公开(公告)号：US08704431B2

公开(公告)日：2014-04-22

申请号：US13462454

申请日：2012-05-02

申请人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

发明人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

IPC分类号： H01J61/52

CPC分类号： F21V19/006 ,  G03F7/70016 ,  H01J5/56 ,  H01J61/523 ,  H01J61/822

摘要： A light source apparatus is equipped with a discharge lamp, which has a glass tube that forms a light emitting part and a base member that is coupled thereto, and a mounting apparatus that holds the discharge lamp via the base member. Therein, the base member has a flange part that contacts positioning plate of the mounting apparatus, and a fixed part that is urged with a pressing force that presses the flange part to the positioning plate. Furthermore, the mounting apparatus has a fixing arm that urges the fixed part by a compression coil spring.

摘要翻译： 光源装置配备有放电灯，其具有形成发光部的玻璃管和与其连接的基座部件，以及通过基座部件保持放电灯的安装装置。 其特征在于，所述基座部件具有与所述安装装置的定位板接触的凸缘部以及将所述凸缘部压向所述定位板的按压力而被推压的固定部。 此外，安装装置具有通过压缩螺旋弹簧推压固定部的固定臂。

公开(公告)号：US20120248960A1

公开(公告)日：2012-10-04

申请号：US13462454

申请日：2012-05-02

申请人： Hiroshi SHIRASU ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

发明人： Hiroshi SHIRASU ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

IPC分类号： H01J61/52

CPC分类号： F21V19/006 ,  G03F7/70016 ,  H01J5/56 ,  H01J61/523 ,  H01J61/822

摘要： A light source apparatus is equipped with a discharge lamp, which has a glass tube that forms a light emitting part and a base member that is coupled thereto, and a mounting apparatus that holds the discharge lamp via the base member. Therein, the base member has a flange part that contacts positioning plate of the mounting apparatus, and a fixed part that is urged with a pressing force that presses the flange part to the positioning plate. Furthermore, the mounting apparatus has a fixing arm that urges the fixed part by a compression coil spring.

摘要翻译： 光源装置配备有放电灯，其具有形成发光部的玻璃管和与其连接的基座部件，以及通过基座部件保持放电灯的安装装置。 其特征在于，所述基座部件具有与所述安装装置的定位板接触的凸缘部以及将所述凸缘部压向所述定位板的按压力而被推压的固定部。 此外，安装装置具有通过压缩螺旋弹簧推压固定部的固定臂。

公开(公告)号：US06750951B2

公开(公告)日：2004-06-15

申请号：US09836430

申请日：2001-04-18

申请人： Motoo Koyama ,  Masaki Kato ,  Hidefumi Shibano

发明人： Motoo Koyama ,  Masaki Kato ,  Hidefumi Shibano

IPC分类号： G03B2754

CPC分类号： G03F7/70958 ,  G02B1/10 ,  G02B1/11 ,  G02B27/0025 ,  G03F7/70575

摘要： An optical apparatus having a suppressor that suppresses the wavelength dependence, in a predetermined wavelength band, of a thin film formed on an optical surface of the optical apparatus.

摘要翻译： 一种具有抑制器的光学装置，其抑制在光学装置的光学表面上形成的薄膜在预定波长带中的波长依赖性。

公开(公告)号：US06489624B1

公开(公告)日：2002-12-03

申请号：US09119162

申请日：1998-07-20

申请人： Yoshijiro Ushio ,  Takehiko Ueda ,  Eiji Matsukawa ,  Motoo Koyama

发明人： Yoshijiro Ushio ,  Takehiko Ueda ,  Eiji Matsukawa ,  Motoo Koyama

IPC分类号： G01N2186

CPC分类号： G01B11/0683

摘要： Apparatus and methods are disclosed that measure the thickness of a layer on a workpiece such as a semiconductor wafer, especially as the layer is undergoing a process such as polishing to achieve planarization of the layer. The apparatus comprises a probe light optical system that directs a beam of probe light to be incident on a surface of the layer, and produce a signal light from reflection of the probe light from or transmission of the probe light through the layer. A light detector retrieves and detects sufficient wavelengths of the signal light to produce a corresponding electronic signal encoding data regarding the intensity at various wavelengths of the signal light. At least one of the following is monitored: appearance or disappearance of maxima or minima in a spectrum of intensity or transmittance of the signal light, a change in wavelength at which a maximum or minimum is located in the spectrum, and change in intensity at a particular wavelength at which a maximum or minimum is located in the spectrum. The apparatus can be included with a polishing apparatus.

摘要翻译： 公开了测量诸如半导体晶片的工件上的层的厚度的装置和方法，特别是当该层经历诸如抛光的工艺以实现该层的平坦化时。 该装置包括探针光学系统，其将探测光束引导入入层的表面，并产生来自探测光的反射的信号光或探测光透过该层的透射。 光检测器检索并检测信号光的足够的波长，以产生相应的电子信号，该信号编码关于信号光的各种波长的强度的数据。 监视以下中的至少一个：信号光的强度或透射光谱中的最大值或最小值的出现或消失，最大或最小位于光谱中的波长变化，以及在 最大或最小位于光谱中的特定波长。 该装置可以包括在抛光装置中。

公开(公告)号：US06339219B1

公开(公告)日：2002-01-15

申请号：US09335782

申请日：1999-06-18

申请人： Tohru Ishizuya ,  Motoo Koyama

发明人： Tohru Ishizuya ,  Motoo Koyama

IPC分类号： G02F101

CPC分类号： G01J5/40

摘要： An imaging device is provided for efficient and accurate conversion of invisible infrared radiation into a visible optical image. In an example, the image device employs an improved configuration of a substrate transmissive to infrared radiation, an infrared lens system, an optical readout radiation/displacement conversion unit for converting the infrared radiation into displacements, a readout optical system for directing readout light towards reflectors of the optical readout radiation/displacement conversion unit. The image device also provides for ease in assembly and calibration by adopting an improved arrangement of the parts.

摘要翻译： 提供了一种成像装置，用于将不可见的红外辐射有效且准确地转换成可见光学图像。 在一个示例中，图像装置采用对红外辐射透射的基板的改进配置，红外透镜系统，用于将红外辐射转换成位移的光学读出辐射/位移转换单元，用于将读出光引导到反射器的读出光学系统 的光读出辐射/位移转换单元。 图像装置还通过采用改进的部件布置来提供组装和校准的容易性。

公开(公告)号：US08531093B2

公开(公告)日：2013-09-10

申请号：US11896416

申请日：2007-08-31

申请人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

发明人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

IPC分类号： H01J7/26 ,  H01J1/02 ,  H01J61/52 ,  F21V29/00 ,  H01R13/00

CPC分类号： F21V19/006 ,  G03F7/70016 ,  H01J5/56 ,  H01J61/523 ,  H01J61/822

摘要： A light source apparatus is equipped with a discharge lamp, which has a glass tube that forms a light emitting part and a base member that is coupled thereto, and a mounting apparatus that holds the discharge lamp via the base member. Therein, the base member has a flange part that contacts positioning plate of the mounting apparatus, and a fixed part that is urged with a pressing force that presses the flange part to the positioning plate. Furthermore, the mounting apparatus has a fixing arm that urges the fixed part by a compression coil spring.

摘要翻译： 光源装置配备有放电灯，其具有形成发光部的玻璃管和与其连接的基座部件，以及通过基座部件保持放电灯的安装装置。 其特征在于，所述基座部件具有与所述安装装置的定位板接触的凸缘部以及将所述凸缘部压向所述定位板的按压力而被推压的固定部。 此外，安装装置具有通过压缩螺旋弹簧推压固定部的固定臂。

公开(公告)号：US20080218049A1

公开(公告)日：2008-09-11

申请号：US11896416

申请日：2007-08-31

申请人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

发明人： Hiroshi Shirasu ,  Yasuo Aoki ,  Motoo Koyama ,  Takayuki Kikuchi

IPC分类号： H01J7/26 ,  H01J61/52 ,  H01J9/46

CPC分类号： F21V19/006 ,  G03F7/70016 ,  H01J5/56 ,  H01J61/523 ,  H01J61/822

摘要： A light source apparatus is equipped with a discharge lamp, which has a glass tube that forms a light emitting part and a base member that is coupled thereto, and a mounting apparatus that holds the discharge lamp via the base member. Therein, the base member has a flange part that contacts positioning plate of the mounting apparatus, and a fixed part that is urged with a pressing force that presses the flange part to the positioning plate. Furthermore, the mounting apparatus has a fixing arm that urges the fixed part by a compression coil spring.

摘要翻译： 光源装置配备有放电灯，其具有形成发光部的玻璃管和与其连接的基座部件，以及通过基座部件保持放电灯的安装装置。 其特征在于，所述基座部件具有与所述安装装置的定位板接触的凸缘部以及将所述凸缘部压向所述定位板的按压力而被推压的固定部。 此外，安装装置具有通过压缩螺旋弹簧推压固定部的固定臂。

公开(公告)号：US5949503A

公开(公告)日：1999-09-07

申请号：US668943

申请日：1996-06-24

申请人： Motoo Koyama ,  Hideaki Shimomura

发明人： Motoo Koyama ,  Hideaki Shimomura

IPC分类号： G02F1/1334 ,  G02F1/1335 ,  H04N5/74 ,  G02F1/136

CPC分类号： G02F1/133553 ,  H04N5/7441 ,  G02F1/1334 ,  G02F2201/305 ,  G02F2203/22 ,  G02F2203/34

摘要： Reflective spatial light modulators (RSLMs) and projection apparatus employing such RSLMs are disclosed. The RSLM comprises a reflective surface and a superposed light-modulation layer. The reflective surface is configured to have a reflective diffraction optical element or a microfaceted reflective array. Incident light impinging on the RSLM can pass through the light-modulation layer, reflect from the reflective surface, and return through the light-modulation layer to become modulated signal light capable of forming a viewable image if projected onto a screen or other surface. The reflective diffraction optical element or microfaceted reflective array on the reflective surface is operable to cause the signal light to propagate from the RSLM in a different direction than any ghost light reflected from the RSLM. Projection apparatus employing such an RSLM comprise an illumination optical system, a projection optical system that may or may not be coaxial with the illumination optical system, and a stop operable to pass signal light but not ghost light to a screen for viewing. The viewed image has enhanced contrast over the prior art.

摘要翻译： 公开了使用这种RSLM的反射空间光调制器（RSLM）和投影装置。 RSLM包括反射表面和叠加的光调制层。 反射表面被配置为具有反射衍射光学元件或微量反射阵列。 入射到RSLM上的入射光可以通过光调制层，从反射面反射，并通过光调制层返回成为能够在投影到屏幕或其它表面上时形成可视图像的调制信号光。 反射表面上的反射衍射光学元件或微量反射阵列可操作以使信号光从与RSLM反射的任何重影光不同的方向从RSLM传播。 使用这样的RSLM的投影装置包括照明光学系统，可以与照明光学系统共轴的投影光学系统，以及可操作以将信号光而不是重影光传递到用于观看的屏幕的停止。 所观看的图像与现有技术相比具有增强的对比度。

公开(公告)号：US20080042044A1

公开(公告)日：2008-02-21

申请号：US11628052

申请日：2005-06-06

申请人： Motoo Koyama

发明人： Motoo Koyama

IPC分类号： G01J1/32 ,  G02B27/14

CPC分类号： G03F7/7085 ,  G01J1/04 ,  G01J1/0407 ,  G01J1/0414 ,  G03F7/70558

摘要： A light detecting apparatus which can be arranged even in an optical path of which converting angle is relatively large, and can accurately detect light entering along a predetermined direction in an optical path. The light detecting apparatus (10) for detecting light which enters in a predetermined direction in an optical path has a light splitting element (11) having two optical surfaces (11a, 11b) positioned in the optical path, and a photoelectric detector (12) for photo detecting light which propagates inside the light splitting element and which is guided from a side face (11c) of the light splitting element. The light splitting element further has an incident angle conversion section (13) for converting a part of light which enters one optical face of the light splitting element into light entering the other optical surface at an incident angle greater than or equal to a total reflection angle.

摘要翻译： 光检测装置即使在转换角度相对较大的光路中也能够被布置，并且能够精确地检测在光路中沿预定方向进入的光。 用于检测在光路中沿预定方向进入的光的光检测装置（10）具有分光元件（11），其具有位于光路中的两个光学表面（11a，11b），以及光电检测器 12），用于在分光元件内传播并从分光元件的侧面（11c）引导的光检测光。 光分离元件还具有入射角转换部（13），其将进入分光元件的一个光学面的一部分光转换成入射角大于或等于全反射角的入射光 。

公开(公告)号：US6102775A

公开(公告)日：2000-08-15

申请号：US62636

申请日：1998-04-20

申请人： Yoshijiro Ushio ,  Motoo Koyama

发明人： Yoshijiro Ushio ,  Motoo Koyama

IPC分类号： B24B37/013 ,  B24B49/04 ,  B24B49/12

CPC分类号： B24B49/12 ,  B24B37/013 ,  B24B49/04

摘要： In the polishing apparatus and film inspection method, a polishing apparatus for polishing an object causes a relative movement between a polishing body and the polishing object. A polishing agent is then interposed between the polishing body and the polishing object. The polishing apparatus includes an optical measuring system capable of measuring at least one of a polished surface state of the polishing object or a film thickness of the polishing object and a position detection system capable of detecting relative positions of the optical measuring system and the polishing object. A control system is also included, and is capable of controlling at least one of the optical measuring system or the polishing object in accordance with position detection system signals so that prescribed endpoint detection regions of the polishing object are measured by the optical measuring system. A film thickness inspection method optically detects the film thickness of the outermost layer on a semiconductor substrate on which desired wiring patterns are formed in predetermined chip regions by laminating a plurality of layers. The film thickness inspection method includes selecting regions other than the chip regions on the semiconductor substrate, and the film thickness is optically detected by illuminating these regions with light.

摘要翻译： 在抛光装置和膜检查方法中，用于抛光物体的抛光装置引起研磨体和抛光对象之间的相对移动。 然后将抛光剂插入在抛光体和抛光对象之间。 抛光装置包括能够测量抛光对象的抛光表面状态或抛光对象的膜厚度中的至少一个的光学测量系统以及能够检测光学测量系统和抛光对象的相对位置的位置检测系统 。 还包括控制系统，并且能够根据位置检测系统信号来控制光学测量系统或抛光对象中的至少一个，使得通过光学测量系统测量抛光对象的规定的端点检测区域。 薄膜厚度检查方法通过层叠多层光学地检测在预定的芯片区域中形成了所需布线图案的半导体基板上的最外层的膜厚度。 膜厚检查方法包括选择半导体衬底上的芯片区域以外的区域，通过用光照亮这些区域来光学检测膜厚度。