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    MAGNETIC FIELD PROBE
    2.
    发明申请
    MAGNETIC FIELD PROBE 有权
    磁场探测器

    公开(公告)号：US20150022195A1

    公开(公告)日：2015-01-22

    申请号：US14498783

    申请日：2014-09-26

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Noriko SHIMIZU ,  Takashi ICHIMURA ,  Takahiro AZUMA

    IPC: G01R33/02

    CPC classification number: G01R33/0206 ,  G01R29/0878 ,  G01R33/0023 ,  G01R33/0047

    Abstract: A detector of a magnetic field probe includes a first wiring pattern formed on a first surface of a multilayer substrate and having a predetermined inclination with respect to an axial line direction of the magnetic field probe, a second wiring pattern formed on a second surface and having the predetermined inclination with respect to the axial line direction, and a first penetrating via penetrating through the multilayer substrate in the thickness direction and connecting a front end portion of the first wiring pattern and a front end portion of the second wiring pattern. A rear end portion of the first wiring pattern is connected to a conductor pattern configuring a strip line and a rear end portion of the second wiring pattern is connected to ground patterns configuring the strip line.

    Abstract translation: 磁场探测器的检测器包括形成在多层基板的第一表面上并且相对于磁场探针的轴线方向具有预定倾斜度的第一布线图案，形成在第二表面上并具有 相对于轴线方向的预定倾斜度，以及在厚度方向上穿过多层基板的第一穿透通孔，并且连接第一布线图案的前端部分和第二布线图案的前端部分。 第一布线图案的后端部与构成带状线的导体图案连接，第二布线图案的后端部与构成带状线的接地图形连接。

    COIL COMPONENT
    3.
    发明申请
    COIL COMPONENT 审中-公开

    公开(公告)号：US20190180909A1

    公开(公告)日：2019-06-13

    申请号：US16180943

    申请日：2018-11-05

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Gota SHINOHARA ,  Noriko SHIMIZU ,  Keiichi ISHIDA ,  Hironobu KUBOTA ,  Mari YONEMURA ,  Takao KAWACHI

    IPC: H01F27/22 ,  H01F27/28 ,  H01F27/29 ,  H01F27/32

    Abstract: A coil component including an element assembly and a coil conductor embedded in the element assembly. The element assembly includes a first magnetic layer and a second magnetic layer that constitute a first principal surface and a second principal surface, respectively, where the first principal surface and the second principal surface are opposite to each other in the element assembly. The first magnetic layer has a higher relative magnetic permeability than the second magnetic layer. At least part of a winding portion of the coil conductor is located in the first magnetic layer. The first magnetic layer contains metal magnetic particles and a resin, and the second magnetic layer contains metal magnetic particles, a resin, and zinc oxide particles. The metal magnetic particles and the zinc oxide particles are dispersed in the resin.

    INDUCTOR MANUFACTURING METHOD
    9.
    发明申请
    INDUCTOR MANUFACTURING METHOD 有权
    电感器制造方法

    公开(公告)号：US20150235765A1

    公开(公告)日：2015-08-20

    申请号：US14613784

    申请日：2015-02-04

    Applicant: MURATA MANUFACTURING CO., LTD.

    Inventor： Hironori SUZUKI ,  Yasushi TAKEDA ,  Noriko SHIMIZU ,  Yoichi NAKATSUJI ,  Gota SHINOHARA ,  Junji KUROBE ,  Kuniaki YOSUI

    IPC: H01F41/32 ,  B32B38/04 ,  B32B38/10 ,  B32B37/18 ,  B32B37/10

    CPC classification number: H01F41/046 ,  B32B37/02 ,  B32B2307/202 ,  B32B2457/00 ,  C09K13/00 ,  H01F17/0013 ,  H01F2017/048

    Abstract: An inductor manufacturing method includes a first step of press bonding a Cu foil onto a non-magnetic resin sheet, a second step of forming a conductor pattern by performing etching on the Cu foil, a third step of press bonding another non-magnetic resin sheet onto the conductor pattern, and a via conductor formation step of forming a via conductor that penetrates through the other resin sheet and leads to the conductor pattern. The method further includes a step of forming a body in which resin having magnetism is provided outside of a coil, by press bonding magnetic-powder-containing resin sheets onto a multilayer body, obtained by a manufacturing method including the first to third steps and the via conductor formation step, and then thermally curing the magnetic-powder-containing resin sheets.

    Abstract translation: 电感器制造方法包括：将Cu箔压接在非磁性树脂片上的第一工序，对Cu箔进行蚀刻而形成导体图案的第二工序，将另一非磁性树脂片 以及通孔导体形成步骤，形成穿过另一树脂片并通向导体图案的通孔导体。 该方法还包括：通过将包含第一至第三步骤的制造方法获得的将含有磁粉的树脂压在含有含磁粉的树脂片材的多层体上，形成具有磁性的树脂的主体的步骤， 通过导体形成步骤，然后热固化含磁粉的树脂片。

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