公开(公告)号：US11373793B2

公开(公告)日：2022-06-28

申请号：US16212720

申请日：2018-12-07

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo Ito ,  Naoki Gouchi ,  Hirotaka Fujii ,  Kazutaka Muraoka

IPC: H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12 ,  H05K1/16 ,  H01F27/29

Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.

公开(公告)号：US11923123B2

公开(公告)日：2024-03-05

申请号：US16166225

申请日：2018-10-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazutaka Muraoka ,  Kuniaki Yosui ,  Yuki Ito ,  Naoki Gouchi

IPC: H01F27/28 ,  H01F17/00 ,  H01F41/04 ,  H05K1/16 ,  H05K3/18 ,  H05K3/46 ,  H01F27/29 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/24 ,  H05K3/40

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F41/041 ,  H01F41/043 ,  H05K1/165 ,  H05K3/188 ,  H05K3/4644 ,  H05K3/4661 ,  H01F2027/2809 ,  H01F27/29 ,  H01F27/292 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/115 ,  H05K3/0032 ,  H05K3/241 ,  H05K3/4038 ,  H05K2201/0154 ,  H05K2203/0723 ,  H05K2203/107

Abstract: A multilayer substrate includes first and second insulating layers stacked in a stacking direction with the second insulating layer located at a first side of the first insulating layer in the stacking direction, a first coil pattern disposed on a first principal surface of the first insulating layer on the first side of the first insulating layer in the stacking direction, and a second coil pattern disposed on a first principal surface of the second insulating layer on the first side of the second insulating layer in the stacking direction. The first and second coil patterns have spiral shapes. When viewed from the layer stacking direction, at least a portion of a first area in which the first coil pattern is disposed and at least a portion of a second area in which the second coil pattern is disposed overlap each other.

公开(公告)号：US11636972B2

公开(公告)日：2023-04-25

申请号：US17751794

申请日：2022-05-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shingo Ito ,  Naoki Gouchi ,  Hirotaka Fujii ,  Kazutaka Muraoka

IPC: H01F27/28 ,  H01F17/00 ,  H01F27/32 ,  H01F41/04 ,  H01F41/12 ,  H05K1/16 ,  H01F27/29

Abstract: A multilayer substrate includes a stacked body of insulating base material layers and conductor patterns on the insulating base material layers. A thickness adjustment base material layer includes a frame portion, an opening portion inside the frame portion, and an island shaped portion inside the frame portion, and connection portions to connect the island shaped portion to the frame portion. The conductor patterns, in a stacking direction of the insulating base material layers, are wound around the island shaped portion. A line width of the connection portions is smaller than the width of the island shaped portion connected to the frame portion through the connection portions. An area overlapped with the conductor patterns is larger in the opening portion than in the frame portion and the island shaped portion.