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Patent Agency Ranking
公开(公告)号：US09385682B2
公开(公告)日：2016-07-05
申请号：US14309918
申请日：2014-06-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunihiro Watanabe
CPC classification number: H03H7/0115 , H01F17/0013 , H01F2017/0026 , H03H7/0161 , H03H7/09 , H03H7/1758 , H03H7/1766 , H03H7/1775 , H03H2001/0085
Abstract: A high frequency component includes a multilayer body including a plurality of insulating layers stacked in a stacking direction, linear conductors extending along the insulating layers, interlayer connection conductors extending through at least one of the insulating layers, and planar conductors extending along the insulating layers. The high frequency component further includes transverse coils and internal capacitors. Each of the transverse coils includes the linear conductors and the interlayer connection conductors spirally wound in a plane in a plurality of turns around a winding axis extending in a direction perpendicular or substantially perpendicular to the stacking direction. Each of the internal capacitors includes the planar conductors being opposed to each other such that at least one of the insulating layers is disposed therebetween, the internal capacitor being arranged within a coil opening of the transverse coil when viewed along the winding axis of the transverse coil.
Abstract translation: 高频分量包括多层体，其包括层叠方向上堆叠的多个绝缘层，沿着绝缘层延伸的线状导体，贯穿至少一个绝缘层的层间连接导体，以及沿绝缘层延伸的平面导体。 高频分量还包括横向线圈和内部电容器。 每个横向线圈包括线性导体和层间连接导体，绕着围绕垂直于或基本上垂直于堆叠方向的方向延伸的绕组轴线以多匝螺旋形地卷绕在平面中。 每个内部电容器包括彼此相对的平面导体，使得绝缘层中的至少一个设置在它们之间，当沿着横向线圈的卷绕轴线观察时，内部电容器布置在横向线圈的线圈开口内 。
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公开(公告)号：US11349521B2
公开(公告)日：2022-05-31
申请号：US17235309
申请日：2021-04-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji Tahara , Seikoh Ono , Kunihiro Watanabe , Hiroshi Masuda , Naohide Tomita , Takeshi Kogure , Yusuke Tanaka
IPC: H04B1/44
Abstract: A radio-frequency signal transmitting and receiving circuit includes a power amplifier, a transmission band pass filter configured to transmit a radio-frequency input signal, a first reception band pass filter configured to transmit a first radio-frequency reception signal, a first low-noise amplifier configured to amplify the first radio-frequency reception signal and output a first radio-frequency output signal, a first transmitting and receiving filter having a first end and a second end, the first end being electrically connected to a first antenna terminal, and a switch configured to electrically connect the transmission band pass filter to the second end of the first transmitting and receiving filter to output the radio-frequency input signal to the first antenna terminal and electrically connect the second end of the first transmitting and receiving filter to the first reception band pass filter to receive the first radio-frequency reception signal from the first antenna terminal.
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公开(公告)号：US09882541B2
公开(公告)日：2018-01-30
申请号：US15008769
申请日：2016-01-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunihiro Watanabe
CPC classification number: H03H7/0115 , H03H7/09 , H03H7/1758 , H03H7/1766 , H03H7/1775 , H03H2001/0085
Abstract: An electronic component includes first through n-th inductors that turn around as viewed from a first direction perpendicular or substantially perpendicular to a stacking direction of a multilayer body of the electronic component. An (n+1)-th inductor includes a linear (n+1)-th inductor conductive layer which is provided in a configuration in which it turns around, as viewed from the stacking direction, and which is located within a region surrounded by the first inductor, as viewed from the first direction. An (n+1)-th capacitor is electrically connected to a first outer electrode, and includes an (n+1)-th capacitor conductive layer which opposes a first inductor conductive layer defining the first inductor with an insulating layer of a plurality of insulating layers of the multilayer body interposed therebetween.
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公开(公告)号：US12040767B2
公开(公告)日：2024-07-16
申请号：US17665627
申请日：2022-02-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroshi Masuda , Kunihiro Watanabe , Rumiko Yuasa
CPC classification number: H03H7/0115 , H01F27/2804 , H01F27/40 , H01G4/30 , H01G4/40 , H05K1/115 , H01F2027/2809 , H03H2001/0085
Abstract: A multilayer substrate includes a via electrode defining and functioning as an end portion on ground terminals side of a first inductor connected to a shield electrode, the end portion on a signal line side is adjacent to or in a vicinity of a first principal surface than the end portion on the ground terminals side is in the lamination direction of base material layers, a via electrode defining and functioning as the end portion on the ground terminals side of a second inductor is connected to the shield electrode, and the end portion on the signal line side is adjacent to or in a vicinity of the first principal surface than the end portion on the ground terminals side is in the lamination direction of the base material layers.
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公开(公告)号：US10110192B2
公开(公告)日：2018-10-23
申请号：US14955138
申请日：2015-12-01
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kunihiro Watanabe
Abstract: An electronic component includes a multilayer body and a first resonator. The multilayer body includes insulating layers stacked on each other in a stacking direction. The first resonator includes a first inductor and a first capacitor disposed in the multilayer body. The first inductor is defined by a conductive layer disposed on an insulating layer of the plurality of insulating layers and an interlayer connecting conductor which passes through an insulating layer of the plurality of insulating layers in the stacking direction connected to each other so that the first inductor preferably has a helical or substantially helical shape as viewed from a first direction perpendicular or substantially perpendicular to the stacking direction. A certain portion of the first inductor is located on a predetermined plane perpendicular or substantially perpendicular to the first direction, and a remaining portion of the first inductor is displaced from the predetermined plane in the first direction.
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