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公开(公告)号:US11901644B2
公开(公告)日:2024-02-13
申请号:US17314454
申请日:2021-05-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda
CPC classification number: H01Q3/24 , H01Q9/0421 , H01Q9/32
Abstract: A ground plane, at least one composite antenna, and a power feeding line configured to supply power to the at least one composite antenna are provided in or on a substrate. The composite antenna includes a power feeding element configuring a patch antenna together with the ground plane, and at least one linear antenna configured to flow an electric current having a component in a vertical direction with respect to the ground plane. The power feeding line includes a main line connected to the power feeding element, and a branch line branched from the main line and connected to the linear antenna.
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公开(公告)号:US11362412B2
公开(公告)日:2022-06-14
申请号:US16816958
申请日:2020-03-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda , Shinya Mizoguchi , Tsubasa Nishida , Shinichiro Banba , Osamu Yamaguchi , Akihiro Muranaka , Koji Yasojima
Abstract: A radiation conductor is constructed of a metal plate having a pair of main surfaces pointing in opposite directions. Each main surface of the pair of main surfaces includes a first surface region that includes at least part of a peripheral edge portion of the main surface. At least one main surface of the pair of main surfaces includes a second surface region that is a region other than the first surface region. A dielectric member holds the radiation conductor in such a manner that the first surface region of each main surface of the pair of main surfaces is sandwiched between portions of the dielectric member in a thickness direction of the radiation conductor. The second surface region of the at least one main surface is exposed.
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公开(公告)号:US10476149B1
公开(公告)日:2019-11-12
申请号:US16118623
申请日:2018-08-31
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda
Abstract: A plurality of fed elements arranged in a first direction is provided within the plane of a substrate. A plurality of non-fed elements is provided to sandwich at least one of the plurality of fed elements. The plurality of non-fed elements are loaded to the plurality of fed elements. At least one of the plurality of non-fed elements is provided between two of the plurality of fed elements arranged in the first direction. The at least one of the plurality non-fed elements is shared by the two of the plurality of non-fed elements that are adjacent to each other in the first direction. This configuration provides an array antenna that is suited for miniaturization and capable of achieving increased beam scanning angle.
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公开(公告)号:US20190089071A1
公开(公告)日:2019-03-21
申请号:US16161722
申请日:2018-10-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kaoru Sudo , Hideki Ueda
CPC classification number: H01Q21/245 , H01Q1/38 , H01Q3/34 , H01Q3/38 , H01Q13/08 , H01Q19/062 , H01Q21/065 , H01Q21/067 , H01Q21/24 , H01Q25/00
Abstract: First and second end-fire antennas are arranged on a dielectric substrate. The first end-fire antenna has polarization characteristics being parallel with a first direction. The second end-fire antenna has polarization characteristics being parallel with a second direction orthogonal to the first direction. A patch antenna provided with a first feed point and a second feed point, which are different from each other, is arranged on the dielectric substrate. When the patch antenna is fed from the first feed point, a radio wave whose polarization direction is parallel with the first direction is excited. When the patch antenna is fed from the second feed point, a radio wave whose polarization direction is orthogonal to the first direction is excited. A wireless communication module capable of achieving directivity in a wide range from a direction parallel with the substrate to the direction of the normal to the substrate is provided.
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公开(公告)号:US12244072B2
公开(公告)日:2025-03-04
申请号:US17672696
申请日:2022-02-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda , Yasuhisa Yamamoto , Masashi Omuro , Kazunari Kawahata , Satoshi Tanaka , Ryuken Mizunuma
Abstract: An antenna device comprises a substrate including a planar first region and a planar second region; at least one first radiating element, arranged in the first region, that communicates a radio wave of a first frequency; and at least one second radiating element, arranged in the second region, that communicates a radio wave of a second frequency. A separation direction is a direction of a straight line connecting a first geometric center position of the at least one first radiating element and a second geometric center position of the at least one second radiating element, and in a case that the second region is viewed along a normal direction of the second region, an angle formed by the separation direction and a polarization direction of the at least one second radiating element is equal to or greater than 45° and equal to or less than 90°.
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公开(公告)号:US11756902B2
公开(公告)日:2023-09-12
申请号:US16589336
申请日:2019-10-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda
CPC classification number: H01L23/66 , H01Q1/48 , H01Q1/526 , H01Q5/378 , H01Q13/08 , H01Q13/10 , H01Q23/00 , H01L2223/6677
Abstract: A ground plane is disposed in a dielectric substrate or on the top surface of the dielectric substrate. A high-frequency semiconductor device is mounted on the bottom surface of the dielectric substrate. A shield structure that is provided in a space closer to the bottom surface than the ground plane is surrounds the high-frequency semiconductor device from below and sideways of the high-frequency semiconductor device and is connected to the ground plane. An opening is formed in the shield structure. A radiation-structure portion causes a high-frequency signal output by the high-frequency semiconductor device to be radiated through the opening.
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公开(公告)号:US11611361B2
公开(公告)日:2023-03-21
申请号:US17032345
申请日:2020-09-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Kazunari Kawahata , Ryuken Mizunuma , Hideki Ueda , Satoshi Tanaka , Masashi Omuro , Yasuhisa Yamamoto
Abstract: A feed line connects an RFIC and a radiating element. A baseband ground plane (BB ground) is connected to a ground terminal of a BBIC. A radio frequency ground plane (RF ground) is placed in such a manner as to overlap the BB ground. The RF ground serves as a return path of the feed line. A first inter-ground connection circuit connects the BB ground and the RF ground. Furthermore, a second inter-ground connection circuit connects the BB ground and the RF ground. Connecting parts between these grounds and the second inter-ground connection circuit are arranged closer to the edges of these grounds than connecting parts between these grounds and the first inter-ground connection circuit. The connecting part between the ground and the second inter-ground connection circuit is placed on one side of a certain imaginary straight line that passes substantially the geometric center of the ground.
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公开(公告)号:US11211718B2
公开(公告)日:2021-12-28
申请号:US16898799
申请日:2020-06-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda
Abstract: An array antenna includes a plurality of first patch antennas configured to radiate a polarized wave in an X direction at a first operating frequency and configured to radiate a polarized wave in a Y direction at a second operating frequency higher than the first operating frequency, and a plurality of second patch antennas configured to radiate a polarized wave in the Y direction at the first operating frequency and configured to radiate a polarized wave in the X direction at the second operating frequency. When a distance between any one of the first patch antennas and another one of the first patch antennas closest to the any one first patch antenna is defined as D1, and a distance between any one of the first patch antennas and the second patch antenna closest to the any one first patch antenna is defined as D2, D1>D2 is satisfied.
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公开(公告)号:US10008783B2
公开(公告)日:2018-06-26
申请号:US15171354
申请日:2016-06-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda
CPC classification number: H01Q21/065 , H01Q1/38 , H01Q1/48 , H01Q5/378 , H01Q9/0407 , H01Q9/0414 , H01Q9/0421 , H01Q9/0442 , H01Q19/10
Abstract: A surface-layer conductive plate having an opening is disposed on a first surface of a dielectric substrate. A radiation electrode is disposed inside the opening on the first surface of the dielectric substrate. A ground conductive plate is disposed on a second surface of the dielectric substrate, the second surface being opposite to the first surface. Interlayer connection members are disposed so as to surround the opening as seen in a plan view. The interlayer connection members electrically connects the surface-layer conductive plate to the ground conductive plate and defines a cavity that causes electromagnetic resonance to occur. A reactance element is configured to cause an impedance that a side face of the cavity exhibits with respect to an electromagnetic wave propagating in the cavity to include a reactance component.
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公开(公告)号:US11942685B2
公开(公告)日:2024-03-26
申请号:US17673798
申请日:2022-02-17
Applicant: Murata Manufacturing Co., Ltd.
Inventor: Hideki Ueda , Yasuhisa Yamamoto , Masashi Omuro , Kazunari Kawahata , Satoshi Tanaka , Ryuken Mizunuma
Abstract: A first antenna, a second antenna, and a waveguide structure are housed in a single cabinet. An operating frequency of the second antenna is higher than an operating frequency of the first antenna. The second antenna is an array antenna including a plurality of radiating elements. The waveguide structure is present outside a range of a half-value angle of a main beam as viewed from the first antenna, includes a unit waveguide disposed in a route of a radio wave received by the second antenna, and further attenuates a radio wave with the operating frequency of the first antenna.
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