Abstract:
A conductive paste for forming terminal electrodes of a monolithic ceramic electronic component having nickel internal electrodes is provided. The conductive paste includes at least one of a silver powder and a silver alloy powder, a boron powder, an inorganic binder and an organic vehicle. The amount of the boron powder is at least about 0.5 percent by weight and less than about 7.0 percent by weight of the total weight of the conductive paste.
Abstract:
A conductive paste containing no Pb and able to suppress heat generation in a sintered ceramic body, and a medium and high voltage ceramic capacitor with thick film electrodes formed thereof, are provided. The conductive paste containing substantially no Pb is composed of an Ag powder, a glass powder having on a % by mole basis, 30
Abstract:
A conductive paste containing no Pb and able to suppress heat generation in a sintered ceramic body, and a medium and high voltage ceramic capacitor with thick film electrodes formed thereof, are provided. The conductive paste containing substantially no Pb is composed of an Ag powder, a glass powder having on a % by mole basis, 30
Abstract:
Provided is a Ag-based conductive paste for a terminal electrode which suppresses oxidation of the Ni surface of an internal conductor and therefore brings about excellent joining with Ni even when baking is performed in the atmosphere in the case where Ni is used as the internal conductor of a laminated ceramic electronic component. The conductive paste includes at least one of an Ag powder and an Ag alloy powder, a nickel boride powder, an inorganic binder and an organic vehicle, wherein the quantity of the nickel boride powder is within the range of about 5% by weight or more, but less than about 60% by weight of the total paste.