is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts, and cavities. Second sealing parts are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes cover the plurality of ground posts. Via holes vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.

    摘要翻译： 一种单片双工器及其制造方法。 单片双工器包括器件晶片，在器件晶片的顶部彼此远离的多个元件，形成在器件晶片的顶部上的第一密封部分和形成在器件晶片的顶部之间的多个第一接地平面 元素。 还提供了盖晶片，其具有用于封装器件晶片，多个突出部分，多个接地柱和空腔的蚀刻区域。 第二密封部分形成在突出部分的底部上，并且多个第二接地平面覆盖多个接地柱。 通孔垂直穿过盖晶片以连接到多个第二接地平面，并且接地端子形成在通孔的顶部上。 第一密封部分和第一接地平面分别附接到第二密封部分和第二接地平面。

    Monolithic duplexer and fabrication method thereof
    6.
    发明授权
    Monolithic duplexer and fabrication method thereof 有权
    单片双工器及其制造方法

    公开(公告)号：US07432781B2

    公开(公告)日：2008-10-07

    申请号：US11392624

    申请日：2006-03-30

    申请人： Sang-chul Sul ,  Duck-hwan Kim ,  Chul-soo Kim ,  In-sang Song ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jea-shik Shin

    发明人： Sang-chul Sul ,  Duck-hwan Kim ,  Chul-soo Kim ,  In-sang Song ,  Moon-chul Lee ,  Kyu-dong Jung ,  Jea-shik Shin

    IPC分类号： H03H7/46

    CPC分类号： H03H3/02 ,  H03H9/0571 ,  H03H9/706

    摘要： A monolithic duplexer and a fabrication method thereof. The monolithic duplexer includes a device wafer, a plurality of elements distanced from each other on a top portion of a device wafer, first sealing parts formed on the top portion of the device wafer, and a plurality of first ground planes formed between the plurality of elements. A cap wafer is also provided having an etched area for packaging the device wafer, a plurality of protrusion parts, a plurality of ground posts, and cavities. Second sealing parts are formed on a bottom portion of the protrusion parts, and a plurality of second ground planes cover the plurality of ground posts. Via holes vertically penetrate the cap wafer to connect to the plurality of the second ground planes, and ground terminals are formed on top portions of the via holes. The first sealing parts and the first ground planes are attached to the second sealing parts and the second ground planes, respectively.

    摘要翻译： 一种单片双工器及其制造方法。 单片双工器包括器件晶片，在器件晶片的顶部彼此远离的多个元件，形成在器件晶片的顶部上的第一密封部分和形成在器件晶片的顶部之间的多个第一接地平面 元素。 还提供了盖晶片，其具有用于封装器件晶片，多个突出部分，多个接地柱和空腔的蚀刻区域。 第二密封部分形成在突出部分的底部上，并且多个第二接地平面覆盖多个接地柱。 通孔垂直穿过盖晶片以连接到多个第二接地平面，并且接地端子形成在通孔的顶部上。 第一密封部分和第一接地平面分别附接到第二密封部分和第二接地平面。

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    7.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US07341888B2

    公开(公告)日：2008-03-11

    申请号：US11435986

    申请日：2006-05-18

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    Balance filter packaging chip having balun mounted therein and manufacturing method thereof
    8.
    发明授权
    Balance filter packaging chip having balun mounted therein and manufacturing method thereof 有权
    具有平衡 - 不平衡转换器的平衡过滤器包装芯片及其制造方法

    公开(公告)号：US08624369B2

    公开(公告)日：2014-01-07

    申请号：US11844084

    申请日：2007-08-23

    申请人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    发明人： Kuang-woo Nam ,  Yun-kwon Park ,  In-sang Song ,  Jea-shik Shin ,  Seok-mo Chang ,  Seok-chul Yun

    IPC分类号： H01L23/02

    CPC分类号： H03H9/0547

    摘要： A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.

    摘要翻译： 提供一种其中安装有平衡 - 不平衡转换器的平衡滤波器封装芯片及其制造方法。 平衡滤波器封装芯片包括器件基板; 安装在装置基板上的平衡过滤器; 层叠在所述器件基板的特定区域上的接合层; 封装基板，其具有形成在所述平衡滤波器上方的空腔，并且通过所述接合层与所述器件基板结合; 位于包装衬底上的某个区域上的平衡 - 不平衡转换器; 以及用于钝化平衡 - 不平衡变换器的绝缘体层。 因此，本发明可以减小元件尺寸并简化制造工艺。

    Apparatus for wireless power transmission using high Q low frequency near magnetic field resonator
    10.
    发明授权
    Apparatus for wireless power transmission using high Q low frequency near magnetic field resonator 有权
    使用高Q低频近场磁场谐振器的无线电力传输装置

    公开(公告)号：US08653909B2

    公开(公告)日：2014-02-18

    申请号：US12591357

    申请日：2009-11-17

    申请人： Eun-seok Park ,  Sang-wook Kwon ,  Jea-shik Shin ,  Young-tack Hong

    发明人： Eun-seok Park ,  Sang-wook Kwon ,  Jea-shik Shin ,  Young-tack Hong

    IPC分类号： H01P7/00 ,  H03H7/00

    CPC分类号： H03H2/001 ,  H01Q7/00

    摘要： An apparatus for wireless power transmission is disclosed. According to an exemplary aspect, the wireless power transmission apparatus includes a high Q low frequency near magnetic field resonator having characteristics of a metamaterial. Accordingly, manufacturing of a compact power supply capable of wirelessly supplying power to mobile communication terminals or multimedia terminals is possible. By using a zeroth-order resonator with a DNG or ENG structure, a small-sized power supply with a simple configuration may be manufactured.

    摘要翻译： 公开了一种用于无线电力传输的装置。 根据示例性方面，无线电力传输装置包括具有超材料特性的高Q低频近场磁场谐振器。 因此，可以制造能够向移动通信终端或多媒体终端无线供电的小型电源。 通过使用具有DNG或ENG结构的零阶谐振器，可以制造具有简单配置的小尺寸电源。